JP6286404B2 - フォトレジスト組成物及び電子デバイスを形成する関連方法 - Google Patents
フォトレジスト組成物及び電子デバイスを形成する関連方法 Download PDFInfo
- Publication number
- JP6286404B2 JP6286404B2 JP2015198558A JP2015198558A JP6286404B2 JP 6286404 B2 JP6286404 B2 JP 6286404B2 JP 2015198558 A JP2015198558 A JP 2015198558A JP 2015198558 A JP2015198558 A JP 2015198558A JP 6286404 B2 JP6286404 B2 JP 6286404B2
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- Prior art keywords
- repeating units
- polymer
- photoacid
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C309/00—Sulfonic acids; Halides, esters, or anhydrides thereof
- C07C309/01—Sulfonic acids
- C07C309/02—Sulfonic acids having sulfo groups bound to acyclic carbon atoms
- C07C309/03—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton
- C07C309/07—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton
- C07C309/12—Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
- C08F220/24—Esters containing halogen containing perhaloalkyl radicals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1809—C9-(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
- C08F220/382—Esters containing sulfur and containing oxygen, e.g. 2-sulfoethyl (meth)acrylate
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- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462062350P | 2014-10-10 | 2014-10-10 | |
| US62/062,350 | 2014-10-10 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016081053A JP2016081053A (ja) | 2016-05-16 |
| JP2016081053A5 JP2016081053A5 (enExample) | 2017-01-26 |
| JP6286404B2 true JP6286404B2 (ja) | 2018-02-28 |
Family
ID=55655373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015198558A Active JP6286404B2 (ja) | 2014-10-10 | 2015-10-06 | フォトレジスト組成物及び電子デバイスを形成する関連方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9557642B2 (enExample) |
| JP (1) | JP6286404B2 (enExample) |
| KR (1) | KR101721957B1 (enExample) |
| CN (1) | CN105511225B (enExample) |
| TW (1) | TWI615675B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9606434B2 (en) * | 2014-10-10 | 2017-03-28 | Rohm And Haas Electronic Materials, Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
| US9527936B2 (en) | 2014-10-10 | 2016-12-27 | Rohm And Haas Electronic Materials Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
| US9557642B2 (en) | 2014-10-10 | 2017-01-31 | Rohm And Haas Electronic Materials Llc | Photoresist composition and associated method of forming an electronic device |
| US9551930B2 (en) | 2014-10-10 | 2017-01-24 | Rohm And Haas Electronic Materials Llc | Photoresist composition and associated method of forming an electronic device |
| US11281099B2 (en) | 2018-05-28 | 2022-03-22 | Tokyo Ohka Kogyo Co., Ltd. | Resist composition, method of forming resist pattern, compound, acid generator, and method of producing compound |
| JP7389622B2 (ja) * | 2018-11-20 | 2023-11-30 | 住友化学株式会社 | 塩、クエンチャー、レジスト組成物及びレジストパターンの製造方法 |
| JP7318129B2 (ja) * | 2020-06-10 | 2023-07-31 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法、電子デバイスの製造方法 |
