JP6267686B2 - 冷却構造を備える一体型電子モジュール - Google Patents

冷却構造を備える一体型電子モジュール Download PDF

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Publication number
JP6267686B2
JP6267686B2 JP2015506334A JP2015506334A JP6267686B2 JP 6267686 B2 JP6267686 B2 JP 6267686B2 JP 2015506334 A JP2015506334 A JP 2015506334A JP 2015506334 A JP2015506334 A JP 2015506334A JP 6267686 B2 JP6267686 B2 JP 6267686B2
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Japan
Prior art keywords
fluid
electronic module
integrated electronic
substrate
cooling
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Expired - Fee Related
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JP2015506334A
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English (en)
Japanese (ja)
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JP2015518660A5 (https=
JP2015518660A (ja
Inventor
ユハニ ブルシラ，アリ
ユハニ ブルシラ，アリ
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/20—Arrangements or instruments for measuring magnetic variables involving magnetic resonance
    • G01R33/28—Details of apparatus provided for in groups G01R33/44 - G01R33/64
    • G01R33/32—Excitation or detection systems, e.g. using radio frequency signals
    • G01R33/34—Constructional details, e.g. resonators, specially adapted to MR
    • G01R33/34015—Temperature-controlled RF coils
    • G01R33/3403—Means for cooling of the RF coils, e.g. a refrigerator or a cooling vessel specially adapted for housing an RF coil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2015506334A 2012-04-23 2013-04-11 冷却構造を備える一体型電子モジュール Expired - Fee Related JP6267686B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261636933P 2012-04-23 2012-04-23
US61/636,933 2012-04-23
PCT/IB2013/052876 WO2013160788A1 (en) 2012-04-23 2013-04-11 Integrated electronics module with cooling structure

Publications (3)

Publication Number Publication Date
JP2015518660A JP2015518660A (ja) 2015-07-02
JP2015518660A5 JP2015518660A5 (https=) 2017-07-06
JP6267686B2 true JP6267686B2 (ja) 2018-01-24

Family

ID=48483116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015506334A Expired - Fee Related JP6267686B2 (ja) 2012-04-23 2013-04-11 冷却構造を備える一体型電子モジュール

Country Status (7)

Country Link
US (1) US20150123663A1 (https=)
EP (1) EP2842162A1 (https=)
JP (1) JP6267686B2 (https=)
CN (1) CN104428891B (https=)
BR (1) BR112014026062A2 (https=)
RU (1) RU2640574C2 (https=)
WO (1) WO2013160788A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674984B2 (en) 2015-06-23 2017-06-06 Cubic Corporation Plastic chassis for liquid cooled electronic components
US10237967B2 (en) * 2015-10-02 2019-03-19 Analogic Corporation Cooling assembly for electronics assembly of imaging system
US11010326B2 (en) 2018-09-20 2021-05-18 Western Digital Technologies, Inc. Universal serial bus voltage reducing adaptor
US20250338437A1 (en) * 2024-04-29 2025-10-30 Hewlett Packard Enterprise Development Lp O-ring gland fittings for liquid cooling with o-ring compression seal having redundant non-radial seal pairs

