JP6251908B2 - 放熱フレーム構造及びそれの製造方法 - Google Patents
放熱フレーム構造及びそれの製造方法 Download PDFInfo
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- JP6251908B2 JP6251908B2 JP2016156733A JP2016156733A JP6251908B2 JP 6251908 B2 JP6251908 B2 JP 6251908B2 JP 2016156733 A JP2016156733 A JP 2016156733A JP 2016156733 A JP2016156733 A JP 2016156733A JP 6251908 B2 JP6251908 B2 JP 6251908B2
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- Prior art keywords
- metal plate
- frame structure
- heating element
- heat dissipation
- heat
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title description 9
- 230000005855 radiation Effects 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 claims description 132
- 239000002184 metal Substances 0.000 claims description 132
- 230000017525 heat dissipation Effects 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 45
- 239000004033 plastic Substances 0.000 claims description 38
- 239000002131 composite material Substances 0.000 claims description 37
- 238000005452 bending Methods 0.000 claims description 10
- 238000010168 coupling process Methods 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 8
- 238000005859 coupling reaction Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 description 30
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 230000000694 effects Effects 0.000 description 16
- 238000000465 moulding Methods 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Resistance Heating (AREA)
Description
[発明の項目]
[項目1]
放熱フレーム構造において、
一部が発熱体と接触する金属板組立部品と、
前記金属板組立部品と結合することで、前記金属板組立部品を介した前記発熱体からの熱を受けるプラスチック合成物と、
を含むことを特徴とする放熱フレーム構造。
[項目2]
前記金属板組立部品と前記プラスチック合成物との結合は、少なくともインサート成形により達成されることを特徴とする項目1に記載の放熱フレーム構造。
[項目3]
前記インサート成形は、固定手段を有する金型において行われることを特徴とする項目2に記載の放熱フレーム構造。
[項目4]
前記金属板組立部品は、一部が前記発熱体と接触の第一の金属板と、一部が前記発熱体と接続の第二の金属板とを含むことを特徴とする項目1に記載の放熱フレーム構造。
[項目5]
前記第一の金属板は、前記発熱体と接触の部分と、囲繞部と、第一の電極部とを含むことを特徴とする項目4に記載の放熱フレーム構造。
[項目6]
前記第一の金属板の前記囲繞部は、細長い金属板を長手方向における両端が重なるように折り曲げることで、短手方向から見るとき円形であるものに形成され、且つ前記重なった部分は固定されていることを特徴とする項目5に記載の放熱フレーム構造。
[項目7]
前記第二の金属板は、L字形となっており、第二の電極部と、第二の電極部と垂直である前記発熱体と接続の部分とを含み、
前記第二の金属板の前記発熱体と接続の部分の面内方向は、前記第一の金属板の前記発熱体と接触の部分の面内方向と平行し、
前記第二の金属板の前記第二の電極部は、前記第一の金属板の囲繞部に囲繞されることを特徴とする項目4に記載の放熱フレーム構造。
[項目8]
前記プラスチック合成物は、固定溝を有するように形成されることを特徴とする項目4に記載の放熱フレーム構造。
[項目9]
前記プラスチック合成物は、固定穴を有するように形成されることを特徴とする項目4に記載の放熱フレーム構造。
[項目10]
項目1〜9のいずれか一項に記載の放熱フレーム構造を製造するための放熱フレーム構造の製造方法。
2:金属板組立部品
21:第一の金属板
211:第一の金属板の一部
212:囲繞部
213:第一の電極部
22:第二の金属板
222:第二の電極部
221:第二の電極部の一部
3:プラスチック合成物
31:固定溝
32:固定穴
4:金型
41:固定柱
Claims (5)
- 放熱フレーム構造において、
一部が発熱体と接触する金属板組立部品と、
前記金属板組立部品と結合することで、前記金属板組立部品を介した前記発熱体からの熱を受けるプラスチック合成物と、
を含み、
前記金属板組立部品は、一部が前記発熱体と接触の第一の金属板と、一部が前記発熱体と接続の第二の金属板とを含み、
前記第一の金属板は、前記発熱体と接触の部分と、囲繞部と、第一の電極部とを含み、
前記囲繞部は、細長い金属板を折り曲げることで、短手方向から見るとき円形であるものに形成されていることを特徴とする放熱フレーム構造。 - 前記第一の金属板の前記囲繞部は、細長い金属板を長手方向における両端が重なるように折り曲げることで形成され、且つ前記重なった部分は固定されていることを特徴とする請求項1に記載の放熱フレーム構造。
- 前記第二の金属板は、L字形となっており、第二の電極部と、第二の電極部と垂直である前記発熱体と接続の部分とを含み、
前記第二の金属板の前記発熱体と接続の部分の面内方向は、前記第一の金属板の前記発熱体と接触の部分の面内方向と平行し、
前記第二の金属板の前記第二の電極部は、前記第一の金属板の囲繞部に囲繞されることを特徴とする請求項1に記載の放熱フレーム構造。 - 前記プラスチック合成物は、固定溝を有するように形成されることを特徴とする請求項1に記載の放熱フレーム構造。
