JP6316959B2 - ゲートパターニングのためのリソグラフィマージプロセス - Google Patents

ゲートパターニングのためのリソグラフィマージプロセス Download PDF

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JP6316959B2
JP6316959B2 JP2016530238A JP2016530238A JP6316959B2 JP 6316959 B2 JP6316959 B2 JP 6316959B2 JP 2016530238 A JP2016530238 A JP 2016530238A JP 2016530238 A JP2016530238 A JP 2016530238A JP 6316959 B2 JP6316959 B2 JP 6316959B2
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gate length
cpp
devices
present disclosure
gates
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JP2016530238A
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Japanese (ja)
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JP2016540378A (ja
JP2016540378A5 (enExample
Inventor
スタンリー・スンチュル・ソン
ジョンゼ・ワン
チョ・フェイ・イェプ
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0135—Manufacturing their gate conductors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/519—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their top-view geometrical layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/834—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET] comprising FinFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • General Engineering & Computer Science (AREA)
JP2016530238A 2013-11-22 2014-10-24 ゲートパターニングのためのリソグラフィマージプロセス Expired - Fee Related JP6316959B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361908007P 2013-11-22 2013-11-22
US61/908,007 2013-11-22
US14/283,168 US9691868B2 (en) 2013-11-22 2014-05-20 Merging lithography processes for gate patterning
US14/283,168 2014-05-20
PCT/US2014/062276 WO2015076978A1 (en) 2013-11-22 2014-10-24 Merging lithography processes for gate patterning

Publications (3)

Publication Number Publication Date
JP2016540378A JP2016540378A (ja) 2016-12-22
JP2016540378A5 JP2016540378A5 (enExample) 2017-09-21
JP6316959B2 true JP6316959B2 (ja) 2018-04-25

Family

ID=51847018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016530238A Expired - Fee Related JP6316959B2 (ja) 2013-11-22 2014-10-24 ゲートパターニングのためのリソグラフィマージプロセス

Country Status (6)

Country Link
US (1) US9691868B2 (enExample)
EP (1) EP3072152A1 (enExample)
JP (1) JP6316959B2 (enExample)
KR (1) KR20160088358A (enExample)
CN (1) CN105745747B (enExample)
WO (1) WO2015076978A1 (enExample)

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US9691868B2 (en) * 2013-11-22 2017-06-27 Qualcomm Incorporated Merging lithography processes for gate patterning
US9691898B2 (en) * 2013-12-19 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Germanium profile for channel strain
US9287398B2 (en) 2014-02-14 2016-03-15 Taiwan Semiconductor Manufacturing Co., Ltd. Transistor strain-inducing scheme
US9406511B2 (en) * 2014-07-10 2016-08-02 Taiwan Semiconductor Manufacturing Company, Ltd. Self-aligned double patterning
US20160111421A1 (en) * 2014-10-21 2016-04-21 Mark S. Rodder Multiple cpp for increased source/drain area for fets including in a critical speed path
TWI695283B (zh) * 2015-08-05 2020-06-01 聯華電子股份有限公司 半導體佈局結構及其設計方法
US9397006B1 (en) 2015-12-04 2016-07-19 International Business Machines Corporation Co-integration of different fin pitches for logic and analog devices
US9793270B1 (en) * 2016-04-21 2017-10-17 International Business Machines Corporation Forming gates with varying length using sidewall image transfer
CN109216185B (zh) * 2017-07-03 2021-02-26 中芯国际集成电路制造(上海)有限公司 一种半导体器件的制备方法
DE102017127276A1 (de) * 2017-08-30 2019-02-28 Taiwan Semiconductor Manufacturing Co., Ltd. Standardzellen und abwandlungen davon innerhalb einer standardzellenbibliothek
US10361127B1 (en) 2017-12-28 2019-07-23 International Business Machines Corporation Vertical transport FET with two or more gate lengths
US11164772B2 (en) 2018-10-30 2021-11-02 International Business Machines Corporation Spacer-defined process for lithography-etch double patterning for interconnects
KR102628894B1 (ko) * 2018-12-05 2024-01-24 삼성전자주식회사 단위 배선 구조를 갖는 집적 회로, 그 제조 방법 및 설계 방법
KR20220087229A (ko) 2020-12-17 2022-06-24 삼성전자주식회사 반도체 소자
US12453071B2 (en) * 2022-04-26 2025-10-21 Qualcomm Incorporated Gate spacer structures for three-dimensional semiconductor devices
US20240171137A1 (en) * 2022-11-22 2024-05-23 Macom Technology Solutions Holdings, Inc. Multi-zone radio frequency transistor amplifiers

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KR100354440B1 (ko) 2000-12-04 2002-09-28 삼성전자 주식회사 반도체 장치의 패턴 형성 방법
US6998332B2 (en) * 2004-01-08 2006-02-14 International Business Machines Corporation Method of independent P and N gate length control of FET device made by sidewall image transfer technique
US7446352B2 (en) * 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
CN101673735B (zh) * 2008-09-12 2011-11-16 台湾积体电路制造股份有限公司 默认多晶硅间距设计规则下的混合多晶硅间距单元设计结构及系统
US7932566B2 (en) 2008-12-31 2011-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and system of mixing poly pitch cell design under default poly pitch design rules
JP2011061003A (ja) 2009-09-10 2011-03-24 Elpida Memory Inc 配線パターン形成方法および半導体装置の製造方法、半導体装置、データ処理システム
US8390331B2 (en) * 2009-12-29 2013-03-05 Nxp B.V. Flexible CMOS library architecture for leakage power and variability reduction
US8314034B2 (en) 2010-12-23 2012-11-20 Intel Corporation Feature size reduction
US8610176B2 (en) * 2011-01-11 2013-12-17 Qualcomm Incorporated Standard cell architecture using double poly patterning for multi VT devices
JP5289479B2 (ja) * 2011-02-14 2013-09-11 株式会社東芝 半導体装置の製造方法
US8673165B2 (en) * 2011-10-06 2014-03-18 International Business Machines Corporation Sidewall image transfer process with multiple critical dimensions
EP2602663A1 (en) 2011-12-09 2013-06-12 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO System and method for overlay control
US9558947B2 (en) 2011-12-29 2017-01-31 Intel Corporation Pattern decomposition lithography techniques
US8782571B2 (en) 2012-03-08 2014-07-15 Globalfoundries Inc. Multiple patterning process for forming trenches or holes using stitched assist features
US9691868B2 (en) * 2013-11-22 2017-06-27 Qualcomm Incorporated Merging lithography processes for gate patterning

Also Published As

Publication number Publication date
US20150145070A1 (en) 2015-05-28
KR20160088358A (ko) 2016-07-25
US9691868B2 (en) 2017-06-27
JP2016540378A (ja) 2016-12-22
CN105745747A (zh) 2016-07-06
CN105745747B (zh) 2019-02-12
EP3072152A1 (en) 2016-09-28
WO2015076978A1 (en) 2015-05-28

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