JP6386106B2 - ビア又はトレンチの中に層を堆積する方法、及び当該方法によって得られる製品 - Google Patents
ビア又はトレンチの中に層を堆積する方法、及び当該方法によって得られる製品 Download PDFInfo
- Publication number
- JP6386106B2 JP6386106B2 JP2016575144A JP2016575144A JP6386106B2 JP 6386106 B2 JP6386106 B2 JP 6386106B2 JP 2016575144 A JP2016575144 A JP 2016575144A JP 2016575144 A JP2016575144 A JP 2016575144A JP 6386106 B2 JP6386106 B2 JP 6386106B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- deposition
- substrate
- depositing
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/043610 WO2015199640A1 (fr) | 2014-06-23 | 2014-06-23 | Procédé pour le dépôt d'une couche dans un trou d'interconnexion ou une tranchée, et produits obtenus par ce procédé |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017520683A JP2017520683A (ja) | 2017-07-27 |
JP2017520683A5 JP2017520683A5 (ja) | 2017-09-07 |
JP6386106B2 true JP6386106B2 (ja) | 2018-09-05 |
Family
ID=51211334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016575144A Expired - Fee Related JP6386106B2 (ja) | 2014-06-23 | 2014-06-23 | ビア又はトレンチの中に層を堆積する方法、及び当該方法によって得られる製品 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6386106B2 (fr) |
KR (2) | KR20170018074A (fr) |
CN (1) | CN106460148B (fr) |
TW (1) | TWI649804B (fr) |
WO (1) | WO2015199640A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240301546A1 (en) * | 2021-04-19 | 2024-09-12 | Applied Materials, Inc. | Sputter deposition source, magnetron sputter cathode, and method of depositing a material on a substrate |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0211758A (ja) * | 1988-06-28 | 1990-01-16 | Nec Corp | スパッタ装置 |
US6143140A (en) * | 1999-08-16 | 2000-11-07 | Applied Materials, Inc. | Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field |
US6242348B1 (en) * | 1999-10-04 | 2001-06-05 | National Semiconductor Corp. | Method for the formation of a boron-doped silicon gate layer underlying a cobalt silicide layer |
TWI242052B (en) * | 2004-03-19 | 2005-10-21 | Promos Technologies Inc | Physical vapor deposition process and apparatus thereof |
JP2006083408A (ja) * | 2004-09-14 | 2006-03-30 | Shin Meiwa Ind Co Ltd | 真空成膜装置 |
US7994002B2 (en) * | 2008-11-24 | 2011-08-09 | Applied Materials, Inc. | Method and apparatus for trench and via profile modification |
EP2306489A1 (fr) * | 2009-10-02 | 2011-04-06 | Applied Materials, Inc. | Procédé de revêtement d'un substrat et dispositif de revêtement |
JP2011091242A (ja) * | 2009-10-23 | 2011-05-06 | Elpida Memory Inc | 半導体装置の製造方法 |
-
2014
- 2014-06-23 JP JP2016575144A patent/JP6386106B2/ja not_active Expired - Fee Related
- 2014-06-23 CN CN201480080149.3A patent/CN106460148B/zh not_active Expired - Fee Related
- 2014-06-23 WO PCT/US2014/043610 patent/WO2015199640A1/fr active Application Filing
- 2014-06-23 KR KR1020177002044A patent/KR20170018074A/ko active Application Filing
- 2014-06-23 KR KR1020177032386A patent/KR20170127051A/ko not_active Application Discontinuation
-
2015
- 2015-06-18 TW TW104119663A patent/TWI649804B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201614726A (en) | 2016-04-16 |
JP2017520683A (ja) | 2017-07-27 |
WO2015199640A1 (fr) | 2015-12-30 |
KR20170127051A (ko) | 2017-11-20 |
CN106460148B (zh) | 2018-12-04 |
TWI649804B (zh) | 2019-02-01 |
CN106460148A (zh) | 2017-02-22 |
KR20170018074A (ko) | 2017-02-15 |
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