JP6294973B2 - 導電材料及び接続構造体 - Google Patents

導電材料及び接続構造体 Download PDF

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Publication number
JP6294973B2
JP6294973B2 JP2016555637A JP2016555637A JP6294973B2 JP 6294973 B2 JP6294973 B2 JP 6294973B2 JP 2016555637 A JP2016555637 A JP 2016555637A JP 2016555637 A JP2016555637 A JP 2016555637A JP 6294973 B2 JP6294973 B2 JP 6294973B2
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Japan
Prior art keywords
solder
electrode
temperature
conductive
particles
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JP2016555637A
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English (en)
Japanese (ja)
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JPWO2017033934A1 (ja
Inventor
麻衣 永田
麻衣 永田
周治郎 定永
周治郎 定永
将大 伊藤
将大 伊藤
敬士 久保田
敬士 久保田
石澤　英亮
英亮 石澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Publication of JPWO2017033934A1 publication Critical patent/JPWO2017033934A1/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Wire Bonding (AREA)
JP2016555637A 2015-08-24 2016-08-23 導電材料及び接続構造体 Active JP6294973B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015165213 2015-08-24
JP2015165213 2015-08-24
PCT/JP2016/074531 WO2017033934A1 (ja) 2015-08-24 2016-08-23 導電材料及び接続構造体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018025977A Division JP2018133336A (ja) 2015-08-24 2018-02-16 導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
JPWO2017033934A1 JPWO2017033934A1 (ja) 2017-10-12
JP6294973B2 true JP6294973B2 (ja) 2018-03-14

Family

ID=58100331

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016555637A Active JP6294973B2 (ja) 2015-08-24 2016-08-23 導電材料及び接続構造体
JP2018025977A Pending JP2018133336A (ja) 2015-08-24 2018-02-16 導電材料及び接続構造体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018025977A Pending JP2018133336A (ja) 2015-08-24 2018-02-16 導電材料及び接続構造体

Country Status (5)

Country Link
JP (2) JP6294973B2 (ko)
KR (1) KR102605910B1 (ko)
CN (1) CN107636773B (ko)
TW (1) TWI704581B (ko)
WO (1) WO2017033934A1 (ko)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323246A (ja) * 2000-03-07 2001-11-22 Sony Chem Corp 電極接続用接着剤及びこれを用いた接着方法
JP3769688B2 (ja) 2003-02-05 2006-04-26 独立行政法人科学技術振興機構 端子間の接続方法及び半導体装置の実装方法
JP5099284B2 (ja) * 2005-02-24 2012-12-19 ソニーケミカル＆インフォメーションデバイス株式会社 異方性接続シート材料
EP1864750B1 (en) * 2005-04-01 2016-11-09 Koki Company Limited Conductive filler and solder material
JPWO2008023452A1 (ja) 2006-08-25 2010-01-07 住友ベークライト株式会社 接着テープ、接合体および半導体パッケージ
KR20090129478A (ko) * 2007-03-19 2009-12-16 나믹스 가부시끼가이샤 이방성 도전 페이스트
JP2012097226A (ja) * 2010-11-04 2012-05-24 Asahi Kasei E-Materials Corp 異方導電性接着フィルム及び接続構造体
WO2013125517A1 (ja) * 2012-02-21 2013-08-29 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
WO2013146604A1 (ja) * 2012-03-26 2013-10-03 積水化学工業株式会社 導電材料及び接続構造体
JP5851071B1 (ja) * 2014-03-07 2016-02-03 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法

Also Published As

Publication number Publication date
TWI704581B (zh) 2020-09-11
JPWO2017033934A1 (ja) 2017-10-12
CN107636773A (zh) 2018-01-26
TW201721663A (zh) 2017-06-16
CN107636773B (zh) 2019-09-27
WO2017033934A1 (ja) 2017-03-02
JP2018133336A (ja) 2018-08-23
KR20180042148A (ko) 2018-04-25
KR102605910B1 (ko) 2023-11-24

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