JP6369774B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6369774B2 JP6369774B2 JP2012540979A JP2012540979A JP6369774B2 JP 6369774 B2 JP6369774 B2 JP 6369774B2 JP 2012540979 A JP2012540979 A JP 2012540979A JP 2012540979 A JP2012540979 A JP 2012540979A JP 6369774 B2 JP6369774 B2 JP 6369774B2
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- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
- C30B29/28—Complex oxides with formula A3Me5O12 wherein A is a rare earth metal and Me is Fe, Ga, Sc, Cr, Co or Al, e.g. garnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Description
本発明の第1の実施の形態について、図1A及び図1Bを参照して説明する。
図1Aは、本発明の第1の実施の形態に係る発光装置1の断面図である。図1Bは、図1Aに示す発光装置1を構成する発光素子10及びその周辺部の断面図である。
本実施の形態によれば、粒状の多数の蛍光体を結合して保持するための結合剤(バインダー)を用いる必要がないので、結合剤の劣化による発光効率の低下を抑制することができる。また、粒状の多数の蛍光体を結合した場合に比較して、蛍光体全体の表面積を小さくすることができるので、外部環境の影響による蛍光剤の特性劣化を抑制できるとともに、蛍光体の組成の均一性及び結晶性を高めることができるので、発光装置の発光効率を高めることができる。また、高出力の励起光の照射に対して、樹脂の劣化による効率の低下や蛍光体の劣化が起こりにくい効果が期待できる。
次に、本発明の第2の実施の形態について、図3A〜図3Cを参照して説明する。
図3Aは、本実施の形態に係る発光装置1Aの断面図、図3Bは、発光装置1Aを構成する発光素子10A及びその周辺部の断面図、図3Cは、発光素子10Aの平面図である。
次に、本発明の第3の実施の形態について、図4を参照して説明する。
図4は、本実施の形態に係る発光装置1Bの断面図である。
次に、本発明の第4の実施の形態について、図5を参照して説明する。
図5は、本実施の形態に係る発光装置1Cの断面図である。図5に示すように、本実施の形態では、発光素子と、発光素子が実装される基板及び蛍光体との位置関係が第3の実施の形態とは異なっている。以下、第1、第2又は第3の実施の形態について説明したものと同一の機能及び構成を有する発光装置1Cの構成要素については共通する符号を付して説明を省略する。
次に、本発明の第5の実施の形態について、図6A及び図6Bを参照して説明する。
図6Aは、本実施の形態に係る発光装置1Dの断面図、図6Bは、発光装置1Dを構成する発光素子7の断面図である。図6Aに示すように、本実施の形態では、発光素子の構成及びその配置が第3の実施の形態とは異なっている。以下、第1、第2又は第3の実施の形態について説明したものと同一の機能及び構成を有する発光装置1Dの構成要素については共通する符号を付して説明を省略する。
Claims (4)
- 素子基板及び前記素子基板上に形成された半導体化合物層を有し、青色系の光を発する発光素子と、
前記発光素子の光を励起光として、黄色系の光を発する単一の単結晶からなる平板状の蛍光体と、
を備え、
前記蛍光体は、Y3−x−yLxMyAl5−zNzO12−w(Lは、Gd又はLu、Mは、Ce,Tb,Eu,Yb,Tm,Smからなる群から選択される1種以上の元素、Nは、Ga又はIn、0≦x<3、0.003≦y≦0.2、0≦z≦5、−0.2≦w≦0.2)で表される組成を有し、前記蛍光体の光入射面は、前記発光素子の出射光を伝搬する空気層に接する、
発光装置。 - 素子基板及び前記素子基板上に形成された半導体化合物層を有し、青色系の光を発する発光素子と、
前記発光素子の光を励起光として、黄色系の光を発する単一の単結晶からなる平板状の蛍光体と、
を備え、
前記蛍光体は、Y3−x−yGdxMyLvN5−vO12−w(Lは、Sc,Luより選択される少なくとも1種以上の元素、Mは、Ce,Tb,Eu,Yb,Tm,Sm,Nd,Dy,Ho,Erからなる群から選択される1種以上の元素、Nは、Ga,In,Alより選択される少なくとも1種以上の元素、0≦x<3、0.003≦y≦0.2、0≦v≦5、−0.2≦w≦0.2)で表される組成を有し、前記蛍光体の光入射面は、前記発光素子の出射光を伝搬する空気層に接する、
発光装置。 - 前記蛍光体は、前記vが0.5≦v≦2である請求項2に記載の発光装置。
- 前記蛍光体は、前記yが0.01≦y≦0.2である請求項1〜3のいずれか1項に記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010243079 | 2010-10-29 | ||
JP2010243079 | 2010-10-29 | ||
PCT/JP2011/074960 WO2012057330A1 (ja) | 2010-10-29 | 2011-10-28 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012057330A1 JPWO2012057330A1 (ja) | 2014-05-12 |
JP6369774B2 true JP6369774B2 (ja) | 2018-08-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012540979A Active JP6369774B2 (ja) | 2010-10-29 | 2011-10-28 | 発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9112123B2 (ja) |
EP (1) | EP2634234B1 (ja) |
JP (1) | JP6369774B2 (ja) |
WO (1) | WO2012057330A1 (ja) |
Families Citing this family (11)
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EP3470495B1 (en) * | 2012-04-24 | 2022-08-24 | National Institute for Materials Science | Transparent member and light-emitting device |
WO2014097802A1 (ja) * | 2012-12-21 | 2014-06-26 | 電気化学工業株式会社 | 蛍光体、発光装置及び照明装置 |
CZ304579B6 (cs) * | 2013-04-22 | 2014-07-16 | Crytur Spol. S R. O. | Dioda emitující bílé světlo s monokrystalickým luminoforem a způsob výroby |
