JP6350126B2 - 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 - Google Patents

無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 Download PDF

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Publication number
JP6350126B2
JP6350126B2 JP2014175580A JP2014175580A JP6350126B2 JP 6350126 B2 JP6350126 B2 JP 6350126B2 JP 2014175580 A JP2014175580 A JP 2014175580A JP 2014175580 A JP2014175580 A JP 2014175580A JP 6350126 B2 JP6350126 B2 JP 6350126B2
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Prior art keywords
glass
low
lead
content
free low
Prior art date
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JP2014175580A
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English (en)
Japanese (ja)
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JP2016050135A5 (enExample
JP2016050135A (ja
Inventor
内藤　孝
内藤　　孝
信一 立薗
信一 立薗
圭 吉村
圭 吉村
裕司 橋場
裕司 橋場
大剛 小野寺
大剛 小野寺
拓也 青柳
拓也 青柳
三宅　竜也
竜也 三宅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2014175580A priority Critical patent/JP6350126B2/ja
Priority to CN201510532988.0A priority patent/CN105384338B/zh
Priority to US14/838,786 priority patent/US9556061B2/en
Publication of JP2016050135A publication Critical patent/JP2016050135A/ja
Publication of JP2016050135A5 publication Critical patent/JP2016050135A5/ja
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Publication of JP6350126B2 publication Critical patent/JP6350126B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/122—Silica-free oxide glass compositions containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/16—Silica-free oxide glass compositions containing phosphorus
    • C03C3/21—Silica-free oxide glass compositions containing phosphorus containing titanium, zirconium, vanadium, tungsten or molybdenum
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Photovoltaic Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electroluminescent Light Sources (AREA)
  • Wood Science & Technology (AREA)
JP2014175580A 2014-08-29 2014-08-29 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品 Active JP6350126B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014175580A JP6350126B2 (ja) 2014-08-29 2014-08-29 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品
CN201510532988.0A CN105384338B (zh) 2014-08-29 2015-08-27 无铅低熔点玻璃组合物以及使用组合物的玻璃材料和元件
US14/838,786 US9556061B2 (en) 2014-08-29 2015-08-28 Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014175580A JP6350126B2 (ja) 2014-08-29 2014-08-29 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品

Publications (3)

Publication Number Publication Date
JP2016050135A JP2016050135A (ja) 2016-04-11
JP2016050135A5 JP2016050135A5 (enExample) 2017-03-16
JP6350126B2 true JP6350126B2 (ja) 2018-07-04

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JP2014175580A Active JP6350126B2 (ja) 2014-08-29 2014-08-29 無鉛低融点ガラス組成物並びにこれを含む低温封止用ガラスフリット、低温封止用ガラスペースト、導電性材料及び導電性ガラスペースト並びにこれらを利用したガラス封止部品及び電気電子部品

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Country Link
US (1) US9556061B2 (enExample)
JP (1) JP6350126B2 (enExample)
CN (1) CN105384338B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021038905A1 (ja) 2019-08-30 2021-03-04 昭和電工マテリアルズ株式会社 無鉛低融点ガラス組成物並びにこれを含む低融点ガラス複合材料及び低融点ガラスペースト並びにこれらを用いた封止構造体、電気電子部品及び塗装部品

