JP6318495B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP6318495B2
JP6318495B2 JP2013164212A JP2013164212A JP6318495B2 JP 6318495 B2 JP6318495 B2 JP 6318495B2 JP 2013164212 A JP2013164212 A JP 2013164212A JP 2013164212 A JP2013164212 A JP 2013164212A JP 6318495 B2 JP6318495 B2 JP 6318495B2
Authority
JP
Japan
Prior art keywords
lens
light emitting
light
emitting device
mounting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013164212A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015035438A (ja
JP2015035438A5 (enExample
Inventor
強志 岡久
強志 岡久
祐太 岡
祐太 岡
三賀　大輔
大輔 三賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013164212A priority Critical patent/JP6318495B2/ja
Priority to US14/452,827 priority patent/US10096753B2/en
Publication of JP2015035438A publication Critical patent/JP2015035438A/ja
Publication of JP2015035438A5 publication Critical patent/JP2015035438A5/ja
Application granted granted Critical
Publication of JP6318495B2 publication Critical patent/JP6318495B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape

Landscapes

  • Led Device Packages (AREA)
JP2013164212A 2013-08-07 2013-08-07 発光装置 Active JP6318495B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013164212A JP6318495B2 (ja) 2013-08-07 2013-08-07 発光装置
US14/452,827 US10096753B2 (en) 2013-08-07 2014-08-06 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013164212A JP6318495B2 (ja) 2013-08-07 2013-08-07 発光装置

Publications (3)

Publication Number Publication Date
JP2015035438A JP2015035438A (ja) 2015-02-19
JP2015035438A5 JP2015035438A5 (enExample) 2016-10-06
JP6318495B2 true JP6318495B2 (ja) 2018-05-09

Family

ID=52447886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013164212A Active JP6318495B2 (ja) 2013-08-07 2013-08-07 発光装置

Country Status (2)

Country Link
US (1) US10096753B2 (enExample)
JP (1) JP6318495B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6693044B2 (ja) 2015-03-13 2020-05-13 日亜化学工業株式会社 発光装置およびその製造方法
JP7029053B2 (ja) * 2015-06-01 2022-03-04 日亜化学工業株式会社 発光モジュール
JP2019096663A (ja) * 2017-11-20 2019-06-20 ソニー株式会社 発光装置および表示装置
CN110534628B (zh) * 2018-05-24 2021-03-09 光宝光电(常州)有限公司 发光装置及其制造方法
JP7295437B2 (ja) 2019-11-29 2023-06-21 日亜化学工業株式会社 発光装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS508494A (enExample) * 1973-05-21 1975-01-28
JP3724620B2 (ja) * 1998-09-29 2005-12-07 シャープ株式会社 発光ダイオードの製造方法
DE60318611T2 (de) * 2002-11-05 2008-06-05 Matsushita Electric Industrial Co., Ltd., Kadoma Lichtemittierende Diode
EP1620903B1 (en) * 2003-04-30 2017-08-16 Cree, Inc. High-power solid state light emitter package
JP2005109289A (ja) * 2003-10-01 2005-04-21 Nichia Chem Ind Ltd 発光装置
US7452737B2 (en) 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
US7352011B2 (en) 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
US7858408B2 (en) 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
US7344902B2 (en) 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
TWI266079B (en) * 2005-01-10 2006-11-11 Shiu-Hua Huang Steering lens and light emitting system using the same
JP4876685B2 (ja) 2005-04-15 2012-02-15 旭硝子株式会社 ガラス封止発光素子の製造方法
WO2006112417A1 (ja) 2005-04-15 2006-10-26 Asahi Glass Company, Limited ガラス封止発光素子、ガラス封止発光素子付き回路基板およびそれらの製造方法
JP2007080884A (ja) 2005-09-09 2007-03-29 Asahi Glass Co Ltd 発光装置の製造方法、発光装置および発光装置の中間部品
JP5326182B2 (ja) 2005-10-07 2013-10-30 日亜化学工業株式会社 発光装置、発光素子用蛍光体及びその製造方法
CN101443922B (zh) 2006-05-18 2011-01-12 旭硝子株式会社 发光装置的制造方法及发光装置
JP4665832B2 (ja) * 2006-05-26 2011-04-06 パナソニック電工株式会社 発光装置ならびにそれを用いる白色光源および照明装置
JP5186800B2 (ja) 2007-04-28 2013-04-24 日亜化学工業株式会社 窒化物半導体発光素子、これを備える発光装置及び窒化物半導体発光素子の製造方法
JP5014182B2 (ja) 2008-01-30 2012-08-29 京セラ株式会社 発光装置
DE202008005987U1 (de) * 2008-04-30 2009-09-03 Ledon Lighting Jennersdorf Gmbh LED-Modul mit kalottenförmiger Farbkonversionsschicht
JP5220533B2 (ja) 2008-09-29 2013-06-26 株式会社朝日ラバー レンズ及びそれを用いた光学製品
US8058667B2 (en) * 2009-03-10 2011-11-15 Nepes Led Corporation Leadframe package for light emitting diode device
JP5689225B2 (ja) 2009-03-31 2015-03-25 日亜化学工業株式会社 発光装置
JP5347681B2 (ja) * 2009-04-20 2013-11-20 日亜化学工業株式会社 発光装置
CN102052630A (zh) * 2009-11-09 2011-05-11 富准精密工业(深圳)有限公司 发光组件
WO2011065322A1 (ja) 2009-11-30 2011-06-03 コニカミノルタオプト株式会社 発光ダイオードユニットの製造方法
CN102102848A (zh) * 2009-12-16 2011-06-22 富准精密工业(深圳)有限公司 透镜及应用该透镜的发光二极管模组
JP5701502B2 (ja) 2009-12-25 2015-04-15 日亜化学工業株式会社 発光装置
JP2013077798A (ja) 2011-09-14 2013-04-25 Toyoda Gosei Co Ltd ガラス封止ｌｅｄランプ及びその製造方法
JP5817521B2 (ja) * 2011-12-28 2015-11-18 日亜化学工業株式会社 発光装置の製造方法
JP5921314B2 (ja) 2012-04-24 2016-05-24 三菱電機株式会社 Ｌｅｄ光源の製造方法

