JP6390040B2 - Adhesive sheet sticking member, sticking device, and sticking method - Google Patents

Description

  The present invention relates to a pressure-sensitive adhesive sheet sticking member, a sticking device, and a sticking method for sticking a pressure-sensitive adhesive sheet such as a protective tape to a member to be stuck such as a semiconductor wafer.

  As such an adhesive sheet sticking device, for example, Patent Document 1 discloses a table that supports a plate-like member (a member to be stuck) such as a semiconductor wafer and a pressing force applied to a sheet arranged along the plate-like member. And a deformable pressing member (sticking member) that imparts the sheet, and by deforming the pressing member so as to be close to the sheet, the sheet is plated by the adhesive layer (adhesive surface) on the plate-like member side of the sheet. What is affixed to a shaped member is described.

  Here, in the sticking device described in Patent Document 1, the first space in the case for housing the table and the first space are formed on the opposite side across the pressing member. The space is depressurized or substantially vacuumed, and then the second space is released from the depressurized or substantially vacuumed state, so that the pressure member is deformed so as to be close to the sheet by the pressure difference and is pressed against the plate-like member. Is affixed to the plate member.

  Moreover, the pressing member of the sticking device described in Patent Document 1 is formed of an elastically deformable material such as rubber, and the pressing surface pressed against the plate-like member has a conical shape protruding toward the plate-like member. Is formed. When the pressing surface presses the plate-like member, the pressing surface attaches the sheet from the central portion toward the outer peripheral side to the surface of the plate-like member to which the sheet is attached, and finally the plate-like member It is deformed so as to be substantially parallel to the member.

JP 2008-066597 A

  By the way, in particular, in the above-described semiconductor wafers, those having hemispherical electrodes (bumps) formed on the surface to which the sheet is attached have recently been used frequently, and projections such as these electrodes have been used. If it is formed on the pasting surface, a gap is easily generated between the pasted sheet and the pasting surface, and the adhesiveness to the sheet is partially impaired. In the case of a semiconductor wafer, if the adhesiveness to the sheet is impaired in this way, for example, when the semiconductor chip is cut out from the semiconductor wafer to which the sheet is attached in the dicing process, the semiconductor chip is scattered or the back surface of the semiconductor wafer There is a possibility that the cooling water supplied during grinding may enter the gap. In addition, in this specification, a space | gap means the non-adhesion location (gap) which generate | occur | produces between an adhesive sheet and a to-be-bonded member, when an adhesive sheet is stuck to a to-be-bonded member. And when the inventors of the present invention repeated various studies, it was found that such a phenomenon that a gap is formed between the pressure-sensitive adhesive sheet and the member to be bonded is likely to occur at the center of the surface to be bonded. It was.

  The present invention has been made under such a background, and even if a protrusion is formed on a surface to be bonded of a member to be bonded, the pressure-sensitive adhesive capable of suppressing the generation of a gap between the pressure-sensitive adhesive sheet. It aims at providing the sticking member of a sheet | seat, the sticking apparatus, and the sticking method.

In order to solve the above-mentioned problems and achieve such an object, the adhesive member of the pressure-sensitive adhesive sheet of the present invention is formed into a plate shape with an elastic material, and an adhesive surface is formed on one surface. A pressed surface is formed on the other surface, and the pressure-sensitive adhesive sheet disposed between the pasting surface and the member to be pasted is expanded by receiving pressure from the pressed surface side and expanding to the pasting member side. A sticking member for an adhesive sheet to be stuck to a sticking member, wherein the sticking surface is flat, and the pressed surface gradually protrudes from an outer peripheral portion toward the sticking surface and a central portion of the pressed surface. The part located in the back side of the center part of the said sticking surface is formed in the convex shape which protruded.

Further, the adhesive sheet sticking device of the present invention includes a sticking member that is formed into a plate shape by an elastic material, a sticking surface is formed on one surface, and a pressed surface is formed on the other surface. A pasting portion in which the member to be pasted is disposed so as to face the pasting surface of the pasting member with a gap, and a pressure is applied to the pressed surface side of the pasting member to attach the pasting member to the pasting member A pressure means for pressing the sticking surface against the member to be stuck by expanding the sticking surface to the side, and an adhesive disposed between the sticking surface and the member to be stuck with the sticking surface facing the member to be stuck A pressure-sensitive adhesive sheet sticking device for sticking a sheet to a member to be stuck, wherein the sticking surface of the sticking member is flat, and the pressed surface is from the outer periphery to the sticking surface and the center of the pressed surface. gradually protrudes toward the part A portion located on the back side of the central portion of the serial application surface is characterized in that it is formed in a convex shape that protrudes.

Further, the pressure-sensitive adhesive sheet sticking method of the present invention is formed into a plate shape by an elastic material, and a flat sticking surface is formed on one surface, and the other surface has a central portion of the sticking surface from the outer peripheral portion. And holding a sticking member formed with a convex pressed surface in which a portion located on the back side of the central portion of the sticking surface protrudes toward the sticking surface, and is spaced from the sticking surface of the sticking member The adhesive member is disposed so as to face each other, the adhesive sheet is disposed between the adhesive surface and the adhesive member so that the adhesive surface faces the adhesive member, and the pressed surface of the adhesive member The pressure-sensitive adhesive sheet is applied by pressing the application surface against the member to be bonded by applying pressure to the side to expand the member to be bonded.

  In such a pressure-sensitive adhesive sheet sticking member, and a pressure-sensitive adhesive sheet sticking apparatus and sticking method using the sticking member, the sticking surface of the sticking member is flat, while the pressed surface is located behind the central portion of the sticking surface. Since the portion is formed in a protruding shape, the thickness of the sticking member is thicker at the center of the sticking surface than the outer peripheral portion, and the rigidity of the sticking member is also higher at the central portion of the sticking surface than the outer peripheral portion. And such a sticking member is pressed from the center part of the sticking surface to the sticking member by being pressurized from the pressed surface side and expanding so that the sticking surface becomes a spherical shape, and is disposed between An adhesive sheet is affixed to a member to be adhered. In this specification, the term “expansion” means that an elastic sticking member receives pressure by a fluid, so that an opening portion of a frame, which will be described later, and a portion located in the periphery thereof are elastically deformed and stretched, and are pushed out to the sticking member side. It means to swell like a balloon.

  Therefore, according to the adhesive sheet sticking member, the sticking device, and the sticking method having the above-described configuration, the adhesive sheet is pressed from the central portion of the highly rigid sticking member as described above to the central portion of the sticking surface of the sticking member. Since sticking is started, the pressure-sensitive adhesive sheet can be strongly pressed particularly at the center of the surface to be stuck, and it is possible to suppress the formation of a gap between the pressure-sensitive adhesive sheet and the center. Further, since the sticking surface is flat, the pressure-sensitive adhesive sheet does not deform with respect to the case where it is formed in a conical shape like the pressing surface of the sticking member described in Patent Document 1, for example. It is possible to reliably suppress the generation of a gap between the sticking member and the sticking member.

  In addition, when the sticking surface where the sticking member expands is circular, the protruding height of the central portion of the pressed surface with respect to the diameter D (mm) (the thickness of the sticking member between the central portion and the outer peripheral portion of the pressed surface) The difference P / D of P (mm) is preferably 0.003 or more, more preferably 0.005 or more, more preferably 0.010 or more, as described in the examples described later, 0.015 The above is particularly preferable. However, if this ratio P / D is too large, smooth expansion of the sticking member may be hindered. Therefore, the ratio P / D is preferably 0.320 or less, more preferably 0.125 or less, and 0 0.080 or less is particularly preferable.

  As described above, according to the present invention, it is possible to suppress a gap from being formed between the adhesive sheet and the adhesive sheet, particularly in the central portion of the adherend member. For example, the adherend member is a semiconductor wafer. In some cases, even if protrusions are formed on the surface to be pasted, the semiconductor chip cut out in the dicing process is prevented from scattering due to non-adhesion, and cooling water entering the back surface of the semiconductor wafer is prevented from entering the gap. Can do.

It is sectional drawing which shows one Embodiment of the sticking member of the adhesive sheet of this invention. In one Embodiment of the adhesive sheet sticking apparatus of this invention using the sticking member of embodiment shown in FIG. 1, it is the schematic which shows the state which the sticking member has not expanded. In the embodiment shown in FIG. 2, it is the schematic which shows the state which the sticking member expanded and started to be pressed on the to-be-sticked member (however, the convex shape of the to-be-pressed surface is abbreviate | omitting illustration).

