CN109952459B - 阀装置、使用该阀装置的流量控制方法和半导体制造方法 - Google Patents

阀装置、使用该阀装置的流量控制方法和半导体制造方法 Download PDF

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Publication number
CN109952459B
CN109952459B CN201780069196.1A CN201780069196A CN109952459B CN 109952459 B CN109952459 B CN 109952459B CN 201780069196 A CN201780069196 A CN 201780069196A CN 109952459 B CN109952459 B CN 109952459B
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CN
China
Prior art keywords
actuator
valve device
opening
valve
valve body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201780069196.1A
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English (en)
Chinese (zh)
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CN109952459A (zh
Inventor
吉田俊英
中田知宏
篠原努
稻田敏之
船越高志
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Fujikin Inc
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Fujikin Inc
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1225—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston with a plurality of pistons
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • F16K7/17—Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/004—Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007—Piezoelectric stacks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1221—Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston one side of the piston being spring-loaded
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
  • Chemical Vapour Deposition (AREA)
  • Fluid-Driven Valves (AREA)
  • Lift Valve (AREA)
CN201780069196.1A 2016-11-08 2017-11-02 阀装置、使用该阀装置的流量控制方法和半导体制造方法 Expired - Fee Related CN109952459B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016-218093 2016-11-08
JP2016218093 2016-11-08
PCT/JP2017/039729 WO2018088326A1 (ja) 2016-11-08 2017-11-02 バルブ装置、このバルブ装置を用いた流量制御方法および半導体製造方法

Publications (2)

Publication Number Publication Date
CN109952459A CN109952459A (zh) 2019-06-28
CN109952459B true CN109952459B (zh) 2021-02-26

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CN201780069196.1A Expired - Fee Related CN109952459B (zh) 2016-11-08 2017-11-02 阀装置、使用该阀装置的流量控制方法和半导体制造方法

Country Status (7)

Country Link
US (1) US11098819B2 (enExample)
EP (1) EP3540280A4 (enExample)
JP (2) JP6336692B1 (enExample)
KR (2) KR102312480B1 (enExample)
CN (1) CN109952459B (enExample)
TW (1) TWI671483B (enExample)
WO (1) WO2018088326A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11022224B2 (en) * 2016-11-30 2021-06-01 Fujikin Incorporated Valve device, flow control method using the same, and semiconductor manufacturing method
WO2018235900A1 (ja) 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
US11506290B2 (en) 2017-09-25 2022-11-22 Fujikin Incorporated Valve apparatus, flow rate adjusting method, fluid control apparatus, flow rate control method, semiconductor manufacturing apparatus, and semiconductor manufacturing method
US11536386B2 (en) * 2018-08-30 2022-12-27 Fujikin Incorporated Fluid control device
KR102542263B1 (ko) 2019-01-31 2023-06-13 가부시키가이샤 후지킨 밸브장치, 이 밸브장치를 사용한 유량 제어방법, 유체 제어장치, 반도체 제조방법, 및 반도체 제조장치
JP7308506B2 (ja) * 2019-01-31 2023-07-14 株式会社フジキン バルブ装置、このバルブ装置を用いた流量制御方法、半導体製造方法、および半導体製造装置
JP7352971B2 (ja) * 2019-01-31 2023-09-29 株式会社フジキン バルブ装置、流量制御方法、流体制御装置、半導体製造方法、および半導体製造装置
CN110307351A (zh) * 2019-07-10 2019-10-08 广东工业大学 一种压电陶瓷限流阀
US11079035B2 (en) * 2019-07-12 2021-08-03 Pivotal Systems Corporation Preloaded piezo actuator and gas valve employing the actuator
IL268254B2 (en) * 2019-07-24 2024-10-01 Ham Let Israel Canada Ltd Fluid-flow control device
JP7382054B2 (ja) * 2019-08-29 2023-11-16 株式会社フジキン バルブ装置および流量制御装置
US11927274B2 (en) 2019-11-25 2024-03-12 M-System Co., Ltd. Actuator and fluid control device
KR20230131613A (ko) 2022-03-07 2023-09-14 주식회사 코일넷 미생물 분뇨처리조가 구비된 변기
DE102022003518A1 (de) * 2022-09-23 2024-03-28 Vat Holding Ag Pneumatisches gaseinlassventil mit verstellbarem anschlag
JP2024158856A (ja) * 2023-04-28 2024-11-08 株式会社堀場エステック 流体制御弁、流体制御装置、及び、材料供給システム

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JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
CN1751200A (zh) * 2003-03-07 2006-03-22 喜开理株式会社 流量控制阀
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CN105190142A (zh) * 2013-03-26 2015-12-23 株式会社富士金 流量控制装置用的流量控制阀
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WO2018235900A1 (ja) * 2017-06-22 2018-12-27 株式会社フジキン 流量制御装置および流量制御装置の流量制御方法
US11506290B2 (en) * 2017-09-25 2022-11-22 Fujikin Incorporated Valve apparatus, flow rate adjusting method, fluid control apparatus, flow rate control method, semiconductor manufacturing apparatus, and semiconductor manufacturing method
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JPH08170755A (ja) * 1994-12-20 1996-07-02 Koganei Corp 流体圧作動弁装置
CN1751200A (zh) * 2003-03-07 2006-03-22 喜开理株式会社 流量控制阀
CN101360941A (zh) * 2006-01-18 2009-02-04 株式会社富士金 常开型压电元件驱动式金属隔膜控制阀
CN101652592A (zh) * 2007-03-30 2010-02-17 株式会社富士金 压电元件驱动式控制阀
CN105190142A (zh) * 2013-03-26 2015-12-23 株式会社富士金 流量控制装置用的流量控制阀
CN106662270A (zh) * 2014-12-25 2017-05-10 株式会社富士金 流体控制器

Also Published As

Publication number Publication date
EP3540280A1 (en) 2019-09-18
US20190285176A1 (en) 2019-09-19
TW201825817A (zh) 2018-07-16
CN109952459A (zh) 2019-06-28
JPWO2018088326A1 (ja) 2018-11-15
JP6336692B1 (ja) 2018-06-06
WO2018088326A1 (ja) 2018-05-17
KR20190077477A (ko) 2019-07-03
JP2018132195A (ja) 2018-08-23
US11098819B2 (en) 2021-08-24
EP3540280A4 (en) 2019-11-27
TWI671483B (zh) 2019-09-11
KR20210079403A (ko) 2021-06-29
KR102312480B1 (ko) 2021-10-14

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