JP6336692B1 - バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 - Google Patents

バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 Download PDF

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JP6336692B1
JP6336692B1 JP2018513389A JP2018513389A JP6336692B1 JP 6336692 B1 JP6336692 B1 JP 6336692B1 JP 2018513389 A JP2018513389 A JP 2018513389A JP 2018513389 A JP2018513389 A JP 2018513389A JP 6336692 B1 JP6336692 B1 JP 6336692B1
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Prior art keywords
actuator
valve
valve device
valve body
operation member
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Japanese (ja)
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JPWO2018088326A1 (ja
Inventor
俊英 吉田
俊英 吉田
中田　知宏
知宏 中田
篠原　努
努 篠原
敏之 稲田
敏之 稲田
高志 船越
高志 船越
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Fujikin Inc
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Fujikin Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • F16K7/17—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1221—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston one side of the piston being spring-loaded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1225—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston with a plurality of pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
  • Chemical Vapour Deposition (AREA)
  • Fluid-Driven Valves (AREA)
  • Lift Valve (AREA)
JP2018513389A 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法 Active JP6336692B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016218093 2016-11-08
JP2016218093 2016-11-08
PCT/JP2017/039729 WO2018088326A1 (ja) 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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JP2018088543A Division JP2018132195A (ja) 2016-11-08 2018-05-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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JP6336692B1 true JP6336692B1 (ja) 2018-06-06
JPWO2018088326A1 JPWO2018088326A1 (ja) 2018-11-15

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JP2018513389A Active JP6336692B1 (ja) 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法
JP2018088543A Pending JP2018132195A (ja) 2016-11-08 2018-05-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

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US (1) US11098819B2 (enExample)
EP (1) EP3540280A4 (enExample)
JP (2) JP6336692B1 (enExample)
KR (2) KR102312480B1 (enExample)
CN (1) CN109952459B (enExample)
TW (1) TWI671483B (enExample)
WO (1) WO2018088326A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018100968A1 (ja) * 2016-11-30 2019-10-17 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法
JP2021032391A (ja) * 2019-08-29 2021-03-01 株式会社フジキン バルブ装置および流量制御装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018235900A1 (ja) 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
US11506290B2 (en) 2017-09-25 2022-11-22 Fujikin Incorporated Valve apparatus, flow rate adjusting method, fluid control apparatus, flow rate control method, semiconductor manufacturing apparatus, and semiconductor manufacturing method
US11536386B2 (en) * 2018-08-30 2022-12-27 Fujikin Incorporated Fluid control device
KR102542263B1 (ko) 2019-01-31 2023-06-13 가부시키가이샤 후지킨 밸브장치, 이 밸브장치를 사용한 유량 제어방법, 유체 제어장치, 반도체 제조방법, 및 반도체 제조장치
JP7308506B2 (ja) * 2019-01-31 2023-07-14 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法、半導体製造方法、および半導体製造装置
JP7352971B2 (ja) * 2019-01-31 2023-09-29 株式会社フジキン バルブ装置、流量制御方法、流体制御装置、半導体製造方法、および半導体製造装置
CN110307351A (zh) * 2019-07-10 2019-10-08 广东工业大学 一种压电陶瓷限流阀
US11079035B2 (en) * 2019-07-12 2021-08-03 Pivotal Systems Corporation Preloaded piezo actuator and gas valve employing the actuator
IL268254B2 (en) * 2019-07-24 2024-10-01 Ham Let Israel Canada Ltd Fluid-flow control device
US11927274B2 (en) 2019-11-25 2024-03-12 M-System Co., Ltd. Actuator and fluid control device
KR20230131613A (ko) 2022-03-07 2023-09-14 주식회사 코일넷 미생물 분뇨처리조가 구비된 변기
DE102022003518A1 (de) * 2022-09-23 2024-03-28 Vat Holding Ag Pneumatisches gaseinlassventil mit verstellbarem anschlag
JP2024158856A (ja) * 2023-04-28 2024-11-08 株式会社堀場エステック 流体制御弁、流体制御装置、及び、材料供給システム

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JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
WO2004079243A1 (ja) * 2003-03-07 2004-09-16 Ckd Corporation 流量制御弁

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JPH10318385A (ja) 1997-05-21 1998-12-04 Hitachi Metals Ltd 金属ダイアフラム式流量調節弁
JP2001317646A (ja) 2000-05-08 2001-11-16 Smc Corp 圧電式流体制御弁
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JP5054904B2 (ja) 2005-08-30 2012-10-24 株式会社フジキン ダイレクトタッチ型メタルダイヤフラム弁
KR100812560B1 (ko) * 2005-09-07 2008-03-13 씨케이디 가부시키 가이샤 유량 제어 밸브
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JP5775110B2 (ja) * 2013-03-26 2015-09-09 株式会社フジキン 流量制御装置用の流量制御弁
JP6491878B2 (ja) 2014-12-25 2019-03-27 株式会社フジキン 流体制御器
KR20170125070A (ko) * 2015-03-13 2017-11-13 테크노프로브 에스.피.에이. 상이한 작동 조건 하에서 각각의 가이드 구멍 내에서 개선된 슬라이드 이동을 하고 테스트 헤드 내에서 프로브를 정확히 유지하는 수직형 프로브를 구비한 테스트 헤드
WO2018235900A1 (ja) * 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
US11506290B2 (en) * 2017-09-25 2022-11-22 Fujikin Incorporated Valve apparatus, flow rate adjusting method, fluid control apparatus, flow rate control method, semiconductor manufacturing apparatus, and semiconductor manufacturing method
US11512993B2 (en) * 2017-09-25 2022-11-29 Fujikin Incorporated Valve device, adjustment information generating method, flow rate adjusting method, fluid control system, flow rate control method, semiconductor manufacturing system and semiconductor manufacturing method

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Publication number Priority date Publication date Assignee Title
JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
WO2004079243A1 (ja) * 2003-03-07 2004-09-16 Ckd Corporation 流量制御弁

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2018100968A1 (ja) * 2016-11-30 2019-10-17 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法
JP2021032391A (ja) * 2019-08-29 2021-03-01 株式会社フジキン バルブ装置および流量制御装置
JP7382054B2 (ja) 2019-08-29 2023-11-16 株式会社フジキン バルブ装置および流量制御装置

Also Published As

Publication number Publication date
EP3540280A1 (en) 2019-09-18
CN109952459B (zh) 2021-02-26
US20190285176A1 (en) 2019-09-19
TW201825817A (zh) 2018-07-16
CN109952459A (zh) 2019-06-28
JPWO2018088326A1 (ja) 2018-11-15
WO2018088326A1 (ja) 2018-05-17
KR20190077477A (ko) 2019-07-03
JP2018132195A (ja) 2018-08-23
US11098819B2 (en) 2021-08-24
EP3540280A4 (en) 2019-11-27
TWI671483B (zh) 2019-09-11
KR20210079403A (ko) 2021-06-29
KR102312480B1 (ko) 2021-10-14

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