CN207250473U - A kind of absorption type wafer carrier - Google Patents
A kind of absorption type wafer carrier Download PDFInfo
- Publication number
- CN207250473U CN207250473U CN201721025058.7U CN201721025058U CN207250473U CN 207250473 U CN207250473 U CN 207250473U CN 201721025058 U CN201721025058 U CN 201721025058U CN 207250473 U CN207250473 U CN 207250473U
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- China
- Prior art keywords
- support plate
- glued membrane
- grid
- absorption type
- adsorption piece
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of absorption type wafer carrier, including vaccum-suction attachement pad, support plate and adsorption piece for vacuumizing, support plate are arranged on vaccum-suction attachement pad, and adsorption piece is embedded in support plate；The adsorption piece includes hard grid and covers the soft quality glued membrane on hard grid, the hard grid is connected with vaccum-suction attachement pad, the gluing face of the glued membrane is located at support plate front for wafer is adhered on support plate, and the glued membrane deforms under the state that vacuumizes and realizes desorption.The utility model need not vacuumize and modes of attachment can be achieved, easy to remove and fixed support, and deform glued membrane by vacuumizing, reduce the contact area of glued membrane and wafer to realize desorption, injury caused by avoiding tape pull, it is easy to use, it is particularly suitable for the load of large scale wafer.
Description
Technical field
Technical field of semiconductors is the utility model is related to, more particularly to a kind of absorption type wafer carrier.
Background technology
Wafer generally requires to be fixed on due to the characteristic such as thin, crisp during support, storage, processing, transmission, test etc.
Protected on carrier.Existing fixing means is to be adhered to wafer surrounding on carrier using adhesive tape, is tearing adhesive tape mistake
Easily cause the rupture and damage of wafer in journey, and if adhere to it is insecure if be easy to cause wafer and drop or transposition.
Vacuum suction is to realize purpose of the absorption wafer on carrier by being evacuated the negative pressure of vacuum produced, goes vacuum
Then realize desorption, be more reliably to apply without tearing adhesive tape.But during vacuum suction, vacuum pump needs to continue
Operation maintains the state of absorption to maintain negative pressure of vacuum, and being not suitable for long-term fixation is also inconvenient to move, should which has limited it
With.
Utility model content
The utility model provides a kind of absorption type wafer carrier, overcomes the shortcoming present in the prior art.
The technical solution that the utility model solves above-mentioned technical problem is as follows：
A kind of absorption type wafer carrier includes being used for vaccum-suction attachement pad, support plate and the adsorption piece vacuumized, and support plate is arranged on
On vaccum-suction attachement pad, adsorption piece is embedded in support plate；The adsorption piece includes hard grid and covers on hard grid
Soft quality glued membrane, the hard grid are connected with vaccum-suction attachement pad, and the gluing face of the glued membrane is located at support plate front for inciting somebody to action
Wafer is adhered on support plate, and the glued membrane deforms under the state that vacuumizes and realizes desorption.
Optionally, the grid line footpath of the hard grid is 550um, line-spacing 1600um, grid height 550.
Optionally, the hard grid is formed by nylon wire braiding.
Optionally, the adsorption piece is arc strip, and some arc strips surround annular ring, and adjacent arc strip interval is set
Put.
Optionally, the thickness of the adsorption piece is more than the support plate, its gluing face is concordant with support plate front, and the back side protrudes from
The support plate back side.
Optionally, the support plate is pcb board.
The beneficial effects of the utility model are：
Support plate and adsorption piece are set on vaccum-suction attachement pad, pass through the design of adsorption piece structure wafer in normal state
It is attached to by what gluing face consolidated on support plate, plays the role of protection, is not easy to be impacted and causes damage or scratch；During release,
It need to only be vacuumized by vaccum-suction attachement pad, soft quality glued membrane down attracts under the vacuum pressures, and hard grid is due to hardness
It is higher so that soft quality glued membrane becomes rough surface, reduces the contact area of wafer and soft quality glued membrane, and adhesive force becomes
It is small, so as to which easily wafer is removed from support plate.The utility model, which need not vacuumize, can be achieved modes of attachment, be easy to
Mobile and fixed support, and realize desorption by vacuumizing, injury caused by tape pull is avoided, it is easy to use.This reality
With the new load for being particularly suitable for large scale wafer.
Brief description of the drawings
Fig. 1 is the top view of the utility model；
Fig. 2 is the profile in A-A directions in Fig. 1, and arrow represents pumping direction in figure；
Fig. 3 is the structure diagram of adsorption piece attachment state；
Fig. 4 is the structure diagram of adsorption piece desorption state, and arrow represents to vacuumize in figure.
Embodiment
The principle and feature of the utility model are described below in conjunction with attached drawing, example is served only for explaining this practicality
It is new, it is not intended to limit the scope of the utility model.
Referring to figs. 1 to Fig. 2, a kind of absorption type wafer carrier include be used for vacuumize vaccum-suction attachement pad 1, support plate 2 and
Adsorption piece 3, support plate 2 are arranged on vaccum-suction attachement pad 1, and adsorption piece 3 is embedded in support plate 2.With reference to figure 3 and Fig. 4, the adsorption piece 3
Including hard grid 31 and the soft quality glued membrane 32 on hard grid 31 is covered, the hard grid 31 and vaccum-suction attachement pad 1
It is connected, the gluing face of the glued membrane 32 is located at support plate front for wafer 4 is adhered on support plate 2, and the glued membrane 32 exists
Vacuumize deformation under state and realize desorption.