- 前記プラスチック合成物は、固定穴を有するように形成されることを特徴とする請求項1に記載の放熱フレーム構造。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104128119 | 2015-08-27 | ||
TW104128119A TWI532953B (zh) | 2015-08-27 | 2015-08-27 | Cooling stent structure and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017045986A JP2017045986A (ja) | 2017-03-02 |
JP6251908B2 true JP6251908B2 (ja) | 2017-12-27 |
Family
ID=55641544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016156733A Active JP6251908B2 (ja) | 2015-08-27 | 2016-08-09 | 放熱フレーム構造及びそれの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10690333B2 (ja) |
EP (1) | EP3136458B1 (ja) |
JP (1) | JP6251908B2 (ja) |
CN (1) | CN106486591B (ja) |
TW (1) | TWI532953B (ja) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6086878A (ja) * | 1983-10-18 | 1985-05-16 | Sumitomo Electric Ind Ltd | 光素子パツケ−ジ |
JPS60192462U (ja) * | 1984-05-31 | 1985-12-20 | 日本デンヨ−株式会社 | Ledランプ |
JP3743186B2 (ja) * | 1998-12-15 | 2006-02-08 | 松下電工株式会社 | 発光ダイオード |
US6552368B2 (en) * | 2000-09-29 | 2003-04-22 | Omron Corporation | Light emission device |
JP2002176203A (ja) * | 2000-09-29 | 2002-06-21 | Omron Corp | 発光デバイス及び発光デバイスアレイ |
CA2427559A1 (en) * | 2002-05-15 | 2003-11-15 | Sumitomo Electric Industries, Ltd. | White color light emitting device |
US7531844B2 (en) * | 2002-09-30 | 2009-05-12 | Sanyo Electric Co., Ltd. | Light emitting element |
JP4359195B2 (ja) * | 2004-06-11 | 2009-11-04 | 株式会社東芝 | 半導体発光装置及びその製造方法並びに半導体発光ユニット |
US7816698B2 (en) * | 2007-04-13 | 2010-10-19 | Industrial Technology Research Institute | Heat dissipation package for heat generation element |
KR101365621B1 (ko) * | 2007-09-04 | 2014-02-24 | 서울반도체 주식회사 | 열 방출 슬러그들을 갖는 발광 다이오드 패키지 |
TWI352439B (en) * | 2007-09-21 | 2011-11-11 | Lite On Technology Corp | Light emitting diode packaging device, heat-dissip |
TWM342619U (en) * | 2008-03-14 | 2008-10-11 | Qiao-En Huang | Light emitting body structure |
CN201408782Y (zh) | 2009-04-10 | 2010-02-17 | 珠海市宏科光电子有限公司 | 功率型发光二极管 |
JP5569558B2 (ja) * | 2012-06-06 | 2014-08-13 | 第一精工株式会社 | 電気部品用ハウジング |
TWI497781B (zh) * | 2012-07-19 | 2015-08-21 | Univ Nat Cheng Kung | 具提升散熱效果之發光二極體裝置及其製備方法 |
TWM448624U (zh) | 2012-11-09 | 2013-03-11 | Amphenol Ltw Technology Co Ltd | 發光二極體燈泡結構 |
CN203932098U (zh) | 2013-10-28 | 2014-11-05 | 比亚迪股份有限公司 | 一种led支架及led封装结构 |
-
2015
- 2015-08-27 TW TW104128119A patent/TWI532953B/zh active
-
2016
- 2016-06-13 CN CN201610410658.9A patent/CN106486591B/zh active Active
- 2016-07-13 US US15/208,803 patent/US10690333B2/en active Active
- 2016-08-05 EP EP16183026.0A patent/EP3136458B1/en active Active
- 2016-08-09 JP JP2016156733A patent/JP6251908B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN106486591A (zh) | 2017-03-08 |
CN106486591B (zh) | 2018-10-02 |
TW201602499A (zh) | 2016-01-16 |
US10690333B2 (en) | 2020-06-23 |
US20170059146A1 (en) | 2017-03-02 |
EP3136458A1 (en) | 2017-03-01 |
EP3136458B1 (en) | 2019-05-08 |
TWI532953B (zh) | 2016-05-11 |
JP2017045986A (ja) | 2017-03-02 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |