KR102124913B1 - 타겟 프로세싱 유닛 - Google Patents

타겟 프로세싱 유닛 Download PDF

Info

Publication number
KR102124913B1
KR102124913B1 KR1020177020391A KR20177020391A KR102124913B1 KR 102124913 B1 KR102124913 B1 KR 102124913B1 KR 1020177020391 A KR1020177020391 A KR 1020177020391A KR 20177020391 A KR20177020391 A KR 20177020391A KR 102124913 B1 KR102124913 B1 KR 102124913B1
Authority
KR
South Korea
Prior art keywords
conduits
vacuum chamber
casing
processing unit
target processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177020391A
Other languages
English (en)
Korean (ko)
Other versions
KR20170087970A (ko
Inventor
조한 주스트 코닝
데이비드 조한네스 반 덴 베르겐
Original Assignee
에이에스엠엘 네델란즈 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스엠엘 네델란즈 비.브이. filed Critical 에이에스엠엘 네델란즈 비.브이.
Publication of KR20170087970A publication Critical patent/KR20170087970A/ko
Application granted granted Critical
Publication of KR102124913B1 publication Critical patent/KR102124913B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002—Details
    • H01J37/3007—Electron or ion-optical systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70975—Assembly, maintenance, transport or storage of apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/10—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/20—Means for supporting or positioning the object or the material; Means for adjusting diaphragms or lenses associated with the support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • General Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
KR1020177020391A 2013-09-07 2014-09-08 타겟 프로세싱 유닛 Active KR102124913B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361875016P 2013-09-07 2013-09-07
US61/875,016 2013-09-07
PCT/EP2014/069116 WO2015032955A1 (en) 2013-09-07 2014-09-08 Target processing unit

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167009273A Division KR101784752B1 (ko) 2013-09-07 2014-09-08 타겟 프로세싱 유닛

Publications (2)

Publication Number Publication Date
KR20170087970A KR20170087970A (ko) 2017-07-31
KR102124913B1 true KR102124913B1 (ko) 2020-06-22

Family

ID=51492355

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177020391A Active KR102124913B1 (ko) 2013-09-07 2014-09-08 타겟 프로세싱 유닛
KR1020167009273A Active KR101784752B1 (ko) 2013-09-07 2014-09-08 타겟 프로세싱 유닛

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167009273A Active KR101784752B1 (ko) 2013-09-07 2014-09-08 타겟 프로세싱 유닛

Country Status (6)

Country Link
US (2) US9263234B2 (enExample)
JP (2) JP6224252B2 (enExample)
KR (2) KR102124913B1 (enExample)
CN (2) CN105745577B (enExample)
NL (2) NL2013437B1 (enExample)
WO (1) WO2015032955A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6189303B2 (ja) * 2011-09-12 2017-08-30 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板処理装置
CN105190824B (zh) * 2013-05-10 2016-11-23 株式会社日立高新技术 带电粒子线装置
DE102016217285A1 (de) * 2016-09-12 2018-03-15 Carl Zeiss Smt Gmbh Vorrichtung zur übertragung von elektrischen signalen sowie lithographieanlage
US11106145B2 (en) * 2016-10-17 2021-08-31 Nikon Corporation Exposure system and lithography system
US10905025B1 (en) * 2019-06-12 2021-01-26 Facebook, Inc. Interconnection module and server rack
CN111239916B (zh) * 2020-02-12 2021-05-18 烽火通信科技股份有限公司 光纤背板上光纤连接器用的清洁工具及清洁方法
KR102467191B1 (ko) * 2020-03-11 2022-11-16 주식회사 포스코 광 점퍼 코드 안전 장치 및 그를 이용한 전력 계통 시스템
CN113495436B (zh) * 2021-07-13 2023-12-29 江门市和盈新材料科技有限公司 一种光电子元件智能制造的光刻机
EP4290550A1 (en) * 2022-06-10 2023-12-13 ASML Netherlands B.V. Electron-optical device
WO2025058838A1 (en) * 2023-09-12 2025-03-20 Lam Research Corporation Prevention of atmosphere exposure in gas delivery system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055933A (ja) 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2006013388A (ja) 2004-06-29 2006-01-12 Canon Inc 電子線露光装置、および、デバイス製造方法
US20130043413A1 (en) 2011-04-20 2013-02-21 Mapper Lithography Ip B.V. Arrangement of optical fibers, and a method of forming such arrangement