Wherein, the hardness of hard grid 31 is more than soft quality glued membrane 32, i.e. soft quality glued membrane 32 is easier to send out than hard grid 31
Change shape.Specifically, the hard grid 31 is formed by nylon wire or nylon6 chips braiding, and grid line footpath is 550um, and line-spacing is
1600um, grid height 550um.Soft quality glued membrane 32 is fabricated from a flexible material, such as can be plastic film, its front be with
The gluing face of viscosity, the back side contacts with hard grid 31 and is supported by hard grid 31.The front of soft quality glued membrane 32 and the front of support plate 2
Concordant to set, the back side protrudes from the back side of support plate 2, i.e. the integral thickness of adsorption piece 3 is more than the thickness of support plate 2.Hard grid 31
Fixation is connected with support plate 2 respectively with soft quality glued membrane 32, forms embedded structure.With reference to figure 3, in use, wafer 4 is positioned over load
On 2 front of plate, the gluing face plane-plane contact of wafer 4 and soft quality glued membrane 32, so as to fulfill firm attachment, protects wafer from hitting
Hit and cause damage or scratch, while also allow for mobile and long-term fixed.With reference to figure 4, when needing to discharge wafer 4, pass through vacuum
Suction tray 1 is vacuumized, and soft quality glued membrane 32 is down attracted under suction function, since 31 hardness of hard grid is higher, is made
Obtain soft quality glued membrane 32 and form rough wave surface, wafer 4 becomes point contact by plane-plane contact with gluing face, connects
Contacting surface product diminishes, and adhesive force diminishes, and almost without adsorption capacity, wafer 4 can be taken off.
Further, to improve adhesion effect, the adsorption piece is arranged to arc strip, and some arc strips surround annular
Circle, and adjacent arc strip is arranged at intervals, so as to realize adhesion from whole border, it is ensured that uniform force.Further, the support plate
It is hard plate such as pcb board, facilitates personnel to take and carrying wafer, and keep the flatness of wafer.
Above-described embodiment is only used for further illustrating a kind of absorption type wafer carrier of the utility model, but the utility model
It is not limited to embodiment, every any simple modification made according to the technical essence of the utility model to above example,
Equivalent variations and modification, each fall within the protection domain of technical solutions of the utility model.
Claims (6)
- A kind of 1. absorption type wafer carrier, it is characterised in that：Including the vaccum-suction attachement pad, support plate and absorption for vacuumizing Part, support plate are arranged on vaccum-suction attachement pad, and adsorption piece is embedded in support plate；The adsorption piece includes hard grid and covers in hard Soft quality glued membrane on grid, the hard grid are connected with vaccum-suction attachement pad, and the gluing face of the glued membrane is being located at support plate just For wafer is adhered on support plate, the glued membrane deforms under the state that vacuumizes and realizes desorption in face.
- 2. absorption type wafer carrier according to claim 1, it is characterised in that：The grid line footpath of the hard grid is 550um, line-spacing 1600um, grid are highly 550um.
- 3. absorption type wafer carrier according to claim 1, it is characterised in that：The hard grid by nylon wire weave and Into.
- 4. absorption type wafer carrier according to claim 1, it is characterised in that：The adsorption piece is arc strip, Ruo Gansuo State arc strip and surround annular ring, and adjacent arc strip is arranged at intervals.
- 5. absorption type wafer carrier according to claim 1, it is characterised in that：The thickness of the adsorption piece is more than the load Plate, its gluing face is concordant with support plate front, and the back side protrudes from the support plate back side.
- 6. absorption type wafer carrier according to claim 1, it is characterised in that：The support plate is pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721025058.7U CN207250473U (en) | 2017-08-16 | 2017-08-16 | A kind of absorption type wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721025058.7U CN207250473U (en) | 2017-08-16 | 2017-08-16 | A kind of absorption type wafer carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207250473U true CN207250473U (en) | 2018-04-17 |
Family
ID=61881361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721025058.7U Active CN207250473U (en) | 2017-08-16 | 2017-08-16 | A kind of absorption type wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207250473U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899308A (en) * | 2018-06-26 | 2018-11-27 | 苏州日月新半导体有限公司 | Semiconductor packaging process and semiconductor package |
| CN110155465A (en) * | 2019-06-13 | 2019-08-23 | 武汉华星光电半导体显示技术有限公司 | A kind of turnover pallet |
-
2017
- 2017-08-16 CN CN201721025058.7U patent/CN207250473U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108899308A (en) * | 2018-06-26 | 2018-11-27 | 苏州日月新半导体有限公司 | Semiconductor packaging process and semiconductor package |
| CN108899308B (en) * | 2018-06-26 | 2020-07-17 | 苏州日月新半导体有限公司 | Semiconductor packaging process and semiconductor package |
| CN110155465A (en) * | 2019-06-13 | 2019-08-23 | 武汉华星光电半导体显示技术有限公司 | A kind of turnover pallet |
| CN110155465B (en) * | 2019-06-13 | 2021-06-01 | 武汉华星光电半导体显示技术有限公司 | Turnover tray |
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