JP6240147B2 - 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 - Google Patents

感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 Download PDF

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JP6240147B2
JP6240147B2 JP2015500248A JP2015500248A JP6240147B2 JP 6240147 B2 JP6240147 B2 JP 6240147B2 JP 2015500248 A JP2015500248 A JP 2015500248A JP 2015500248 A JP2015500248 A JP 2015500248A JP 6240147 B2 JP6240147 B2 JP 6240147B2
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structural unit
resin composition
photosensitive resin
carbon atoms
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JPWO2014126088A1 (ja
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知樹 松田
知樹 松田
大助 柏木
大助 柏木
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Fujifilm Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
JP2015500248A 2013-02-13 2014-02-12 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置 Active JP6240147B2 (ja)

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JP2013025368 2013-02-13
JP2013025368 2013-02-13
PCT/JP2014/053153 WO2014126088A1 (ja) 2013-02-13 2014-02-12 感光性樹脂組成物、これを用いた硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置

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JP6240147B2 true JP6240147B2 (ja) 2017-11-29

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JP (1) JP6240147B2 (zh)
KR (1) KR20150103210A (zh)
CN (1) CN104995560B (zh)
TW (1) TWI624719B (zh)
WO (1) WO2014126088A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034518A1 (ja) * 2022-08-10 2024-02-15 株式会社レゾナック 重合体エマルジョンならびに該重合体エマルジョンを用いた一液系熱硬化性樹脂組成物、二液系熱硬化性樹脂組成物、塗料、樹脂硬化膜および塗膜

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JP6241267B2 (ja) * 2013-12-25 2017-12-06 Jsr株式会社 感放射線性樹脂組成物及びレジストパターン形成方法
JP2016071243A (ja) * 2014-09-30 2016-05-09 富士フイルム株式会社 樹脂パターンの形成方法、パターンの形成方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、及び、タッチパネル表示装置
JP6680966B2 (ja) * 2016-12-16 2020-04-15 Ｋｊケミカルズ株式会社 （メタ）アクリロイル基を有する多環式カルボキサミド
JP6921382B2 (ja) * 2017-05-25 2021-08-18 日油株式会社 フレキシブルデバイス用レジスト樹脂
JP7189875B2 (ja) * 2017-08-03 2022-12-14 昭和電工株式会社 感光性樹脂組成物
TW202035593A (zh) * 2019-01-21 2020-10-01 日商日產化學股份有限公司 具有縮醛構造及醯胺構造之保護膜形成組成物
JP7445198B2 (ja) 2019-02-25 2024-03-07 日産化学株式会社 マイクロレンズ用感光性樹脂組成物

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JP2008040180A (ja) * 2006-08-07 2008-02-21 Tokyo Ohka Kogyo Co Ltd 層間絶縁膜用感光性樹脂組成物
JP2009288343A (ja) * 2008-05-27 2009-12-10 Fujifilm Corp ポジ型レジスト組成物、及び該組成物を用いたパターン形成方法
JP5623896B2 (ja) * 2010-01-15 2014-11-12 富士フイルム株式会社 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
KR101618897B1 (ko) * 2010-01-20 2016-05-09 후지필름 가부시키가이샤 경화막의 제조 방법, 감광성 수지 조성물, 경화 막, 유기 ｅｌ 표시 장치, 및 액정 표시 장치
WO2011096400A1 (ja) * 2010-02-02 2011-08-11 日産化学工業株式会社 ポジ型感光性樹脂組成物及び撥液性被膜
JP5291744B2 (ja) * 2010-11-02 2013-09-18 富士フイルム株式会社 エッチングレジスト用感光性樹脂組成物、パターン作製方法、ｍｅｍｓ構造体及びその作製方法、ドライエッチング方法、ウェットエッチング方法、ｍｅｍｓシャッターデバイス、並びに、画像表示装置
TWI557508B (zh) * 2010-12-13 2016-11-11 富士軟片股份有限公司 正型感光性樹脂組成物、硬化膜及其形成方法、層間絕緣膜以及顯示裝置
JP5313285B2 (ja) * 2011-03-29 2013-10-09 富士フイルム株式会社 ポジ型感光性樹脂組成物、パターン作製方法、ｍｅｍｓ構造体及びその作製方法、ドライエッチング方法、ウェットエッチング方法、ｍｅｍｓシャッターデバイス、並びに、画像表示装置
JP6094050B2 (ja) * 2011-04-15 2017-03-15 住友化学株式会社 着色感光性樹脂組成物
JP6043716B2 (ja) * 2011-05-20 2016-12-14 メルク パテント ゲーエムベーハー ポジ型感光性シロキサン組成物
JP5298222B2 (ja) * 2011-07-28 2013-09-25 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、これを用いた感活性光線性又は感放射線性膜、及び、パターン形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024034518A1 (ja) * 2022-08-10 2024-02-15 株式会社レゾナック 重合体エマルジョンならびに該重合体エマルジョンを用いた一液系熱硬化性樹脂組成物、二液系熱硬化性樹脂組成物、塗料、樹脂硬化膜および塗膜

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TWI624719B (zh) 2018-05-21
WO2014126088A1 (ja) 2014-08-21
JPWO2014126088A1 (ja) 2017-02-02
CN104995560B (zh) 2020-01-07
KR20150103210A (ko) 2015-09-09
TW201437745A (zh) 2014-10-01

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