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4831270A (en) * 1987-05-21 1989-05-16 Ion Implant Services Ion implantation apparatus
US5250808A (en) * 1987-05-21 1993-10-05 Electroscan Corporation Integrated electron optical/differential pumping/imaging signal system for an environmental scanning electron microscope
KR20000016498A (ko) * 1996-06-10 2000-03-25 다니엘 제이. 설리반 생산환경을 위한 홀로그래픽 패터닝방법 및 공구
US6714278B2 (en) * 1996-11-25 2004-03-30 Nikon Corporation Exposure apparatus
TWI220998B (en) * 2001-02-13 2004-09-11 Nikon Corp Exposure method, exposure apparatus and manufacture method of the same
US6756706B2 (en) * 2002-01-18 2004-06-29 Nikon Corporation Method and apparatus for cooling power supply wires used to drive stages in electron beam lithography machines
JP2005106166A (ja) 2003-09-30 2005-04-21 Nikon Corp アクティブ除振装置及び露光装置
JP2005209702A (ja) * 2004-01-20 2005-08-04 Fujitsu Access Ltd 電子機器用キャビネット
JP2006079911A (ja) * 2004-09-09 2006-03-23 Hitachi High-Technologies Corp 電子ビーム電流計測方法、電子ビーム描画装置および電子ビーム検出器
CN102017052B (zh) 2008-02-26 2013-09-04 迈普尔平版印刷Ip有限公司 投影透镜装置
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
NL1036912C2 (en) * 2009-04-29 2010-11-01 Mapper Lithography Ip Bv Charged particle optical system comprising an electrostatic deflector.
NL2003619C2 (en) 2009-10-09 2011-04-12 Mapper Lithography Ip Bv Projection lens assembly.
US8362441B2 (en) * 2009-10-09 2013-01-29 Mapper Lithography Ip B.V. Enhanced integrity projection lens assembly
US8638109B2 (en) * 2009-12-31 2014-01-28 Mapper Lithography Ip B.V. Capacitive sensing system with differential pairs
JP5579278B2 (ja) 2010-02-23 2014-08-27 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
WO2012080278A1 (en) * 2010-12-14 2012-06-21 Mapper Lithography Ip B.V. Lithography system and method of processing substrates in such a lithography system
NL2007392C2 (en) 2011-09-12 2013-03-13 Mapper Lithography Ip Bv Assembly for providing an aligned stack of two or more modules and a lithography system or a microscopy system comprising such an assembly.
TW201337469A (zh) 2011-09-12 2013-09-16 Mapper Lithography Ip Bv 具有基底板之真空腔室
JP6189303B2 (ja) * 2011-09-12 2017-08-30 マッパー・リソグラフィー・アイピー・ビー．ブイ． 基板処理装置
WO2013171216A1 (en) * 2012-05-14 2013-11-21 Mapper Lithography Ip B.V. Charged particle multi-beamlet lithography system and cooling arrangement manufacturing method
JP5936484B2 (ja) * 2012-08-20 2016-06-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置及び試料観察方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004055933A (ja) 2002-07-22 2004-02-19 Advantest Corp 電子ビーム露光装置、及び電子ビーム計測モジュール
JP2006013388A (ja) 2004-06-29 2006-01-12 Canon Inc 電子線露光装置、および、デバイス製造方法
US20130043413A1 (en) 2011-04-20 2013-02-21 Mapper Lithography Ip B.V. Arrangement of optical fibers, and a method of forming such arrangement

Also Published As

Publication number Publication date
NL2013437A (en) 2015-03-10
CN107272352A (zh) 2017-10-20
JP6580634B2 (ja) 2019-09-25
NL2013438B1 (en) 2016-05-18
CN105745577A (zh) 2016-07-06
CN107272352B (zh) 2021-02-02
US9263234B2 (en) 2016-02-16
WO2015032955A1 (en) 2015-03-12
CN105745577B (zh) 2018-01-23
US9941093B2 (en) 2018-04-10
JP6224252B2 (ja) 2017-11-01
KR20170087970A (ko) 2017-07-31
KR20160055852A (ko) 2016-05-18
JP2016530728A (ja) 2016-09-29
US20150090895A1 (en) 2015-04-02
KR101784752B1 (ko) 2017-11-06
NL2013437B1 (en) 2016-05-18
US20160126055A1 (en) 2016-05-05
JP2017224828A (ja) 2017-12-21
NL2013438A (en) 2015-03-10

Similar Documents

Publication Publication Date Title
KR102124913B1 (ko) 타겟 프로세싱 유닛
NL2010624C2 (en) Cabinet for electronic equipment.
US11961627B2 (en) Vacuum chamber arrangement for charged particle beam generator
CN105874560B (zh) 电极堆栈布置
EP2681624B1 (en) Lithography system and method of processing substrates in such a lithography system
TWI604493B (zh) 帶電粒子微影系統和射束產生器
US12387903B2 (en) Aberration correction in charged particle system
JP6189303B2 (ja) 基板処理装置
NL2010502C2 (en) Fluid transfer system and substrate processing apparatus comprising the same.

Legal Events

Date Code Title Description
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20170720

Application number text: 1020167009273

Filing date: 20160407

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190903

Comment text: Request for Examination of Application

PN2301 Change of applicant

Patent event date: 20190909

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20191125

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20200319

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20200615

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20200616

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20250604

Start annual number: 6

End annual number: 6