JP6345602B2 - レーザー吸収化合物 - Google Patents

レーザー吸収化合物 Download PDF

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Publication number
JP6345602B2
JP6345602B2 JP2014560115A JP2014560115A JP6345602B2 JP 6345602 B2 JP6345602 B2 JP 6345602B2 JP 2014560115 A JP2014560115 A JP 2014560115A JP 2014560115 A JP2014560115 A JP 2014560115A JP 6345602 B2 JP6345602 B2 JP 6345602B2
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Japan
Prior art keywords
laser
substrate
marking
marking composition
composition
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JP2014560115A
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English (en)
Japanese (ja)
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JP2015510950A (ja
JP2015510950A5 (enExample
Inventor
デトリー，テリー，ジェイ．
サコスケ，ジョージ，イー．
ロズウッド，スティーブン
サーヴァー，ジョセフ，イー．
Original Assignee
フエロ コーポレーション
フエロ コーポレーション
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Publication of JP2015510950A5 publication Critical patent/JP2015510950A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B23K26/0661—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks disposed on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00—Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
JP2014560115A 2012-03-01 2013-03-01 レーザー吸収化合物 Active JP6345602B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261605387P 2012-03-01 2012-03-01
US61/605,387 2012-03-01
PCT/US2013/028760 WO2013131064A1 (en) 2012-03-01 2013-03-01 Laser absorbing compounds

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018011092A Division JP6445194B2 (ja) 2012-03-01 2018-01-26 レーザー吸収化合物

Publications (3)

Publication Number Publication Date
JP2015510950A JP2015510950A (ja) 2015-04-13
JP2015510950A5 JP2015510950A5 (enExample) 2016-11-17
JP6345602B2 true JP6345602B2 (ja) 2018-06-20

Family

ID=49083368

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2014560115A Active JP6345602B2 (ja) 2012-03-01 2013-03-01 レーザー吸収化合物
JP2018011092A Active JP6445194B2 (ja) 2012-03-01 2018-01-26 レーザー吸収化合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018011092A Active JP6445194B2 (ja) 2012-03-01 2018-01-26 レーザー吸収化合物

Country Status (6)

Country Link
US (1) US9321130B2 (enExample)
EP (1) EP2790869B1 (enExample)
JP (2) JP6345602B2 (enExample)
CN (1) CN104093520B (enExample)
ES (1) ES2655965T3 (enExample)
WO (1) WO2013131064A1 (enExample)

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FR3066130B1 (fr) * 2017-05-09 2022-07-15 Gravotech Marking Dispositif d'application d'une couche de materiau absorbant et ensemble de marquage laser comprenant un tel dispositif
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CN109279654B (zh) * 2018-12-06 2021-04-09 盐城工学院 一种铜钨酸的制备方法
CN109868008A (zh) * 2019-03-25 2019-06-11 刘应良 一种激光标记油墨
IT201900014934A1 (it) * 2019-08-22 2021-02-22 Alchina T L A Procedimento per il taglio di materiali non metallici mediante macchina laser
JP7700461B2 (ja) * 2021-02-02 2025-07-01 住友金属鉱山株式会社 電磁波吸収粒子、電磁波吸収粒子分散液、電磁波吸収粒子分散体、電磁波吸収積層体
JP7639373B2 (ja) * 2021-02-02 2025-03-05 住友金属鉱山株式会社 電磁波吸収粒子、電磁波吸収粒子分散液、電磁波吸収粒子分散体、電磁波吸収積層体
CN114231993B (zh) * 2021-12-20 2022-08-23 上海集优张力控制螺栓有限公司 一种金属防腐材料
CN115480448B (zh) * 2022-08-22 2025-08-01 广东风华高新科技股份有限公司 一种标识组合物及其制备方法和应用

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Also Published As

Publication number Publication date
US20140370247A1 (en) 2014-12-18
ES2655965T3 (es) 2018-02-22
WO2013131064A1 (en) 2013-09-06
US9321130B2 (en) 2016-04-26
JP2018095886A (ja) 2018-06-21
CN104093520A (zh) 2014-10-08
CN104093520B (zh) 2017-07-04
JP2015510950A (ja) 2015-04-13
EP2790869B1 (en) 2017-11-01
EP2790869A1 (en) 2014-10-22
JP6445194B2 (ja) 2018-12-26
EP2790869A4 (en) 2015-06-24

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