JP6224252B2 - 標的処理ユニット - Google Patents

標的処理ユニット Download PDF

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Publication number
JP6224252B2
JP6224252B2 JP2016539575A JP2016539575A JP6224252B2 JP 6224252 B2 JP6224252 B2 JP 6224252B2 JP 2016539575 A JP2016539575 A JP 2016539575A JP 2016539575 A JP2016539575 A JP 2016539575A JP 6224252 B2 JP6224252 B2 JP 6224252B2
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Japan
Prior art keywords
conduit
processing unit
projection lens
lens assembly
guide
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JP2016539575A
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English (en)
Japanese (ja)
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JP2016530728A (ja
JP2016530728A5 (enExample
Inventor
コニング、ヨハン・ヨースト
ファン・デン・ベルゲン、ダビド・ヨハンネス
Original Assignee
マッパー・リソグラフィー・アイピー・ビー．ブイ．
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
JP2016539575A 2013-09-07 2014-09-08 標的処理ユニット Active JP6224252B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361875016P 2013-09-07 2013-09-07
US61/875,016 2013-09-07
PCT/EP2014/069116 WO2015032955A1 (en) 2013-09-07 2014-09-08 Target processing unit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017129332A Division JP6580634B2 (ja) 2013-09-07 2017-06-30 標的処理ユニット

Publications (3)

Publication Number Publication Date
JP2016530728A JP2016530728A (ja) 2016-09-29
JP2016530728A5 JP2016530728A5 (enExample) 2017-02-09
JP6224252B2 true JP6224252B2 (ja) 2017-11-01

Family

ID=51492355

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016539575A Active JP6224252B2 (ja) 2013-09-07 2014-09-08 標的処理ユニット
JP2017129332A Active JP6580634B2 (ja) 2013-09-07 2017-06-30 標的処理ユニット

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017129332A Active JP6580634B2 (ja) 2013-09-07 2017-06-30 標的処理ユニット

Country Status (6)

Country Link
US (2) US9263234B2 (enExample)
JP (2) JP6224252B2 (enExample)
KR (2) KR102124913B1 (enExample)
CN (2) CN105745577B (enExample)
NL (2) NL2013437B1 (enExample)
WO (1) WO2015032955A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6189303B2 (ja) * 2011-09-12 2017-08-30 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板処理装置
CN105190824B (zh) * 2013-05-10 2016-11-23 株式会社日立高新技术 带电粒子线装置
DE102016217285A1 (de) * 2016-09-12 2018-03-15 Carl Zeiss Smt Gmbh Vorrichtung zur übertragung von elektrischen signalen sowie lithographieanlage
US11106145B2 (en) * 2016-10-17 2021-08-31 Nikon Corporation Exposure system and lithography system
US10905025B1 (en) * 2019-06-12 2021-01-26 Facebook, Inc. Interconnection module and server rack
CN111239916B (zh) * 2020-02-12 2021-05-18 烽火通信科技股份有限公司 光纤背板上光纤连接器用的清洁工具及清洁方法
KR102467191B1 (ko) * 2020-03-11 2022-11-16 주식회사 포스코 광 점퍼 코드 안전 장치 및 그를 이용한 전력 계통 시스템
CN113495436B (zh) * 2021-07-13 2023-12-29 江门市和盈新材料科技有限公司 一种光电子元件智能制造的光刻机
EP4290550A1 (en) * 2022-06-10 2023-12-13 ASML Netherlands B.V. Electron-optical device
WO2025058838A1 (en) * 2023-09-12 2025-03-20 Lam Research Corporation Prevention of atmosphere exposure in gas delivery system

Family Cites Families (26)

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US4831270A (en) * 1987-05-21 1989-05-16 Ion Implant Services Ion implantation apparatus
US5250808A (en) * 1987-05-21 1993-10-05 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal system for an environmental scanning electron microscope
KR20000016498A (ko) * 1996-06-10 2000-03-25 다니엘 제이. 설리반 생산환경을 위한 홀로그래픽 패터닝방법 및 공구
US6714278B2 (en) * 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
US6756706B2 (en) * 2002-01-18 2004-06-29 Nikon Corporation Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
JP2004055933A (ja) * 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2005106166A (ja) 2003-09-30 2005-04-21 Nikon Corp アクティブ除振装置及び露光装置
JP2005209702A (ja) * 2004-01-20 2005-08-04 Fujitsu Access Ltd 電子機器用キャビネット
JP4405867B2 (ja) * 2004-06-29 2010-01-27 キヤノン株式会社 電子線露光装置、および、デバイス製造方法
JP2006079911A (ja) * 2004-09-09 2006-03-23 Hitachi High-Technologies Corp 電子ビーム電流計測方法、電子ビーム描画装置および電子ビーム検出器
CN102017052B (zh) 2008-02-26 2013-09-04 迈普尔平版印刷Ip有限公司 投影透镜装置
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
NL1036912C2 (en) * 2009-04-29 2010-11-01 Mapper Lithography Ip Bv Charged particle optical system comprising an electrostatic deflector.
NL2003619C2 (en) 2009-10-09 2011-04-12 Mapper Lithography Ip Bv Projection lens assembly.
US8362441B2 (en) * 2009-10-09 2013-01-29 Mapper Lithography Ip B.V. Enhanced integrity projection lens assembly
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs
JP5579278B2 (ja) 2010-02-23 2014-08-27 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
WO2012080278A1 (en) * 2010-12-14 2012-06-21 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
JP6038882B2 (ja) 2011-04-20 2016-12-07 マッパー・リソグラフィー・アイピー・ビー．ブイ． 光ファイバの構成体及びこのような構成体を形成する方法
NL2007392C2 (en) 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
TW201337469A (zh) 2011-09-12 2013-09-16 Mapper Lithography Ip Bv 具有基底板之真空腔室
JP6189303B2 (ja) * 2011-09-12 2017-08-30 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板処理装置
WO2013171216A1 (en) * 2012-05-14 2013-11-21 Mapper Lithography Ip B.V. Charged particle multi-beamlet lithography system and cooling arrangement manufacturing method
JP5936484B2 (ja) * 2012-08-20 2016-06-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法

Also Published As

Publication number Publication date
NL2013437A (en) 2015-03-10
CN107272352A (zh) 2017-10-20
JP6580634B2 (ja) 2019-09-25
NL2013438B1 (en) 2016-05-18
CN105745577A (zh) 2016-07-06
CN107272352B (zh) 2021-02-02
US9263234B2 (en) 2016-02-16
WO2015032955A1 (en) 2015-03-12
CN105745577B (zh) 2018-01-23
US9941093B2 (en) 2018-04-10
KR20170087970A (ko) 2017-07-31
KR20160055852A (ko) 2016-05-18
JP2016530728A (ja) 2016-09-29
US20150090895A1 (en) 2015-04-02
KR101784752B1 (ko) 2017-11-06
NL2013437B1 (en) 2016-05-18
US20160126055A1 (en) 2016-05-05
KR102124913B1 (ko) 2020-06-22
JP2017224828A (ja) 2017-12-21
NL2013438A (en) 2015-03-10

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