JP6388644B2 - 筐体内に密閉封止してはんだ付けすることができる窓要素を製造するための方法、および前記方法によって製造された自由形状窓要素 - Google Patents

筐体内に密閉封止してはんだ付けすることができる窓要素を製造するための方法、および前記方法によって製造された自由形状窓要素 Download PDF

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JP6388644B2
JP6388644B2 JP2016513228A JP2016513228A JP6388644B2 JP 6388644 B2 JP6388644 B2 JP 6388644B2 JP 2016513228 A JP2016513228 A JP 2016513228A JP 2016513228 A JP2016513228 A JP 2016513228A JP 6388644 B2 JP6388644 B2 JP 6388644B2
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layer
substrate material
window element
optical coating
coating
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JP2016526290A5 (enExample
JP2016526290A (ja
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エルヴィラ ギットラー
エルヴィラ ギットラー
シュテフェン ビアマン
シュテフェン ビアマン
ヴォルフガング ブローデ
ヴォルフガング ブローデ
ファルコ シュテルツナー
ファルコ シュテルツナー
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イエーノプティーク オプティカル システムズ ゲーエムベーハー
イエーノプティーク オプティカル システムズ ゲーエムベーハー
マイクロ・ハイブリッド エレクトロニック ゲーエムベーハー
マイクロ・ハイブリッド エレクトロニック ゲーエムベーハー
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/02—Viewing or reading apparatus
    • G02B27/022—Viewing apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0875—Windows; Arrangements for fastening thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0271—Housings; Attachments or accessories for photometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/02—Viewing or reading apparatus
    • G02B27/028—Viewing or reading apparatus characterised by the supporting structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/007—Pressure-resistant sight glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2016513228A 2013-05-13 2014-05-13 筐体内に密閉封止してはんだ付けすることができる窓要素を製造するための方法、および前記方法によって製造された自由形状窓要素 Active JP6388644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013008478.4A DE102013008478A1 (de) 2013-05-13 2013-05-13 Verfahren zur Herstellung von in ein Gehäuse hermetisch dicht einlötbaren Fensterelementen und danach hergestellte Freiformfensterelemente
DE102013008478.4 2013-05-13
PCT/DE2014/100165 WO2014183746A1 (de) 2013-05-13 2014-05-13 Verfahren zur herstellung von in ein gehäuse hermetisch dicht einlötbaren fensterelementen und danach hergestellte freiformfensterelemente

Publications (3)

Publication Number Publication Date
JP2016526290A JP2016526290A (ja) 2016-09-01
JP2016526290A5 JP2016526290A5 (enExample) 2017-06-22
JP6388644B2 true JP6388644B2 (ja) 2018-09-12

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JP2016513228A Active JP6388644B2 (ja) 2013-05-13 2014-05-13 筐体内に密閉封止してはんだ付けすることができる窓要素を製造するための方法、および前記方法によって製造された自由形状窓要素

Country Status (6)

Country Link
US (1) US10330941B2 (enExample)
EP (1) EP2997406B1 (enExample)
JP (1) JP6388644B2 (enExample)
CN (1) CN105209949B (enExample)
DE (2) DE102013008478A1 (enExample)
WO (1) WO2014183746A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9560781B2 (en) * 2013-07-19 2017-01-31 Materion Corporation Metal cap assembly for optical communications
DE102017109913A1 (de) * 2017-05-09 2018-11-15 Henke-Sass, Wolf Gmbh Linse für ein distales Ende eines Optikkanals eines Endoskopschaftes
DE112018004026A5 (de) * 2017-08-07 2020-05-28 Jenoptik Optical Systems Gmbh Lagetoleranzunempfindliches kontaktierungsmodul zur kontaktierung optoelektronischer chips
CN109788643B (zh) * 2017-11-10 2024-07-30 泰连公司 铝基可焊接的触头
DE102018107697B4 (de) * 2018-03-29 2020-12-10 Hegla Boraident Gmbh & Co. Kg Entschichtungseinrichtungen und -verfahren zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln
CN114895393B (zh) * 2022-05-23 2023-09-05 无锡泓瑞航天科技有限公司 一种晶圆级金属化光学窗片及其制备方法
CN115064599B (zh) * 2022-06-10 2024-04-02 无锡泓瑞航天科技有限公司 一种红外探测器用金属化窗片的金属膜层制备方法
CN118377099B (zh) * 2024-03-15 2025-12-19 华侨大学 一种光学窗口的封装方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51156770U (enExample) * 1975-06-07 1976-12-14
JPH07101721B2 (ja) * 1988-06-03 1995-11-01 住友特殊金属株式会社 集積回路用Ａｇろう付きシールリング及びその製造方法
JPH06201454A (ja) * 1992-12-30 1994-07-19 Horiba Ltd 赤外線検出器
JPH0799368A (ja) * 1993-09-29 1995-04-11 Mitsubishi Electric Corp 光半導体装置
US5882988A (en) * 1995-08-16 1999-03-16 Philips Electronics North America Corporation Semiconductor chip-making without scribing
JPH11211555A (ja) * 1998-01-29 1999-08-06 Horiba Ltd 赤外線検出器
US6962834B2 (en) * 2002-03-22 2005-11-08 Stark David H Wafer-level hermetic micro-device packages
DE102004049134A1 (de) * 2004-10-07 2006-04-13 Schott Ag Metallreflektor und Verfahren zu dessen Herstellung
DE102005024512B3 (de) 2005-05-26 2007-02-08 Jenoptik Laser, Optik, Systeme Gmbh Verfahren zur Herstellung von in ein Gehäuse hermetisch dicht einlötbaren Fensterelementen
DE102007039291A1 (de) * 2007-08-20 2009-02-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen
JP2009276691A (ja) * 2008-05-16 2009-11-26 Nippon Shinku Kogaku Kk 光学素子及びその製造方法
JP2010045117A (ja) * 2008-08-11 2010-02-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP5492213B2 (ja) * 2009-08-17 2014-05-14 パナソニック株式会社 赤外線センサ
US20140093688A1 (en) * 2012-09-28 2014-04-03 Yindar Chuo Method for fabrication of nano-structures

Also Published As

Publication number Publication date
US20160062127A1 (en) 2016-03-03
EP2997406A1 (de) 2016-03-23
US10330941B2 (en) 2019-06-25
DE112014002384A5 (de) 2016-07-14
CN105209949B (zh) 2018-08-24
CN105209949A (zh) 2015-12-30
JP2016526290A (ja) 2016-09-01
EP2997406B1 (de) 2021-09-29
WO2014183746A1 (de) 2014-11-20
WO2014183746A4 (de) 2015-01-29
DE102013008478A1 (de) 2014-11-13

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