KR101356208B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR101356208B1
KR101356208B1 KR1020120031327A KR20120031327A KR101356208B1 KR 101356208 B1 KR101356208 B1 KR 101356208B1 KR 1020120031327 A KR1020120031327 A KR 1020120031327A KR 20120031327 A KR20120031327 A KR 20120031327A KR 101356208 B1 KR101356208 B1 KR 101356208B1
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KR
South Korea
Prior art keywords
lower body
substrate
outside
discharge pipe
boat
Prior art date
Application number
KR1020120031327A
Other languages
English (en)
Korean (ko)
Other versions
KR20130109541A (ko
Inventor
유한길
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to KR1020120031327A priority Critical patent/KR101356208B1/ko
Priority to JP2013063935A priority patent/JP6249618B2/ja
Priority to TW102110655A priority patent/TWI569302B/zh
Priority to CN201310102266.2A priority patent/CN103367205B/zh
Publication of KR20130109541A publication Critical patent/KR20130109541A/ko
Application granted granted Critical
Publication of KR101356208B1 publication Critical patent/KR101356208B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020120031327A 2012-03-27 2012-03-27 기판 처리 장치 KR101356208B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020120031327A KR101356208B1 (ko) 2012-03-27 2012-03-27 기판 처리 장치
JP2013063935A JP6249618B2 (ja) 2012-03-27 2013-03-26 基板処理装置
TW102110655A TWI569302B (zh) 2012-03-27 2013-03-26 用於加工基材之裝置
CN201310102266.2A CN103367205B (zh) 2012-03-27 2013-03-27 基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120031327A KR101356208B1 (ko) 2012-03-27 2012-03-27 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20130109541A KR20130109541A (ko) 2013-10-08
KR101356208B1 true KR101356208B1 (ko) 2014-01-29

Family

ID=49368282

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120031327A KR101356208B1 (ko) 2012-03-27 2012-03-27 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP6249618B2 (zh)
KR (1) KR101356208B1 (zh)
CN (1) CN103367205B (zh)
TW (1) TWI569302B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320915A (ja) * 1996-05-30 1997-12-12 Tokyo Electron Ltd 処理装置
KR100273230B1 (ko) * 1997-09-29 2001-01-15 김영환 반도체 공정용 종형 확산로 및 그 운전방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4876322B2 (ja) * 2001-03-30 2012-02-15 東京エレクトロン株式会社 ロードロック室、その排気方法及び熱処理装置
JP2004103990A (ja) * 2002-09-12 2004-04-02 Hitachi Kokusai Electric Inc 半導体製造装置および半導体装置の製造方法
JP4860373B2 (ja) * 2005-09-21 2012-01-25 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP2008078448A (ja) * 2006-09-22 2008-04-03 Hitachi Kokusai Electric Inc 基板処理装置
JP4438850B2 (ja) * 2006-10-19 2010-03-24 東京エレクトロン株式会社 処理装置、このクリーニング方法及び記憶媒体
JP2011187543A (ja) * 2010-03-05 2011-09-22 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2012004408A (ja) * 2010-06-18 2012-01-05 Tokyo Electron Ltd 支持体構造及び処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09320915A (ja) * 1996-05-30 1997-12-12 Tokyo Electron Ltd 処理装置
KR100273230B1 (ko) * 1997-09-29 2001-01-15 김영환 반도체 공정용 종형 확산로 및 그 운전방법

Also Published As

Publication number Publication date
TWI569302B (zh) 2017-02-01
CN103367205B (zh) 2017-05-10
TW201403660A (zh) 2014-01-16
JP6249618B2 (ja) 2017-12-20
KR20130109541A (ko) 2013-10-08
JP2013207304A (ja) 2013-10-07
CN103367205A (zh) 2013-10-23

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