JP6342357B2 - 印刷回路基板及びその製造方法 - Google Patents

印刷回路基板及びその製造方法 Download PDF

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Publication number
JP6342357B2
JP6342357B2 JP2015080094A JP2015080094A JP6342357B2 JP 6342357 B2 JP6342357 B2 JP 6342357B2 JP 2015080094 A JP2015080094 A JP 2015080094A JP 2015080094 A JP2015080094 A JP 2015080094A JP 6342357 B2 JP6342357 B2 JP 6342357B2
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Japan
Prior art keywords
layer
circuit board
printed circuit
core
insulating layer
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JP2015080094A
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English (en)
Japanese (ja)
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JP2015128195A5 (https=
JP2015128195A (ja
Inventor
ミン・テ・ホン
チョ・スク・ヒョン
キム・ジョン・リプ
イ・チョン・ハン
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Samsung Electro Mechanics Co Ltd
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Samsung Electro Mechanics Co Ltd
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Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2015128195A publication Critical patent/JP2015128195A/ja
Publication of JP2015128195A5 publication Critical patent/JP2015128195A5/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015080094A 2012-07-30 2015-04-09 印刷回路基板及びその製造方法 Active JP6342357B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2012-0083160 2012-07-30
KR20120083160 2012-07-30
KR10-2012-0140480 2012-12-05
KR20120140480 2012-12-05
KR10-2013-0061168 2013-05-29
KR1020130061168A KR20140016150A (ko) 2012-07-30 2013-05-29 인쇄회로기판 및 그 제조방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013157429A Division JP2014027284A (ja) 2012-07-30 2013-07-30 印刷回路基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2015128195A JP2015128195A (ja) 2015-07-09
JP2015128195A5 JP2015128195A5 (https=) 2016-02-12
JP6342357B2 true JP6342357B2 (ja) 2018-06-13

Family

ID=50265370

Family Applications (1)

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JP2015080094A Active JP6342357B2 (ja) 2012-07-30 2015-04-09 印刷回路基板及びその製造方法

Country Status (3)

Country Link
JP (1) JP6342357B2 (https=)
KR (1) KR20140016150A (https=)
TW (1) TWI595811B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102268385B1 (ko) * 2014-08-14 2021-06-23 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판의 제조 방법
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
KR20170001310A (ko) 2015-06-26 2017-01-04 삼성전기주식회사 글라스 코어 기판, 그의 제조 방법 및 그를 이용한 회로기판
TWI685288B (zh) * 2018-08-22 2020-02-11 健鼎科技股份有限公司 電路板及其製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946165A (https=) * 1972-09-11 1974-05-02
JP3756041B2 (ja) * 1999-05-27 2006-03-15 Ｈｏｙａ株式会社 多層プリント配線板の製造方法
JP4134172B2 (ja) * 2003-09-09 2008-08-13 Ｈｏｙａ株式会社 両面配線ガラス基板の製造方法
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
TWI236324B (en) * 2004-04-08 2005-07-11 Phoenix Prec Technology Corp Insulating structure of circuit board and method for fabricating the circuit board by using the insulating structure
JP2006049804A (ja) * 2004-07-07 2006-02-16 Shinko Electric Ind Co Ltd 配線基板の製造方法
JP4564342B2 (ja) * 2004-11-24 2010-10-20 大日本印刷株式会社 多層配線基板およびその製造方法
JP5561279B2 (ja) * 2009-09-02 2014-07-30 パナソニック株式会社 プリント配線板、ビルドアップ多層基板とその製造方法

Also Published As

Publication number Publication date
TWI595811B (zh) 2017-08-11
KR20140016150A (ko) 2014-02-07
TW201414367A (zh) 2014-04-01
JP2015128195A (ja) 2015-07-09

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