JP6342636B2 - ガラス基板のエッチング切断方法 - Google Patents

ガラス基板のエッチング切断方法 Download PDF

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JP6342636B2
JP6342636B2 JP2013202195A JP2013202195A JP6342636B2 JP 6342636 B2 JP6342636 B2 JP 6342636B2 JP 2013202195 A JP2013202195 A JP 2013202195A JP 2013202195 A JP2013202195 A JP 2013202195A JP 6342636 B2 JP6342636 B2 JP 6342636B2
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glass substrate
glass
cutting
protective film
etching
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JP2014070017A (ja
Inventor
ルー ヨンジュン
ルー ヨンジュン
リー タイ−チェン
リー タイ−チェン
Original Assignee
ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー
ザ ケマーズ カンパニー エフシー リミテッド ライアビリティ カンパニー
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
JP2013202195A 2012-09-27 2013-09-27 ガラス基板のエッチング切断方法 Active JP6342636B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210369577.0 2012-09-27
CN201210369577.0A CN103693855A (zh) 2012-09-27 2012-09-27 蚀刻切割玻璃基材的方法

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JP2014070017A JP2014070017A (ja) 2014-04-21
JP6342636B2 true JP6342636B2 (ja) 2018-06-13

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JP2013202195A Active JP6342636B2 (ja) 2012-09-27 2013-09-27 ガラス基板のエッチング切断方法

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JP (1) JP6342636B2 (zh)
KR (1) KR102151997B1 (zh)
CN (1) CN103693855A (zh)
TW (1) TWI595077B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6535226B2 (ja) * 2014-07-11 2019-06-26 東京応化工業株式会社 ガラス加工方法、ガラスエッチング液、及びガラス基板
KR20170057323A (ko) 2014-09-16 2017-05-24 더 케무어스 컴퍼니 에프씨, 엘엘씨 유리 기판에 사용하기 위한 에칭 절단 용액
CN104628245A (zh) * 2014-12-26 2015-05-20 合肥蓝氏特种玻璃有限责任公司 平板钢化玻璃的切割方法
CN106277810B (zh) * 2016-07-28 2019-04-02 武汉华星光电技术有限公司 玻璃基板的切割方法
CN107459266B (zh) * 2017-08-09 2020-10-20 维达力实业(深圳)有限公司 盖板玻璃及其制作方法
CN108101386A (zh) * 2017-12-18 2018-06-01 信利光电股份有限公司 一种移动终端盖板刻蚀方法及移动终端盖板
KR102639626B1 (ko) * 2018-03-09 2024-02-23 동우 화인켐 주식회사 은 박막 식각액 조성물 및 이를 이용한 식각 방법 및 금속 패턴의 형성 방법
CN112573833B (zh) * 2019-09-29 2022-03-18 比亚迪股份有限公司 对型材的表面进行处理的方法
KR102266775B1 (ko) * 2020-02-11 2021-06-18 솔브레인 주식회사 선택적 식각 방법
CN112864024A (zh) * 2021-01-08 2021-05-28 池州昀冢电子科技有限公司 陶瓷线路板及其制作方法
CN114031301A (zh) * 2021-11-19 2022-02-11 赛德半导体有限公司 一种切割玻璃的方法、玻璃及显示装置
CN114105483A (zh) * 2021-11-19 2022-03-01 赛德半导体有限公司 超薄玻璃的强化方法、超薄玻璃、显示屏及触控显示装置
KR102466383B1 (ko) 2022-06-27 2022-11-11 차재현 유리판 가공장치
WO2024005072A1 (ja) * 2022-06-28 2024-01-04 株式会社寺岡製作所 接着剤組成物、該接着剤組成物を含む接着剤層、及び該接着剤層を備える接着シート
CN115057624A (zh) * 2022-07-11 2022-09-16 东莞华清光学科技有限公司 一种增加2.5d手表玻璃盖板单点静压强度的工艺
CN115385579A (zh) * 2022-08-15 2022-11-25 惠州市清洋实业有限公司 一种摄像头镜片加工工艺

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006059535A (ja) * 2004-08-17 2006-03-02 Seiko Instruments Inc 有機電子デバイスの製造方法
CN1290787C (zh) * 2004-11-22 2006-12-20 信利半导体有限公司 有机电致发光显示器玻璃后盖的制作方法
KR100860367B1 (ko) * 2006-08-21 2008-09-25 제일모직주식회사 금속실리사이드막 대비 실리콘 산화막에 대한 상대적인 식각 선택성이 향상된 식각용액
CN101071830A (zh) * 2007-05-29 2007-11-14 中国科学院等离子体物理研究所 染料敏化太阳电池电极的制备方法
KR100815856B1 (ko) * 2007-08-17 2008-03-24 (주)이그잭스 평판디스플레이를 구성하는 유리의 식각액 조성물
CN101445328B (zh) * 2007-11-27 2010-12-22 光捷国际股份有限公司 瀑布式层流蚀刻切割方法
KR101141688B1 (ko) * 2010-02-10 2012-05-04 김철하 케미컬 습식 식각을 통한 기판 절단 방법
JP5437351B2 (ja) * 2010-12-27 2014-03-12 Ｈｏｙａ株式会社 携帯型電子機器用カバーガラスのガラス基板、携帯型電子機器用画像表示装置、携帯型電子機器

Also Published As

Publication number Publication date
TWI595077B (zh) 2017-08-11
TW201425538A (zh) 2014-07-01
KR20140041349A (ko) 2014-04-04
JP2014070017A (ja) 2014-04-21
CN103693855A (zh) 2014-04-02
KR102151997B1 (ko) 2020-09-07

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