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1325963A1 (ru) * 1985-05-23 1991-08-07 Истринское Отделение Всесоюзного Электротехнического Института Им.В.И.Ленина Радиоэлектронный блок
DE3666644D1 (en) * 1985-11-19 1989-11-30 Nec Corp Liquid cooling system for integrated circuit chips
US4781244A (en) * 1986-02-25 1988-11-01 Nec Corporation Liquid cooling system for integrated circuit chips
JPS6351454U (https=) * 1986-09-22 1988-04-07
EP0320198B1 (en) * 1987-12-07 1995-03-01 Nec Corporation Cooling system for IC package
JPH06209060A (ja) * 1992-10-15 1994-07-26 Sun Microsyst Inc 半導体チップを冷却する装置及び方法
JPH08103426A (ja) * 1994-10-06 1996-04-23 Toshiba Corp 磁気共鳴イメージング装置の遮蔽シート
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6386278B1 (en) * 1998-08-04 2002-05-14 Jurgen Schulz-Harder Cooler
US6011245A (en) * 1999-03-19 2000-01-04 Bell; James H. Permanent magnet eddy current heat generator
JP2002200055A (ja) * 2000-12-28 2002-07-16 Toshiba Medical System Co Ltd 磁気共鳴イメージング装置
JP2002094192A (ja) * 2000-09-12 2002-03-29 Denki Kagaku Kogyo Kk 回路基板の冷却構造
DE20115922U1 (de) * 2001-01-11 2002-01-17 Siemens AG, 80333 München Kunststoff-Schaltplatte eines hydraulischen Kraftfahrzeug-Getriebesteuergerätes
JP4969738B2 (ja) * 2001-06-28 2012-07-04 株式会社東芝 セラミックス回路基板およびそれを用いた半導体モジュール
US20060293727A1 (en) * 2002-05-09 2006-12-28 Greg Spooner System and method for treating exposed tissue with light emitting diodes
JP2005288044A (ja) * 2004-04-06 2005-10-20 Hitachi Medical Corp 磁気共鳴イメージング装置
GB2419417B (en) * 2004-10-20 2007-05-16 Gen Electric Gradient bore cooling and RF shield
US7397665B2 (en) 2004-12-08 2008-07-08 Optherm - Thermal Solutions Ltd. Integral heat-dissipation system for electronic boards
US20060157225A1 (en) * 2005-01-18 2006-07-20 Yves Martin High turbulence heat exchanger
RU53072U1 (ru) * 2005-04-06 2006-04-27 Федеральное государственное унитарное предприятие "Научно-исследовательский институт Научно-производственное объединение "ЛУЧ" (ФГУП "НИИ НПО "ЛУЧ") Устройство для охлаждения и термостатирования полупроводниковых приборов
JP4759384B2 (ja) * 2005-12-20 2011-08-31 昭和電工株式会社 半導体モジュール
US20100010595A1 (en) 2006-08-30 2010-01-14 Koninklijke Philips Electronics N. V. Apparatus for thermal treatment of tissue
ATE505067T1 (de) * 2006-10-27 2011-04-15 Agie Charmilles Sa Leiterplatteneinheit und verfahren zur herstellung dazu
JP5222735B2 (ja) * 2007-02-06 2013-06-26 株式会社日立メディコ 磁気共鳴イメージング装置および傾斜磁場コイル
JP2010114121A (ja) * 2008-11-04 2010-05-20 Daikin Ind Ltd 電装部品の放熱器
US20100175857A1 (en) * 2009-01-15 2010-07-15 General Electric Company Millichannel heat sink, and stack and apparatus using the same
DE102009005915B4 (de) * 2009-01-23 2013-07-11 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul in Druckkontaktausführung
WO2011036607A1 (en) 2009-09-24 2011-03-31 Koninklijke Philips Electronics N.V. High intensity focused ultrasound positioning mechanism
DE102009046321B4 (de) * 2009-11-03 2013-10-17 Bruker Biospin Ag Kühlvorrichtung zur kryogenen Kühlung eines NMR-Detektionssystems mit Hilfe eines mit kryogenen Fluid gefüllten Behälters
CN201667332U (zh) * 2010-03-29 2010-12-08 比亚迪股份有限公司 一种半导体功率模块
DE102010032078B4 (de) * 2010-07-23 2012-02-16 Siemens Aktiengesellschaft Leistungselektronik-Baueinheit für eine Magnetresonanzeinrichtung und Magnetresonanzeinrichtung

Also Published As

Publication number Publication date
BR112014026062A2 (pt) 2017-06-27
EP2842162A1 (en) 2015-03-04
CN104428891B (zh) 2018-03-13
RU2014146775A (ru) 2016-06-10
RU2640574C2 (ru) 2018-01-10
CN104428891A (zh) 2015-03-18
WO2013160788A1 (en) 2013-10-31
JP2015518660A (ja) 2015-07-02
US20150123663A1 (en) 2015-05-07

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