WO2014183746A4 - Verfahren zur herstellung von in ein gehäuse hermetisch dicht einlötbaren fensterelementen und danach hergestellte freiformfensterelemente - Google Patents
Verfahren zur herstellung von in ein gehäuse hermetisch dicht einlötbaren fensterelementen und danach hergestellte freiformfensterelemente Download PDFInfo
- Publication number
- WO2014183746A4 WO2014183746A4 PCT/DE2014/100165 DE2014100165W WO2014183746A4 WO 2014183746 A4 WO2014183746 A4 WO 2014183746A4 DE 2014100165 W DE2014100165 W DE 2014100165W WO 2014183746 A4 WO2014183746 A4 WO 2014183746A4
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- window elements
- optical coating
- layer
- carrier material
- protective layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- 238000000576 coating method Methods 0.000 claims abstract 24
- 239000011248 coating agent Substances 0.000 claims abstract 23
- 239000010410 layer Substances 0.000 claims abstract 22
- 230000003287 optical effect Effects 0.000 claims abstract 22
- 239000011241 protective layer Substances 0.000 claims abstract 14
- 229910000679 solder Inorganic materials 0.000 claims abstract 10
- 238000001465 metallisation Methods 0.000 claims abstract 9
- 230000002093 peripheral effect Effects 0.000 claims abstract 6
- 230000005855 radiation Effects 0.000 claims abstract 5
- 238000005530 etching Methods 0.000 claims abstract 3
- 239000012876 carrier material Substances 0.000 claims 15
- 238000005520 cutting process Methods 0.000 claims 6
- 238000003754 machining Methods 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 238000010894 electron beam technology Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims 1
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 229910001148 Al-Li alloy Inorganic materials 0.000 claims 1
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910000640 Fe alloy Inorganic materials 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 229910052769 Ytterbium Inorganic materials 0.000 claims 1
- 239000005083 Zinc sulfide Substances 0.000 claims 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 claims 1
- 238000002679 ablation Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims 1
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 239000011324 bead Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims 1
- 239000001989 lithium alloy Substances 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 239000007769 metal material Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 230000003313 weakening effect Effects 0.000 claims 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 1
- 229910052984 zinc sulfide Inorganic materials 0.000 claims 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims 1
- 239000002184 metal Substances 0.000 abstract 1
- 230000000717 retained effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/02—Viewing or reading apparatus
- G02B27/022—Viewing apparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0875—Windows; Arrangements for fastening thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/0271—Housings; Attachments or accessories for photometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/02—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of crystals, e.g. rock-salt, semi-conductors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/02—Viewing or reading apparatus
- G02B27/028—Viewing or reading apparatus characterised by the supporting structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/007—Pressure-resistant sight glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Led Device Packages (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480027085.0A CN105209949B (zh) | 2013-05-13 | 2014-05-13 | 用于制造能密闭式密封地钎焊到壳体中的窗口元件的方法和按该方法制造的自由形状窗口元件 |
EP14741504.6A EP2997406B1 (de) | 2013-05-13 | 2014-05-13 | Verfahren zur herstellung von in ein gehäuse hermetisch dicht einlötbaren fensterelementen und danach hergestellte freiformfensterelemente |
JP2016513228A JP6388644B2 (ja) | 2013-05-13 | 2014-05-13 | 筐体内に密閉封止してはんだ付けすることができる窓要素を製造するための方法、および前記方法によって製造された自由形状窓要素 |
DE112014002384.1T DE112014002384A5 (de) | 2013-05-13 | 2014-05-13 | Verfahren zur Herstellung von in ein Gehäuse hermetisch dicht einlötbaren Fensterelementen und danach hergestellte Freiformfensterelemente |
US14/939,385 US10330941B2 (en) | 2013-05-13 | 2015-11-12 | Method for producing window elements that can be soldered into a housing in a hermetically sealed manner and free-form window elements produced in accordance with said method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013008478.4A DE102013008478A1 (de) | 2013-05-13 | 2013-05-13 | Verfahren zur Herstellung von in ein Gehäuse hermetisch dicht einlötbaren Fensterelementen und danach hergestellte Freiformfensterelemente |