| JP7758480B2 (ja) * | 2020-07-01 | 2025-10-22 | 住友化学株式会社 | 塩、酸発生剤、レジスト組成物及びレジストパターンの製造方法 |
| JP2023145385A (ja) * | 2022-03-28 | 2023-10-11 | 信越化学工業株式会社 | レジスト組成物及びパターン形成方法 |
| WO2025069927A1 (ja) * | 2023-09-29 | 2025-04-03 | 富士フイルム株式会社 | 感活性光線性又は感放射線性樹脂組成物、レジスト膜、パターン形成方法及び電子デバイスの製造方法 |
| WO2025234401A1 (ja) * | 2024-05-08 | 2025-11-13 | Jsr株式会社 | 感放射線性組成物及びレジストパターン形成方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3902115A1 (de) | 1989-01-25 | 1990-08-02 | Basf Ag | Strahlungsempfindliche polymere |
| JP3613491B2 (ja) | 1996-06-04 | 2005-01-26 | 富士写真フイルム株式会社 | 感光性組成物 |
| US7361447B2 (en) * | 2003-07-30 | 2008-04-22 | Hynix Semiconductor Inc. | Photoresist polymer and photoresist composition containing the same |
| KR100637450B1 (ko) * | 2005-02-16 | 2006-10-23 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 치환된 화합물과 이를 중합한 공중합체 |
| JP4845650B2 (ja) * | 2006-09-08 | 2011-12-28 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| US7569326B2 (en) * | 2006-10-27 | 2009-08-04 | Shin-Etsu Chemical Co., Ltd. | Sulfonium salt having polymerizable anion, polymer, resist composition, and patterning process |
| EP2101217B1 (en) * | 2008-03-14 | 2011-05-11 | Shin-Etsu Chemical Co., Ltd. | Sulfonium salt-containing polymer, resist compositon, and patterning process |
| JP4998746B2 (ja) * | 2008-04-24 | 2012-08-15 | 信越化学工業株式会社 | スルホニウム塩を含む高分子化合物、レジスト材料及びパターン形成方法 |
| JP5201363B2 (ja) * | 2008-08-28 | 2013-06-05 | 信越化学工業株式会社 | 重合性アニオンを有するスルホニウム塩及び高分子化合物、レジスト材料及びパターン形成方法 |
| TWI400226B (zh) | 2008-10-17 | 2013-07-01 | Shinetsu Chemical Co | 具有聚合性陰離子之鹽及高分子化合物、光阻劑材料及圖案形成方法 |
| JP5401910B2 (ja) | 2008-10-17 | 2014-01-29 | セントラル硝子株式会社 | 重合性アニオンを有する含フッ素スルホン塩類とその製造方法、含フッ素樹脂、レジスト組成物及びそれを用いたパターン形成方法 |
| JP5851688B2 (ja) | 2009-12-31 | 2016-02-03 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 感光性組成物 |
| JP5782283B2 (ja) | 2010-03-31 | 2015-09-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 新規のポリマーおよびフォトレジスト組成物 |
| US9182664B2 (en) | 2010-10-13 | 2015-11-10 | Central Glass Company, Limited | Polymerizable fluorine-containing sulfonate, fluorine-containing sulfonate resin, resist composition and pattern-forming method using same |
| JP5521996B2 (ja) * | 2010-11-19 | 2014-06-18 | 信越化学工業株式会社 | スルホニウム塩を含む高分子化合物、レジスト材料及びパターン形成方法、並びにスルホニウム塩単量体及びその製造方法 |
| JP5802394B2 (ja) | 2011-01-17 | 2015-10-28 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法及び高分子化合物 |
| JP5677135B2 (ja) | 2011-02-23 | 2015-02-25 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法および高分子化合物 |
| JP5715890B2 (ja) | 2011-06-10 | 2015-05-13 | 東京応化工業株式会社 | 高分子化合物の製造方法 |
| US20120322006A1 (en) | 2011-06-20 | 2012-12-20 | Central Glass Company, Limited | Fluorine-Containing Sulfonate Resin, Resist Composition and Pattern Formation Method |
| JP2013227466A (ja) * | 2011-06-20 | 2013-11-07 | Central Glass Co Ltd | 含フッ素スルホン酸塩樹脂、含フッ素n−スルホニルオキシイミド樹脂、レジスト組成物及びそれを用いたパターン形成方法 |
| TW201323456A (zh) | 2011-07-21 | 2013-06-16 | Tokyo Ohka Kogyo Co Ltd | 聚合物,光阻組成物及光阻圖型之形成方法 |
| JP6019849B2 (ja) | 2011-09-08 | 2016-11-02 | セントラル硝子株式会社 | 含フッ素スルホン酸塩類、含フッ素スルホン酸塩樹脂、レジスト組成物及びそれを用いたパターン形成方法 |
