JP6312999B2 - 発光素子及びこれを備えた照明システム - Google Patents

発光素子及びこれを備えた照明システム Download PDF

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Publication number
JP6312999B2
JP6312999B2 JP2013183676A JP2013183676A JP6312999B2 JP 6312999 B2 JP6312999 B2 JP 6312999B2 JP 2013183676 A JP2013183676 A JP 2013183676A JP 2013183676 A JP2013183676 A JP 2013183676A JP 6312999 B2 JP6312999 B2 JP 6312999B2
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Japan
Prior art keywords
light emitting
lead frame
emitting device
cavity
width
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Expired - Fee Related
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JP2013183676A
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English (en)
Japanese (ja)
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JP2014057060A5 (https=
JP2014057060A (ja
Inventor
ユン・ヨチャン
チョン・ジェファン
エマム・ユンシク
ホ・キロク
キム・ジンソン
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Publication of JP2014057060A5 publication Critical patent/JP2014057060A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2013183676A 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム Expired - Fee Related JP6312999B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120101821A KR102033928B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 조명 시스템
KR10-2012-0101821 2012-09-13

Publications (3)

Publication Number Publication Date
JP2014057060A JP2014057060A (ja) 2014-03-27
JP2014057060A5 JP2014057060A5 (https=) 2016-10-20
JP6312999B2 true JP6312999B2 (ja) 2018-04-18

Family

ID=48874933

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JP2013183676A Expired - Fee Related JP6312999B2 (ja) 2012-09-13 2013-09-05 発光素子及びこれを備えた照明システム

Country Status (5)

Country Link
US (2) US9318675B2 (https=)
EP (1) EP2709174B1 (https=)
JP (1) JP6312999B2 (https=)
KR (1) KR102033928B1 (https=)
CN (1) CN103682068B (https=)

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DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
DE102014101557A1 (de) * 2014-02-07 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016035508A1 (ja) * 2014-09-01 2016-03-10 シャープ株式会社 発光装置
JP6532200B2 (ja) 2014-09-04 2019-06-19 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP6862141B2 (ja) 2015-10-14 2021-04-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び照明装置
KR20170064673A (ko) * 2015-12-02 2017-06-12 (주)포인트엔지니어링 칩기판
JP2017135148A (ja) * 2016-01-25 2017-08-03 スタンレー電気株式会社 半導体装置
JP6387973B2 (ja) 2016-01-27 2018-09-12 日亜化学工業株式会社 発光装置
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP1563908S (https=) * 2016-03-24 2016-11-21
JP1563909S (https=) * 2016-03-24 2016-11-21
US10411169B2 (en) * 2017-02-03 2019-09-10 Nichia Corporation Light emitting device having leads in resin package
CN108428714B (zh) * 2017-02-13 2024-01-23 富士胶片商业创新有限公司 层叠结构、发光部件、发光装置和图像形成装置
JP6669208B2 (ja) * 2018-08-02 2020-03-18 日亜化学工業株式会社 発光装置
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
KR101970938B1 (ko) * 2019-02-11 2019-04-19 진재언 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치
US11417808B2 (en) 2019-09-12 2022-08-16 Nichia Corporation Light emitting device

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JPH0832118A (ja) * 1994-07-19 1996-02-02 Rohm Co Ltd 発光ダイオード
US7193299B2 (en) 2001-08-21 2007-03-20 Osram Opto Semiconductors Gmbh Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
JP2005026401A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 発光ダイオード
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
JP2007142290A (ja) 2005-11-21 2007-06-07 Sharp Corp 発光装置
TWI284433B (en) * 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
US20100163920A1 (en) * 2007-06-14 2010-07-01 Rohm Co., Ltd. Semiconductor light emitting device
KR20110018777A (ko) * 2009-08-18 2011-02-24 삼성엘이디 주식회사 발광 다이오드 패키지
TWD139299S1 (zh) * 2009-11-11 2011-03-01 億光電子工業股份有限公司 發光二極體
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP5922326B2 (ja) * 2010-07-26 2016-05-24 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
KR101186000B1 (ko) * 2010-06-28 2012-09-25 엘지디스플레이 주식회사 발광 다이오드, 백라이트 유닛 및 이를 구비한 액정표시장치
DE102010026343A1 (de) * 2010-07-07 2012-03-29 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
DE102010027253B4 (de) * 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
US20120098006A1 (en) * 2010-10-22 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Light emitting diode package with photoresist reflector and method of manufacturing
JP2012142426A (ja) 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
KR20120118686A (ko) * 2011-04-19 2012-10-29 엘지이노텍 주식회사 발광소자 모듈
JP2012234955A (ja) * 2011-04-28 2012-11-29 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
US8692282B2 (en) * 2011-10-27 2014-04-08 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same

Also Published As

Publication number Publication date
CN103682068A (zh) 2014-03-26
EP2709174A2 (en) 2014-03-19
CN103682068B (zh) 2018-01-30
KR20140035213A (ko) 2014-03-21
US20140070259A1 (en) 2014-03-13
US20160197254A1 (en) 2016-07-07
US9620693B2 (en) 2017-04-11
EP2709174B1 (en) 2019-07-03
KR102033928B1 (ko) 2019-10-18
JP2014057060A (ja) 2014-03-27
US9318675B2 (en) 2016-04-19
EP2709174A3 (en) 2014-10-29

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