CN105684170B (zh) * | 2013-08-09 | 2019-09-03 | 株式会社光波 | 发光装置 |
JP6384893B2 (ja) * | 2013-10-23 | 2018-09-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
JP6955704B2 (ja) * | 2013-10-23 | 2021-10-27 | 株式会社光波 | 発光装置 |
JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
JP6356573B2 (ja) * | 2014-10-23 | 2018-07-11 | 国立研究開発法人物質・材料研究機構 | 単結晶蛍光体及び発光装置 |
KR20200032598A (ko) | 2018-09-18 | 2020-03-26 | 삼성전자주식회사 | 발광 장치 |
JP6741244B2 (ja) * | 2019-07-11 | 2020-08-19 | 株式会社光波 | 発光装置 |
CH717559A1 (de) * | 2020-06-22 | 2021-12-30 | Brevalor Sarl | Lichtdurchlässiges nachleuchtend lumineszierendes Objekt und dessen Anwendung. |
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TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US6630691B1 (en) | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
JP2002141559A (ja) * | 2000-10-31 | 2002-05-17 | Sanken Electric Co Ltd | 発光半導体チップ組立体及び発光半導体リードフレーム |
US6596195B2 (en) * | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
JP4032704B2 (ja) | 2001-10-23 | 2008-01-16 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP4269645B2 (ja) * | 2001-11-05 | 2009-05-27 | 日亜化学工業株式会社 | 付活剤を含有した基板を用いた窒化物半導体led素子、及び成長方法 |
JP2007300134A (ja) | 2002-05-27 | 2007-11-15 | Nichia Chem Ind Ltd | 窒化物半導体発光素子、発光素子、素子積層体、並びにそれらを用いた発光装置 |
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JP4507636B2 (ja) * | 2003-03-27 | 2010-07-21 | 日亜化学工業株式会社 | 半導体発光素子 |
JP2005005544A (ja) * | 2003-06-13 | 2005-01-06 | Sumitomo Electric Ind Ltd | 白色発光素子 |
US20050006659A1 (en) * | 2003-07-09 | 2005-01-13 | Ng Kee Yean | Light emitting diode utilizing a discrete wavelength-converting layer for color conversion |
JP2005146172A (ja) * | 2003-11-18 | 2005-06-09 | Nichia Chem Ind Ltd | 発光装置および発光装置用蛍光体 |
JP4325629B2 (ja) * | 2005-02-28 | 2009-09-02 | 三菱化学株式会社 | 蛍光体及びその製造方法並びにそれを使用した発光装置 |
EP1854863A4 (en) | 2005-02-28 | 2012-02-22 | Mitsubishi Chem Corp | LUMINOPHORE, PROCESS FOR PRODUCING THE SAME, AND APPLICATION |
JP2007049019A (ja) * | 2005-08-11 | 2007-02-22 | Koha Co Ltd | 発光装置 |
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JP2008098486A (ja) * | 2006-10-13 | 2008-04-24 | Kyocera Corp | 発光素子 |
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JP5578597B2 (ja) * | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
KR100924912B1 (ko) * | 2008-07-29 | 2009-11-03 | 서울반도체 주식회사 | 웜화이트 발광장치 및 그것을 포함하는 백라이트 모듈 |
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JP5482378B2 (ja) | 2009-04-20 | 2014-05-07 | 日亜化学工業株式会社 | 発光装置 |
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-
2011
- 2011-10-28 US US13/882,037 patent/US9112123B2/en active Active
- 2011-10-28 WO PCT/JP2011/074960 patent/WO2012057330A1/ja active Application Filing
- 2011-10-28 JP JP2012540979A patent/JP6369774B2/ja active Active
- 2011-10-28 EP EP11836463.7A patent/EP2634234B1/en active Active
Also Published As
Publication number | Publication date |
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EP2634234A4 (en) | 2015-01-28 |
US20130256730A1 (en) | 2013-10-03 |
US9112123B2 (en) | 2015-08-18 |
EP2634234B1 (en) | 2017-12-06 |
WO2012057330A1 (ja) | 2012-05-03 |
JPWO2012057330A1 (ja) | 2014-05-12 |
EP2634234A1 (en) | 2013-09-04 |
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