  FIG. 1 shows an embodiment of an adhesive sheet sticking member of the present invention, and FIGS. 2 and 3 show an embodiment of an adhesive sheet sticking device of the present invention using the sticking member. . In the sticking device of the present embodiment, a box-shaped upper case 1 having an opening at the bottom and a box-shaped lower case 2 having an opening at the top are provided so as to be opposed to each other in the vertical direction. When the upper and lower cases 1 and 2 are close to each other and the upper and lower parts that are opened are in close contact with each other, a closed space sealed inside is formed. The closed spaces in the upper and lower cases 1 and 2 are connected to a decompression device such as a vacuum pump (not shown), and can be decompressed to a decompressed state or a substantially vacuum state.

  On the lower surface of the top plate portion 1A of the upper case 1, as a sticking member in the present embodiment, a diaphragm 3 formed in a plate shape by an elastic material such as rubber is formed into a ring having a circular opening 4A. It is held by a plate-like frame 4. Then, a pasting surface 3A is formed on one surface (lower surface in FIGS. 1 to 3) of this diaphragm 3, and a pressed surface 3B is formed on the other surface (upper surface in FIGS. 1 to 3). While being flat, the pressed surface 3B is formed in a convex shape in which a portion located on the back side of the central portion of the pasting surface 3A protrudes.

  The diaphragm 3 is substantially disc-shaped, and is concentric with a circle formed by the opening 4A of the frame 4 and is fixed so that a peripheral edge is sandwiched between the frame 4 and the top plate 1A. One surface of the diaphragm 3 is a flat surface, and a circular portion located in the opening 4A is a pasting surface 3A. In addition, a portion of the other surface on the back side of the pasting surface 3A is a pressed surface 3B, and in this embodiment, the pressed surface 3B has a flat conical surface concentric with a circle formed by the pasting surface 3A and has an outer periphery. It forms so that it may protrude gradually as it goes to the center part of 3 A of sticking surfaces and the to-be-pressed surface 3B from a part.

  The sticking member is not particularly limited as long as it is an elastic body that can be expanded and contracted by a fluid, but natural rubber and synthetic rubber are preferable, and isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, acrylic rubber, and the like. Synthetic rubbers such as urethane rubber and silicone rubber are particularly preferred. In addition, the outer shape is not particularly limited as long as the shape of the sticking member is a plate shape. If the size includes the opening 4A of the frame 4, a circular shape, an elliptical shape, a triangular shape, a rectangular shape, a polygonal shape, an indefinite shape, or the like. The opening 4A of the frame 4 is not limited to a circular shape as long as the opening 4A of the frame 4 is similarly included in the sticking member.

  Further, the thickness of the sticking member (thickness between the protruding central portion of the pressed surface 3B and the sticking surface 3A) is not particularly limited as long as it can be expanded and contracted by a fluid, but is preferably 1 mm or more and 20 mm or less, preferably 2 mm. More preferably, it is 10 mm or less. The sticking member needs to return to its original size after being stretched and deformed, and durability over time is required, but if the thickness is less than 1 mm, the durability may be inferior. In addition, if the thickness exceeds 20 mm, the plate becomes hard and may not extend to a desired size by the fluid.

  Here, the protrusion height of the center portion of the pressed surface 3B with respect to the diameter D (mm) of the circular pasting surface 3A (the difference in thickness of the diaphragm 3 between the central portion and the outer peripheral portion of the pressed surface 3B) ) The ratio P / D of P (mm) is preferably 0.003 or more, more preferably 0.005 or more, more preferably 0.010 or more, and particularly preferably 0.015 or more. When the opening 4A of the frame 4 is not circular, the diameter D may be the diameter D of a circle inscribed in the opening 4A, that is, the diameter D of the largest circle included in the opening 4A. Moreover, in the said peripheral part of the diaphragm 3 pinched | interposed between the flame | frame 4 and the top-plate part 1A, as shown in FIG. 1, the other surface is made into the flat surface parallel to one surface, and thickness is constant. The other surface may be a conical surface connected to the pressed surface 3B.

  A portion between the pressed surface 3B of the diaphragm 3 thus held and the top plate portion 1A is airtight with respect to the closed space in the upper and lower cases 1 and 2 as shown in FIG. It communicates with the pipe 5 as a part of the pressurizing means in this embodiment connected to the part 1A. The pipe 5 is connected to a pressure reducing device such as a vacuum pump as a pressurizing means (not shown) via a flow rate adjusting valve 5A, and the flow rate adjusting valve 5A is connected to a computer or the like as a control means 5B. The flow rate of the pressurized fluid supplied through 5 can be controlled.

