JP6244646B2 - 熱交換器 - Google Patents

熱交換器 Download PDF

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Publication number
JP6244646B2
JP6244646B2 JP2013089761A JP2013089761A JP6244646B2 JP 6244646 B2 JP6244646 B2 JP 6244646B2 JP 2013089761 A JP2013089761 A JP 2013089761A JP 2013089761 A JP2013089761 A JP 2013089761A JP 6244646 B2 JP6244646 B2 JP 6244646B2
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Japan
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group
heat exchanger
flow path
cylindrical
wall
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JP2013089761A
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Japanese (ja)
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JP2014204111A (ja
JP2014204111A5 (https=
Inventor
伸季 睦月
伸季 睦月
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Mutsuki Electric KK
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Mutsuki Electric KK
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013089761A 2013-04-04 2013-04-04 熱交換器 Active JP6244646B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013089761A JP6244646B2 (ja) 2013-04-04 2013-04-04 熱交換器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013089761A JP6244646B2 (ja) 2013-04-04 2013-04-04 熱交換器

Publications (3)

Publication Number Publication Date
JP2014204111A JP2014204111A (ja) 2014-10-27
JP2014204111A5 JP2014204111A5 (https=) 2016-05-19
JP6244646B2 true JP6244646B2 (ja) 2017-12-13

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JP2013089761A Active JP6244646B2 (ja) 2013-04-04 2013-04-04 熱交換器

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JP (1) JP6244646B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6519365B2 (ja) * 2015-07-07 2019-05-29 富士通株式会社 接合体、接合体の製造方法、冷却システム、及び情報処理装置
JP6712915B2 (ja) * 2015-07-08 2020-06-24 株式会社フジクラ コールドプレート
JP6465943B1 (ja) * 2017-10-04 2019-02-06 三菱電機株式会社 ヒートシンクおよび半導体モジュール
KR102570354B1 (ko) * 2019-05-28 2023-08-25 미쯔이가가꾸가부시끼가이샤 냉각 장치 및 냉각 장치의 제조 방법
JP2023108534A (ja) * 2022-01-25 2023-08-04 三井化学株式会社 温度制御装置
WO2023145290A1 (ja) * 2022-01-26 2023-08-03 三井化学株式会社 温度制御装置及び温度制御装置の製造方法
JP2023118536A (ja) * 2022-02-15 2023-08-25 三井化学株式会社 温度制御装置
DE102024200840A1 (de) * 2024-01-30 2025-07-31 Volkswagen Aktiengesellschaft Verfahren zur Herstellung einer Einheit aus mindestens einem Leistungsmodul und einem mit Kühlmittel durchströmten Kühlkörper und Einheit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701554B1 (fr) * 1993-02-12 1995-05-12 Transcal Echangeur de chaleur pour composants électroniques et appareillages électro-techniques.
FR2759243B1 (fr) * 1997-02-03 1999-04-30 Ferraz Echangeur de chaleur pour composants electroniques et appareillages electrotechniques
KR100456342B1 (ko) * 2002-02-08 2004-11-12 쿨랜스코리아 주식회사 반도체 칩의 수냉식 냉각 블록
JP4225310B2 (ja) * 2004-11-11 2009-02-18 株式会社デンソー 半導体装置
JP5094045B2 (ja) * 2005-11-09 2012-12-12 大成プラス株式会社 冷却機能を有する電子回路装置とその製造方法
JP5339078B2 (ja) * 2009-07-09 2013-11-13 睦月電機株式会社 金属端子付き封口板
JP2011119250A (ja) * 2009-11-05 2011-06-16 Mutsuki Denki Kk コイン型電解質電池
JP2012049483A (ja) * 2010-08-25 2012-03-08 Nakamura Mfg Co Ltd 放熱装置
JP2012104789A (ja) * 2010-11-11 2012-05-31 Mutsuki Denki Kk 電解コンデンサ用封口体およびその封口体を用いた電解コンデンサ
JP5642022B2 (ja) * 2011-06-17 2014-12-17 カルソニックカンセイ株式会社 半導体装置および半導体装置の製造方法
JP5729215B2 (ja) * 2011-08-22 2015-06-03 トヨタ自動車株式会社 冷却器及びその製造方法

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Publication number Publication date
JP2014204111A (ja) 2014-10-27

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