JP6249618B2 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP6249618B2
JP6249618B2 JP2013063935A JP2013063935A JP6249618B2 JP 6249618 B2 JP6249618 B2 JP 6249618B2 JP 2013063935 A JP2013063935 A JP 2013063935A JP 2013063935 A JP2013063935 A JP 2013063935A JP 6249618 B2 JP6249618 B2 JP 6249618B2
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lower body
substrate
main body
outside
discharge pipe
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JP2013063935A
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English (en)
Japanese (ja)
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JP2013207304A (ja
Inventor
ユ・ハン・キル
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Tera Semicon Corp
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Tera Semicon Corp
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Publication of JP2013207304A publication Critical patent/JP2013207304A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
JP2013063935A 2012-03-27 2013-03-26 基板処理装置 Active JP6249618B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0031327 2012-03-27
KR1020120031327A KR101356208B1 (ko) 2012-03-27 2012-03-27 기판 처리 장치

Publications (2)

Publication Number Publication Date
JP2013207304A JP2013207304A (ja) 2013-10-07
JP6249618B2 true JP6249618B2 (ja) 2017-12-20

Family

ID=49368282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013063935A Active JP6249618B2 (ja) 2012-03-27 2013-03-26 基板処理装置

Country Status (4)

Country Link
JP (1) JP6249618B2 (zh)
KR (1) KR101356208B1 (zh)
CN (1) CN103367205B (zh)
TW (1) TWI569302B (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3342803B2 (ja) * 1996-05-30 2002-11-11 東京エレクトロン株式会社 処理装置及び基板搬送方法
KR100273230B1 (ko) * 1997-09-29 2001-01-15 김영환 반도체 공정용 종형 확산로 및 그 운전방법
JP4876322B2 (ja) * 2001-03-30 2012-02-15 東京エレクトロン株式会社 ロードロック室、その排気方法及び熱処理装置
JP2004103990A (ja) * 2002-09-12 2004-04-02 Hitachi Kokusai Electric Inc 半導体製造装置および半導体装置の製造方法
JP4860373B2 (ja) * 2005-09-21 2012-01-25 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP2008078448A (ja) * 2006-09-22 2008-04-03 Hitachi Kokusai Electric Inc 基板処理装置
JP4438850B2 (ja) * 2006-10-19 2010-03-24 東京エレクトロン株式会社 処理装置、このクリーニング方法及び記憶媒体
JP2011187543A (ja) * 2010-03-05 2011-09-22 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2012004408A (ja) * 2010-06-18 2012-01-05 Tokyo Electron Ltd 支持体構造及び処理装置

Also Published As

Publication number Publication date
CN103367205B (zh) 2017-05-10
KR20130109541A (ko) 2013-10-08
KR101356208B1 (ko) 2014-01-29
TW201403660A (zh) 2014-01-16
CN103367205A (zh) 2013-10-23
TWI569302B (zh) 2017-02-01
JP2013207304A (ja) 2013-10-07

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