  Furthermore, in this embodiment, the adhesive sheet 6 is attached to the pasting surface 3 </ b> A of the diaphragm 3 and disposed between the pasting member described below. The pressure-sensitive adhesive sheet 6 is preliminarily cut into a circular shape having a smaller diameter than the opening 4A, and in this embodiment, the pressure-sensitive adhesive sheet 6 is disposed by being adsorbed to the pasting surface 3A by static electricity. The lower surface in FIG. 2 opposite to the sticking surface 3A of the adhesive sheet 6 arranged in this manner is an adhesive surface 6A to which an adhesive is applied.

  On the other hand, a table 7 as a pasting portion is installed on the upper surface of the bottom of the lower case 2 directly below the diaphragm 3, and the semiconductor wafer 8 as a member to be pasted in this embodiment is placed on the table 7 on the table 7. It arrange | positions so that it may oppose 3 A of sticking surfaces at intervals. The semiconductor wafer 8 is also disk-shaped, and is disposed concentrically with the circular pasting surface 3A and the opening 4A of the frame 4, and the outer diameter thereof is substantially the same as that of the adhesive sheet 6.

  In the sticking method of the pressure-sensitive adhesive sheet 6 according to one embodiment of the present invention in which the pressure-sensitive adhesive sheet 6 is stuck to the semiconductor wafer 8 (a member to be stuck) by the sticking device of this embodiment configured as described above, first, the upper and lower cases 1 The semiconductor wafer 8 is disposed on the table 7 in a state in which the closed space is opened while being spaced apart, and the adhesive sheet 6 is adsorbed and disposed on the attaching surface 3A of the diaphragm 3. Next, the upper and lower cases 1 and 2 are brought close to each other so that the upper and lower portions are in close contact with each other, thereby forming a closed space sealed inside as shown in FIG.

  Thereafter, the space between the closed space and the pressed surface 3B of the diaphragm 3 and the top plate portion 1A of the upper case 1 is reduced by the pressure reducing device connected to the closed space and the pressure reducing device connected to the pipe 5, respectively. The pressure is gradually reduced to a reduced pressure state or a substantially vacuum state with the same pressure. And when it becomes a predetermined pressure, the flow regulating valve 5A is opened and the space between the pressed surface 3B and the top plate portion 1A is opened under the atmospheric pressure, so The diaphragm 3 receives pressure from the pressed surface 3B side due to the pressure difference from the closed space, and as shown in FIG. 3, the affixing surface 3A has a spherical shape and the diaphragm 3 expands to the semiconductor wafer 8 side. That is, in this embodiment, the diaphragm (sticking member) 3 is pressurized by supplying air (atmosphere) as a pressurized fluid between the top plate portion 1A.

The diaphragm 3 thus expanded is pressed against the semiconductor wafer 8 from the central portion of the attaching surface 3A, and the adhesive sheet 6 is attached to the upper surface (surface to be attached) of the semiconductor wafer 8 from the central portion. The air supply amount Q (× 10 ⁻³ m ³ / s) at this time is measured by a flow meter (not shown) installed in the middle of the pipe 5 between the flow regulating valve 5 A and the diaphragm 3. It is controlled by the control means 5B for adjusting the opening / closing of the provided flow rate adjusting valve 5A. Further, when the diaphragm 3 expands from the state shown in FIG. 3, the diaphragm 3 adheres to the semiconductor wafer 8 as a whole and the entire surface of the adhesive sheet 6 is adhered to the semiconductor wafer 8. The semiconductor wafer 8 is taken out and transferred to a subsequent process such as a dicing process.

  In the diaphragm 3 which is a sticking member of the pressure-sensitive adhesive sheet 6 of the present embodiment used in such a sticking method and the sticking device, the sticking surface 3A is flat while the pressed surface 3B is the sticking surface 3A. A portion located on the back side of the central portion is formed in a protruding shape, and the thickness of the diaphragm 3 is thicker than the outer peripheral portion in the central portion of the pasting surface 3A from which the pressed surface 3B protrudes. Accordingly, the rigidity of the diaphragm 3 is also higher than that of the outer peripheral portion at the central portion of the sticking surface 3A where the thickness is thick.

  Then, as shown in FIG. 3, the diaphragm 3 is pressed against the semiconductor wafer 8 as a member to be bonded from the center of the bonding surface 3 </ b> A thus made highly rigid, whereby the adhesive disposed on the bonding surface 3 </ b> A. Since the sheet 6 is affixed, the adhesive sheet 6 can be affixed so as to be strongly pressed particularly at the center of the affixed surface of the semiconductor wafer 8. For this reason, generation | occurrence | production of the space | gap in the center part of this to-be-bonded surface can be suppressed, for example, even if the semiconductor wafer 8 by which the bump was formed in the to-be-bonded surface is a to-be-bonded member, the semiconductor cut out at the dicing process It is possible to prevent a situation where the chips are scattered or the cooling water enters the gap.

  Moreover, since the sticking surface 3A of the diaphragm 3 is flat with respect to the pressed surface 3B thus formed in a convex shape, the pressure-sensitive adhesive sheet 6 cut into a circle in advance on the sticking surface 3A as in the present embodiment. In the case of adsorbing and arranging, the adhesive sheet 6 is not wrinkled or deformed, and this also reliably suppresses the generation of a gap with the semiconductor wafer 8. It becomes possible. However, instead of adhering and pasting the adhesive sheet 6 cut in advance to the pasting surface 3A, for example, a tape-like adhesive sheet wound around a roll is fed between the pasting member and the pasting member and applied to the pasting member. It may be cut after being applied, or the support tape may be peeled off after the cut adhesive sheet is attached to a support tape and applied to a member to be applied.

  In addition, if the protruding height P of the pressed surface 3B from which the portion located on the back side of the central portion of the attaching surface 3A protrudes is too low, the rigidity of the diaphragm 3 at the central portion of the attaching surface 3A can be sufficiently increased. Without being able to suppress the generation of voids. For this reason, the ratio P / D of the protrusion height P (mm) to the diameter D (mm) of the circular pasting surface 3A is preferably 0.003 or more, more preferably 0.005 or more, as described above. 0.010 or more is more preferable, and 0.015 or more is particularly preferable. However, if the ratio P / D is too large, it may be difficult to smoothly expand the diaphragm 3. Therefore, the ratio P / D is preferably set to 0.320 or less.

Further, in the present embodiment, as shown in FIG. 1, the pressed surface 3B of the portion located on the back side of the pasting surface 3A is substantially entirely formed in a conical surface, so that the back side of the central portion of the pasting surface 3A They are formed over a substrate in a convex shape protruding or being a central portion attachment surface parallel and has been truncated cone surface shape of the pressed surface 3B, and or is a convex spherical, pressed surface 3B is convex It may be formed. Further, only the central portion of the pressed surface 3B located on the back side of the central portion of the pasting surface 3A is partially formed in such a convex shape, and the outer peripheral portion of the pressed surface 3B is a flat parallel to the pasting surface 3A. It may be formed on the surface.

  Furthermore, in the sticking apparatus and sticking method of the present embodiment, the pressure between the pressed surface 3B of the diaphragm 3 and the top plate portion 1A of the upper case 1 is released from the reduced pressure state or the substantially vacuum state to the atmosphere. Air as a fluid is supplied to pressurize the diaphragm 3 from the pressed surface 3B side and expand to the semiconductor wafer 8 side. However, as a pressurized fluid, a gas other than air, such as nitrogen, oxygen, argon, water, oil, etc. The diaphragm 3 may be expanded by supplying pressurized fluid without reducing the pressure in the upper and lower cases 1 and 2. Further, in the present embodiment, the case where the adhesive sheet 6 is pasted to the semiconductor wafer 8 as the member to be pasted has been described, but glass, polarizing plates, bottles, bottles, cardboard boxes, other articles, etc. other than the semiconductor wafer 8 are covered. It is also possible to apply the present invention to affix the adhesive sheet to the affixing member.

Hereinafter, an example is given and the effect about ratio P / D of the protrusion height P (mm) of the to-be-pressed surface with respect to the diameter D (mm) of a sticking surface is demonstrated. In this embodiment, the diameter D of the opening of the frame, that is, the diameter D of the diaphragm attachment surface is 375 (× 10 ⁻³ m), and the distance h between the unexpanded diaphragm and the semiconductor wafer shown in FIG. (× 10 ⁻³ m) Using the sticking device of the above embodiment, the closed space in the upper and lower cases, the closed space between the diaphragm and the top plate portion is depressurized to a substantially vacuum state, and then the control means By adjusting the opening and closing of the flow control valve, the air supply amount Q is set to 0.167 (× 10 ⁻³ m ³ / s), and the space between the diaphragm and the top plate is opened under atmospheric pressure, and the diameter of 8 inches is increased. An adhesive sheet (Adwill (registered trademark) model number LE5000S manufactured by Lintec Corporation) having a diameter of 8 inches was attached to the semiconductor wafer.

