CN103682068B - 发光装置 - Google Patents

发光装置 Download PDF

Info

Publication number
CN103682068B
CN103682068B CN201310328799.2A CN201310328799A CN103682068B CN 103682068 B CN103682068 B CN 103682068B CN 201310328799 A CN201310328799 A CN 201310328799A CN 103682068 B CN103682068 B CN 103682068B
Authority
CN
China
Prior art keywords
lead frame
light emitting
emitting device
cavity
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201310328799.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN103682068A (zh
Inventor
尹汝赞
郑在桓
严允植
许起绿
金镇成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN103682068A publication Critical patent/CN103682068A/zh
Application granted granted Critical
Publication of CN103682068B publication Critical patent/CN103682068B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
CN201310328799.2A 2012-09-13 2013-07-31 发光装置 Active CN103682068B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120101821A KR102033928B1 (ko) 2012-09-13 2012-09-13 발광 소자 및 조명 시스템
KR10-2012-0101821 2012-09-13

Publications (2)

Publication Number Publication Date
CN103682068A CN103682068A (zh) 2014-03-26
CN103682068B true CN103682068B (zh) 2018-01-30

Family

ID=48874933

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310328799.2A Active CN103682068B (zh) 2012-09-13 2013-07-31 发光装置

Country Status (5)

Country Link
US (2) US9318675B2 (https=)
EP (1) EP2709174B1 (https=)
JP (1) JP6312999B2 (https=)
KR (1) KR102033928B1 (https=)
CN (1) CN103682068B (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013104840A1 (de) * 2013-05-10 2014-11-13 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen
DE102014101557A1 (de) * 2014-02-07 2015-08-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
WO2016035508A1 (ja) * 2014-09-01 2016-03-10 シャープ株式会社 発光装置
JP6532200B2 (ja) 2014-09-04 2019-06-19 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
JP6862141B2 (ja) 2015-10-14 2021-04-21 エルジー イノテック カンパニー リミテッド 発光素子パッケージ及び照明装置
KR20170064673A (ko) * 2015-12-02 2017-06-12 (주)포인트엔지니어링 칩기판
JP2017135148A (ja) * 2016-01-25 2017-08-03 スタンレー電気株式会社 半導体装置
JP6387973B2 (ja) 2016-01-27 2018-09-12 日亜化学工業株式会社 発光装置
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
JP1563908S (https=) * 2016-03-24 2016-11-21
JP1563909S (https=) * 2016-03-24 2016-11-21
US10411169B2 (en) * 2017-02-03 2019-09-10 Nichia Corporation Light emitting device having leads in resin package
CN108428714B (zh) * 2017-02-13 2024-01-23 富士胶片商业创新有限公司 层叠结构、发光部件、发光装置和图像形成装置
JP6669208B2 (ja) * 2018-08-02 2020-03-18 日亜化学工業株式会社 発光装置
JP6669217B2 (ja) * 2018-08-30 2020-03-18 日亜化学工業株式会社 パッケージ及びそれを用いた発光装置
KR101970938B1 (ko) * 2019-02-11 2019-04-19 진재언 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치
US11417808B2 (en) 2019-09-12 2022-08-16 Nichia Corporation Light emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD632659S1 (en) * 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832118A (ja) * 1994-07-19 1996-02-02 Rohm Co Ltd 発光ダイオード
US7193299B2 (en) 2001-08-21 2007-03-20 Osram Opto Semiconductors Gmbh Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
JP2005026401A (ja) * 2003-07-01 2005-01-27 Matsushita Electric Ind Co Ltd 発光ダイオード
KR100587020B1 (ko) * 2004-09-01 2006-06-08 삼성전기주식회사 고출력 발광 다이오드용 패키지
JP2007142290A (ja) 2005-11-21 2007-06-07 Sharp Corp 発光装置
TWI284433B (en) * 2006-02-23 2007-07-21 Novalite Optronics Corp Light emitting diode package and fabricating method thereof
US20100163920A1 (en) * 2007-06-14 2010-07-01 Rohm Co., Ltd. Semiconductor light emitting device
KR20110018777A (ko) * 2009-08-18 2011-02-24 삼성엘이디 주식회사 발광 다이오드 패키지
KR101028195B1 (ko) * 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP5922326B2 (ja) * 2010-07-26 2016-05-24 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
KR101186000B1 (ko) * 2010-06-28 2012-09-25 엘지디스플레이 주식회사 발광 다이오드, 백라이트 유닛 및 이를 구비한 액정표시장치
DE102010026343A1 (de) * 2010-07-07 2012-03-29 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
DE102010027253B4 (de) * 2010-07-15 2022-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
US20120098006A1 (en) * 2010-10-22 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Light emitting diode package with photoresist reflector and method of manufacturing
JP2012142426A (ja) 2010-12-28 2012-07-26 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
KR20120118686A (ko) * 2011-04-19 2012-10-29 엘지이노텍 주식회사 발광소자 모듈
JP2012234955A (ja) * 2011-04-28 2012-11-29 Toshiba Corp Ｌｅｄパッケージ及びその製造方法
US8692282B2 (en) * 2011-10-27 2014-04-08 Seoul Semiconductor Co., Ltd. Light emitting diode package and light emitting module comprising the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD632659S1 (en) * 2009-11-11 2011-02-15 Everlight Electronics Co., Ltd. Light emitting diode lamp

Also Published As

Publication number Publication date
CN103682068A (zh) 2014-03-26
JP6312999B2 (ja) 2018-04-18
EP2709174A2 (en) 2014-03-19
KR20140035213A (ko) 2014-03-21
US20140070259A1 (en) 2014-03-13
US20160197254A1 (en) 2016-07-07
US9620693B2 (en) 2017-04-11
EP2709174B1 (en) 2019-07-03
KR102033928B1 (ko) 2019-10-18
JP2014057060A (ja) 2014-03-27
US9318675B2 (en) 2016-04-19
EP2709174A3 (en) 2014-10-29

Similar Documents

Publication Publication Date Title
CN103682068B (zh) 发光装置
KR101997243B1 (ko) 발광 소자 및 조명 시스템
CN103928596B (zh) 发光器件
US9306139B2 (en) Light emitting device, method of fabricating the same and lighting system
CN103682037B (zh) 发光装置
KR102075561B1 (ko) 발광 소자, 발광 모듈 및 조명 시스템
KR101997252B1 (ko) 광학 렌즈를 구비한 발광 모듈
KR101926531B1 (ko) 발광 소자, 발광 소자 제조방법 및 조명 시스템
KR101916148B1 (ko) 발광 소자, 발광 소자 제조방법 및 조명 시스템
KR102053287B1 (ko) 발광 소자 및 이를 구비한 조명 시스템
KR101953280B1 (ko) 발광소자 및 이를 구비한 조명 시스템
KR101977831B1 (ko) 발광 소자 및 조명 시스템
KR102019498B1 (ko) 발광 소자 및 조명 시스템
KR102042271B1 (ko) 발광 소자 및 조명 시스템
KR101896691B1 (ko) 발광 소자 및 조명 시스템
KR20190024930A (ko) 발광소자 및 이를 구비한 조명 시스템
KR20140072538A (ko) 발광 소자 및 이를 구비한 조명 시스템

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20210818

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China