DE102013008478.4 | 2013-05-13 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/939,385 Continuation US10330941B2 (en) | 2013-05-13 | 2015-11-12 | Method for producing window elements that can be soldered into a housing in a hermetically sealed manner and free-form window elements produced in accordance with said method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014183746A1 WO2014183746A1 (de) | 2014-11-20 |
WO2014183746A4 true WO2014183746A4 (de) | 2015-01-29 |
Family
ID=51211462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2014/100165 WO2014183746A1 (de) | 2013-05-13 | 2014-05-13 | Verfahren zur herstellung von in ein gehäuse hermetisch dicht einlötbaren fensterelementen und danach hergestellte freiformfensterelemente |
Country Status (6)
Country | Link |
---|---|
US (1) | US10330941B2 (de) |
EP (1) | EP2997406B1 (de) |
JP (1) | JP6388644B2 (de) |
CN (1) | CN105209949B (de) |
DE (2) | DE102013008478A1 (de) |
WO (1) | WO2014183746A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9560781B2 (en) * | 2013-07-19 | 2017-01-31 | Materion Corporation | Metal cap assembly for optical communications |
DE102017109913A1 (de) | 2017-05-09 | 2018-11-15 | Henke-Sass, Wolf Gmbh | Linse für ein distales Ende eines Optikkanals eines Endoskopschaftes |
US11480495B2 (en) * | 2017-08-07 | 2022-10-25 | Jenoptik Optical Systems Gmbh | Position-tolerance-insensitive contacting module for contacting optoelectronic chips |
CN109788643A (zh) * | 2017-11-10 | 2019-05-21 | 泰连公司 | 铝基可焊接的触头 |
DE102018107697B4 (de) * | 2018-03-29 | 2020-12-10 | Hegla Boraident Gmbh & Co. Kg | Entschichtungseinrichtungen und -verfahren zum Entschichten von Glastafeln, vorzugsweise Verbundglastafeln |
CN114895393B (zh) * | 2022-05-23 | 2023-09-05 | 无锡泓瑞航天科技有限公司 | 一种晶圆级金属化光学窗片及其制备方法 |
CN115064599B (zh) * | 2022-06-10 | 2024-04-02 | 无锡泓瑞航天科技有限公司 | 一种红外探测器用金属化窗片的金属膜层制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51156770U (de) * | 1975-06-07 | 1976-12-14 | ||
JPH07101721B2 (ja) * | 1988-06-03 | 1995-11-01 | 住友特殊金属株式会社 | 集積回路用Agろう付きシールリング及びその製造方法 |
JPH06201454A (ja) * | 1992-12-30 | 1994-07-19 | Horiba Ltd | 赤外線検出器 |
JPH0799368A (ja) * | 1993-09-29 | 1995-04-11 | Mitsubishi Electric Corp | 光半導体装置 |
US5882988A (en) * | 1995-08-16 | 1999-03-16 | Philips Electronics North America Corporation | Semiconductor chip-making without scribing |
JPH11211555A (ja) * | 1998-01-29 | 1999-08-06 | Horiba Ltd | 赤外線検出器 |
US6962834B2 (en) * | 2002-03-22 | 2005-11-08 | Stark David H | Wafer-level hermetic micro-device packages |
DE102004049134A1 (de) * | 2004-10-07 | 2006-04-13 | Schott Ag | Metallreflektor und Verfahren zu dessen Herstellung |
DE102005024512B3 (de) | 2005-05-26 | 2007-02-08 | Jenoptik Laser, Optik, Systeme Gmbh | Verfahren zur Herstellung von in ein Gehäuse hermetisch dicht einlötbaren Fensterelementen |
DE102007039291A1 (de) * | 2007-08-20 | 2009-02-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen |
JP2009276691A (ja) * | 2008-05-16 | 2009-11-26 | Nippon Shinku Kogaku Kk | 光学素子及びその製造方法 |
JP2010045117A (ja) * | 2008-08-11 | 2010-02-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
CN102625907B (zh) * | 2009-08-17 | 2014-09-03 | 松下电器产业株式会社 | 红外线传感器 |
US20140093688A1 (en) * | 2012-09-28 | 2014-04-03 | Yindar Chuo | Method for fabrication of nano-structures |
-
2013
- 2013-05-13 DE DE102013008478.4A patent/DE102013008478A1/de not_active Withdrawn
-
2014
- 2014-05-13 WO PCT/DE2014/100165 patent/WO2014183746A1/de active Application Filing
- 2014-05-13 JP JP2016513228A patent/JP6388644B2/ja active Active
- 2014-05-13 CN CN201480027085.0A patent/CN105209949B/zh active Active
- 2014-05-13 DE DE112014002384.1T patent/DE112014002384A5/de not_active Withdrawn
- 2014-05-13 EP EP14741504.6A patent/EP2997406B1/de active Active
-
2015
- 2015-11-12 US US14/939,385 patent/US10330941B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105209949A (zh) | 2015-12-30 |
DE112014002384A5 (de) | 2016-07-14 |
EP2997406A1 (de) | 2016-03-23 |
CN105209949B (zh) | 2018-08-24 |
WO2014183746A1 (de) | 2014-11-20 |
DE102013008478A1 (de) | 2014-11-13 |
US20160062127A1 (en) | 2016-03-03 |
EP2997406B1 (de) | 2021-09-29 |
JP2016526290A (ja) | 2016-09-01 |
JP6388644B2 (ja) | 2018-09-12 |
US10330941B2 (en) | 2019-06-25 |
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