| JP6006928B2 (ja) | 2011-11-02 | 2016-10-12 | 東京応化工業株式会社 | 高分子化合物の製造方法 |
| JP5783137B2 (ja) * | 2012-06-15 | 2015-09-24 | 信越化学工業株式会社 | スルホニウム塩、高分子化合物、レジスト材料及びパターン形成方法 |
| JP6131776B2 (ja) * | 2012-09-05 | 2017-05-24 | 信越化学工業株式会社 | レジスト材料及びこれを用いたパターン形成方法 |
| US8945814B2 (en) * | 2012-09-15 | 2015-02-03 | Rohm And Haas Electronic Materials Llc | Acid generators and photoresists comprising same |
| TWI545118B (zh) * | 2012-09-15 | 2016-08-11 | 羅門哈斯電子材料有限公司 | 酸產生劑化合物及包含該化合物之光阻劑 |
| JP5913241B2 (ja) * | 2012-09-15 | 2016-04-27 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 複数の酸発生剤化合物を含むフォトレジスト |
| JP5803872B2 (ja) * | 2012-10-17 | 2015-11-04 | 信越化学工業株式会社 | ポジ型レジスト材料及びこれを用いたパターン形成方法 |
| JP6106432B2 (ja) | 2012-12-28 | 2017-03-29 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、高分子化合物 |
| US10248020B2 (en) * | 2012-12-28 | 2019-04-02 | Rohm And Haas Electronic Materials Llc | Acid generators and photoresists comprising same |
| JP6571912B2 (ja) | 2012-12-31 | 2019-09-04 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 樹状化合物、フォトレジスト組成物、および電子デバイスを作製する方法 |
| JP6243608B2 (ja) * | 2013-02-05 | 2017-12-06 | 東京応化工業株式会社 | 化合物、高分子化合物、レジスト組成物、レジストパターン形成方法 |
| US9581901B2 (en) * | 2013-12-19 | 2017-02-28 | Rohm And Haas Electronic Materials Llc | Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device |
| US10345700B2 (en) | 2014-09-08 | 2019-07-09 | International Business Machines Corporation | Negative-tone resist compositions and multifunctional polymers therein |
| US9606434B2 (en) | 2014-10-10 | 2017-03-28 | Rohm And Haas Electronic Materials, Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
| US9557642B2 (en) | 2014-10-10 | 2017-01-31 | Rohm And Haas Electronic Materials Llc | Photoresist composition and associated method of forming an electronic device |
| US9527936B2 (en) | 2014-10-10 | 2016-12-27 | Rohm And Haas Electronic Materials Llc | Polymer comprising repeat units with photoacid-generating functionality and base-solubility-enhancing functionality, and associated photoresist composition and electronic device forming method |
| US9551930B2 (en) | 2014-10-10 | 2017-01-24 | Rohm And Haas Electronic Materials Llc | Photoresist composition and associated method of forming an electronic device |
-
2015
- 2015-08-24 US US14/833,284 patent/US9557642B2/en active Active
- 2015-10-05 TW TW104132735A patent/TWI615675B/zh active
- 2015-10-06 JP JP2015198558A patent/JP6286404B2/ja active Active
- 2015-10-06 KR KR1020150140468A patent/KR101721957B1/ko active Active
- 2015-10-09 CN CN201510649722.4A patent/CN105511225B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20160103392A1 (en) | 2016-04-14 |
| JP2016081053A (ja) | 2016-05-16 |
| US9557642B2 (en) | 2017-01-31 |
| TW201614371A (en) | 2016-04-16 |
| CN105511225B (zh) | 2019-11-15 |
| TWI615675B (zh) | 2018-02-21 |
| KR101721957B1 (ko) | 2017-04-03 |
| CN105511225A (zh) | 2016-04-20 |
| KR20160042772A (ko) | 2016-04-20 |
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