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DE102014014322B4 (de) * 2014-10-01 2017-11-23 Ferro Gmbh Tellurat-Fügeglas mit Verarbeitungstemperaturen ≦ 400 °C
US10913680B2 (en) * 2016-01-18 2021-02-09 Hitachi, Ltd. Lead-free glass composition, glass composite material, glass paste, sealing structure, electrical/electronic component and coated component
US10531555B1 (en) * 2016-03-22 2020-01-07 The United States Of America As Represented By The Secretary Of The Army Tungsten oxide thermal shield
JP6690607B2 (ja) * 2016-08-03 2020-04-28 信越化学工業株式会社 合成石英ガラスリッド及び光学素子用パッケージ
US10564063B2 (en) 2016-11-09 2020-02-18 Associated Materials, Llc System and method for detecting failures in insulating glass units
JP2020073418A (ja) * 2017-01-30 2020-05-14 株式会社日立製作所 接合材及び接合体
WO2018150016A1 (en) * 2017-02-17 2018-08-23 Vkr Holding A/S Top frit heat treatment
CN107043213B (zh) * 2017-04-27 2019-08-27 湖南港鹏实业有限公司 一种中温日用陶瓷装饰用花釉及其使用方法
JP2018188341A (ja) * 2017-05-10 2018-11-29 株式会社日立製作所 複層ガラス及びその製造方法
US20200303482A1 (en) * 2017-12-22 2020-09-24 Sakai Display Products Corporation Sealing structure, organic el display device, display device, and method for manufacturing display device
JP6927154B2 (ja) * 2018-05-30 2021-08-25 昭和電工マテリアルズ株式会社 無鉛ガラス組成物ならびにそれを含むガラス複合材料、ガラスペーストおよび封止構造体
US20210254398A1 (en) * 2018-07-13 2021-08-19 Vkr Holding A/S Manufacturing of glass sheet assemblies by means of preheated edge sealing material
EP3877621A1 (en) * 2018-11-07 2021-09-15 VKR Holding A/S Method of providing edge seal for vacuum insulated glass unit
WO2020112396A2 (en) 2018-11-26 2020-06-04 Ocv Intellectual Capital, Llc High performance fiberglass composition with improved specific modulus
DK3887329T3 (da) 2018-11-26 2024-04-29 Owens Corning Intellectual Capital Llc Højydelsesglasfibersammensætning med forbedret elasticitetskoefficient
CN111689691B (zh) * 2020-05-27 2022-11-08 上海大学 无铅低熔点玻璃焊料、其制备方法和应用
CN111847889A (zh) * 2020-08-26 2020-10-30 南通天盛新能源股份有限公司 一种玻璃粉及含该玻璃粉的银浆
CN112456803A (zh) * 2020-11-05 2021-03-09 东南大学 一种用于可伐合金的高性能封接玻璃的制备方法
CN114031298A (zh) * 2021-11-30 2022-02-11 深圳市绚图新材科技有限公司 一种导电浆料用的低熔点无铅玻璃粉及其制备方法
CN114180843B (zh) * 2021-12-28 2023-01-13 海南大学 一种封接玻璃及其制备方法

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US4945071A (en) * 1989-04-19 1990-07-31 National Starch And Chemical Investment Holding Company Low softening point metallic oxide glasses suitable for use in electronic applications
US5663109A (en) * 1992-10-19 1997-09-02 Quantum Materials, Inc. Low temperature glass paste with high metal to glass ratio
US5334558A (en) * 1992-10-19 1994-08-02 Diemat, Inc. Low temperature glass with improved thermal stress properties and method of use
JPH06171975A (ja) * 1992-12-11 1994-06-21 Nippon Electric Glass Co Ltd 低融点封着組成物
US5346863A (en) * 1992-12-11 1994-09-13 Nippon Electric Glass Co., Ltd. Low temperature sealing composition
US8022000B2 (en) * 2006-01-06 2011-09-20 Hitachi Displays Ltd. Display device and production method thereof
WO2008096796A1 (ja) * 2007-02-07 2008-08-14 Asahi Glass Company, Limited 光学素子被覆用ガラス及びガラス被覆発光装置
JP5525714B2 (ja) * 2008-02-08 2014-06-18 日立粉末冶金株式会社 ガラス組成物
EP2460780A4 (en) * 2009-07-31 2013-12-04 Asahi Glass Co Ltd SEALING GLASS, SEALING MATERIAL AND SEALING MATERIAL PASTE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
JP5726698B2 (ja) * 2011-07-04 2015-06-03 株式会社日立製作所 ガラス組成物、それを含むガラスフリット、それを含むガラスペースト、およびそれを利用した電気電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021038905A1 (ja) 2019-08-30 2021-03-04 昭和電工マテリアルズ株式会社 無鉛低融点ガラス組成物並びにこれを含む低融点ガラス複合材料及び低融点ガラスペースト並びにこれらを用いた封止構造体、電気電子部品及び塗装部品

Also Published As

Publication number Publication date
CN105384338B (zh) 2018-10-23
US9556061B2 (en) 2017-01-31
JP2016050135A (ja) 2016-04-11
US20160060158A1 (en) 2016-03-03
CN105384338A (zh) 2016-03-09

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