Also Published As

Publication number Publication date
JP2015035438A (ja) 2015-02-19
US10096753B2 (en) 2018-10-09
US20150041844A1 (en) 2015-02-12

Similar Documents

Publication Publication Date Title
US10217918B2 (en) Light-emitting element package
US8916887B2 (en) Light emitting device package and lighting system using the same
TWI712181B (zh) 發光裝置、整合式發光裝置、及發光模組
JP6524904B2 (ja) 発光装置
JP6387954B2 (ja) 波長変換部材を用いた発光装置の製造方法
US10032969B2 (en) Light emitting device
KR102538448B1 (ko) 조명 모듈
WO2016038757A1 (en) Semiconductor light emitting device
CN107450228B (zh) 发光装置
JP6090680B2 (ja) 発光モジュール
TW201218428A (en) Light emitting diode package structure
CN107431116A (zh) 发光器件和具有发光器件的相机模块
TW201635599A (zh) 發光裝置
JP2016219613A (ja) 発光装置
JP6318495B2 (ja) 発光装置
JP2016171188A (ja) 半導体発光装置とその製造方法
EP2704541A2 (en) Wiring board, light-emitting device, and method of manufacturing the wiring board
US8445920B1 (en) Light emitting diode
JP6619966B2 (ja) 半導体発光装置
KR102425317B1 (ko) 광학 렌즈, 조명 모듈 및 이를 구비한 라이트 유닛
JPWO2017013869A1 (ja) 発光装置及び発光モジュール
KR20140004351A (ko) 발광 다이오드 패키지
JP2016115745A (ja) 発光装置用基板及び発光装置
CN102456808A (zh) 发光二极管封装结构
KR20130014755A (ko) 발광 소자 패키지 및 조명 시스템

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20160216

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160728

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160728

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160817

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170417

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170425

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170516

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170926

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171121

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180306

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180319

R150 Certificate of patent or registration of utility model

Ref document number: 6318495

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250