  Here, in the present embodiment, the thickness t of the peripheral portion shown in FIG. 1 is 4 (mm), and the protrusion height P of the pressed surface is 6 (mm) and 3 (mm). Member) was prepared. These are sequentially referred to as Examples 1 and 2. In addition, as a comparative example for Examples 1 and 2, a diaphragm having a constant thickness of 4 (mm), that is, a protrusion height P of 0 (mm) and a flat pressed surface is prepared. An adhesive sheet was attached. This is referred to as Comparative Example 1. The diaphragms of Examples 1 and 2 and Comparative Example 1 are made of rubber having a hardness of 65 degrees.

  In Examples 1 and 2 and Comparative Example 1, the ratio between the area of the portion where a gap was generated between the attached adhesive sheet and the semiconductor wafer and the area of the adhesive sheet was visually evaluated. These results are shown in Table 1 together with the protrusion height P and the ratio P / D. In the evaluation, a case where no generation of voids is recognized is indicated by a round mark, a case where the ratio is less than 1% and a slight generation is observed, a triangular mark, and a case where the ratio is 1 to 3% is a cross mark. is there.

  From the results of Table 1, in Comparative Example 1 in which the pressed surface is not formed in a convex shape, the void is generated exceeding 1% of the area of the pressure-sensitive adhesive sheet, whereas the pressed surface is convex. In Examples 1 and 2 formed in the above, the area of the portion where the void was generated was suppressed to less than 1%. In particular, in Example 1 in which the ratio P / D of the protrusion height P (mm) of the pressed surface with respect to the diameter D (mm) of the pasting surface was 0.016 of 0.015 or more, no void was generated. .

3 Diaphragm (Attaching material)
3A Affixing surface 3B Pressed surface 4 Frame 4A Opening portion of frame 4 5 Piping (pressurizing means)
5A Flow adjustment valve 5B Control means 6 Adhesive sheet 6A Adhesive surface 7 Table (attachment part)
8 Semiconductor wafer (bonding material)
P Projection height of pressed surface 3B D Diameter of opening 4A of frame 4 (diameter of pasting surface 3A)
h Distance between diaphragm 3 and semiconductor wafer 8 in an unexpanded state

Claims (3)

It is formed in a plate shape with a material having elasticity, and a sticking surface is formed on one surface and a pressed surface is formed on the other surface, and pressure is applied from the pressed surface side to the bonded member side. By being expanded, it is an adhesive member for an adhesive sheet that attaches an adhesive sheet disposed between the application surface and the adhesive member to the adhesive member,
The affixing surface is flat, and the pressed surface gradually protrudes from the outer peripheral portion toward the affixing surface and the central portion of the pressed surface, and a portion located on the back side of the central portion of the affixing surface protrudes A sticking member for an adhesive sheet, characterized in that it is formed in a convex shape. An adhesive member that is formed into a plate shape with a material having elasticity, an adhesive surface is formed on one surface, and a pressed surface is formed on the other surface;
A sticking part in which a member to be stuck is disposed so as to face the sticking surface of the sticking member with a space therebetween;
Pressure means for applying pressure to the pressed surface side of the sticking member and expanding the sticking member to the sticking member side to press the sticking surface against the sticking member;
A pressure-sensitive adhesive sheet sticking device for sticking a pressure-sensitive adhesive sheet placed between the sticking surface and the sticking member to the sticking member with the sticking surface facing the sticking member,
The affixing surface of the affixing member is flat, and the pressed surface gradually protrudes from the outer peripheral part toward the affixing surface and the central part of the pressed surface, and is located behind the central part of the affixing surface. A pressure-sensitive adhesive sheet pasting device, characterized in that the portion is formed in a protruding shape. It is formed into a plate shape by an elastic material, and a flat sticking surface is formed on one surface, and the other surface gradually protrudes from the outer peripheral portion toward the central portion of the sticking surface, and the central portion of the sticking surface While holding a sticking member formed with a pressed surface protruding a portion located on the back side of,
Arrange the member to be pasted so as to face the pasting surface of the pasting member with a gap,
An adhesive sheet is arranged with the adhesive surface facing the adherend member between the sticking surface and the adherend member,
The pressure-sensitive adhesive sheet is adhered by pressing the application surface against the member to be applied by applying pressure to the member to be pressed to expand the application member toward the member to be applied. How to stick an adhesive sheet.

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