JP6288769B2 - 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体 - Google Patents

半導体パワーモジュール、電力変換装置、およびこれを用いた移動体 Download PDF

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JP6288769B2
JP6288769B2 JP2014095862A JP2014095862A JP6288769B2 JP 6288769 B2 JP6288769 B2 JP 6288769B2 JP 2014095862 A JP2014095862 A JP 2014095862A JP 2014095862 A JP2014095862 A JP 2014095862A JP 6288769 B2 JP6288769 B2 JP 6288769B2
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signal line
terminal
gate signal
emitter
power module
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Japanese (ja)
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JP2015213408A5 (enExample
JP2015213408A (ja
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敬介 堀内
敬介 堀内
大助 川瀬
大助 川瀬
政光 稲葉
政光 稲葉
克明 齊藤
克明 齊藤
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Hitachi Ltd
Minebea Power Semiconductor Device Inc
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Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
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  • Inverter Devices (AREA)
JP2014095862A 2014-05-07 2014-05-07 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体 Active JP6288769B2 (ja)

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JP2014095862A JP6288769B2 (ja) 2014-05-07 2014-05-07 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体

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JP2014095862A JP6288769B2 (ja) 2014-05-07 2014-05-07 半導体パワーモジュール、電力変換装置、およびこれを用いた移動体

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JP2015213408A JP2015213408A (ja) 2015-11-26
JP2015213408A5 JP2015213408A5 (enExample) 2017-04-13
JP6288769B2 true JP6288769B2 (ja) 2018-03-07

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110168899B (zh) 2016-12-14 2021-03-30 三菱电机株式会社 功率转换装置
DE112018002101B4 (de) * 2017-04-19 2025-11-13 Mitsubishi Electric Corporation Halbleitermodul und Leistungswandlergerät
JP2019087668A (ja) * 2017-11-08 2019-06-06 トヨタ自動車株式会社 バスバ−
JP6754387B2 (ja) * 2018-03-15 2020-09-09 本田技研工業株式会社 電力変換装置
JP7172326B2 (ja) 2018-09-14 2022-11-16 富士電機株式会社 半導体ユニット、半導体モジュール及び半導体装置
JP7215265B2 (ja) 2019-03-19 2023-01-31 富士電機株式会社 半導体ユニット、半導体モジュール及び半導体装置
JP7351209B2 (ja) * 2019-12-17 2023-09-27 富士電機株式会社 半導体装置
DE102019220010A1 (de) * 2019-12-18 2021-06-24 Zf Friedrichshafen Ag Halbbrückenmodul eines Traktionsinverters einer Leistungselektronik eines Elektrofahrzeugs oder Hybridfahrzeugs
JP7615592B2 (ja) * 2020-09-30 2025-01-17 ニデック株式会社 パワーモジュール
US20240087968A1 (en) 2022-09-08 2024-03-14 Mitsubishi Electric Corporation Semiconductor device, method of manufacturing semiconductor device, and power conversion apparatus
CN115665970B (zh) * 2022-10-08 2023-11-21 江苏东海半导体股份有限公司 一种igbt驱动保护电路板
JP2024120308A (ja) * 2023-02-24 2024-09-05 ミネベアパワーデバイス株式会社 半導体モジュール
JP2025024482A (ja) * 2023-08-07 2025-02-20 株式会社東芝 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59177951A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 半導体装置
JP2894402B2 (ja) * 1992-07-20 1999-05-24 富士電機株式会社 半導体装置
JP3550970B2 (ja) * 1997-09-19 2004-08-04 株式会社日立製作所 電力変換装置並びに多層積層導体と電気部品接続体
JPH11177017A (ja) * 1997-12-16 1999-07-02 Nippon Inter Electronics Corp 複合半導体装置
JP4540884B2 (ja) * 2001-06-19 2010-09-08 三菱電機株式会社 半導体装置
JP2004014547A (ja) * 2002-06-03 2004-01-15 Toshiba Corp 半導体装置及び容量調節回路
JP4276037B2 (ja) * 2003-09-18 2009-06-10 三菱電機株式会社 半導体モジュール
JP2013140889A (ja) * 2012-01-05 2013-07-18 Hitachi Ltd パワーモジュール
JP5835167B2 (ja) * 2012-09-07 2015-12-24 トヨタ自動車株式会社 パワーモジュール構造

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