JP6219384B2 - 光学および電子装置における熱管理 - Google Patents
光学および電子装置における熱管理 Download PDFInfo
- Publication number
- JP6219384B2 JP6219384B2 JP2015520234A JP2015520234A JP6219384B2 JP 6219384 B2 JP6219384 B2 JP 6219384B2 JP 2015520234 A JP2015520234 A JP 2015520234A JP 2015520234 A JP2015520234 A JP 2015520234A JP 6219384 B2 JP6219384 B2 JP 6219384B2
- Authority
- JP
- Japan
- Prior art keywords
- synthetic jet
- diaphragm
- thermal management
- management system
- spacer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
12 光源
14 熱管理システム
16 駆動電子装置
18 シンセティックジェット装置
20 ヒートシンク
22 通気スロットまたはホール
24 LED電源
26 シンセティックジェット電源
50 電気的なプロングまたは端子
54 ランプの電子装置
56 LED
58 熱管理電子装置(シンセティックジェット駆動電子装置)
60 スタック
62 冷却フィン
66 収容構造
68 基板またはボード
72 照明構造または光学部品
76 電子装置
78 熱伝導性圧縮パッド
86 ねじ込みベース
88 リフレクタ
90 ケージ
100 ダイアフラム
102 ホローフレームまたはスペーサ
104 オリフィス、開口
110 シム、シム材料
112 ワイヤ
114 圧電材料、圧電素子
116 対称軸
120 機械的クランプ装置
124 クランプ板
126 係合構造
128 圧縮性リング
130 ポスト
t1 厚み
t2 厚み
t3 厚み
Claims (7)
- 一つまたは複数の発熱電子部品と、
熱管理システム(14)であって、前記一つまたは複数の発熱電子部品と熱を伝導するヒートシンク(20)、および複数のシンセティック・ジェット・ダイアフラム(100)と、複数のスペーサ(102)と、前記複数のシンセティック・ジェット・ダイアフラム(100)、および、前記複数のスペーサ(102)が配置されたホルダ構成部と、を備える、スタックアセンブリであって、各一組のシンセティック・ジェット・ダイアフラム(100)が前記複数のスペーサ(102)の各スペーサ(102)により分けられて、各シンセティック・ジェットを形成し、また各スペーサ(102)が、前記シンセティック・ジェット・ダイアフラム(100)の動作中、空気が通り排出される開口(104)を有する、スタックアセンブリを備える、熱管理システム(14)と、
を備え、
各シンセティック・ジェットが、各スペーサにより分割される対応する上部ダイアフラムと下部ダイアフラムとを含むように、前記複数のシンセティック・ジェットは、前記複数のシンセティック・ジェット・ダイアフラム(100)と前記複数のスペーサ(102)とにより規定されており、
前記スタックアセンブリが、
前記ホルダ構成部の一つまたは複数の係合構造(126)と係合するように構成される少なくとも一つのクランプ板(124)と、
少なくとも一つのクランプ板(124)と前記スタックアセンブリとの間に配置された圧縮性リング(128)と、
を備える、
電子装置。 - 前記一つまたは複数の発熱電子部品が光源(12)を備える、請求項1に記載の電子装置。
- 前記ヒートシンク(20)が一つまたは複数の冷却フィン(62)を備え、
前記一つまたは複数のスペーサ(102)の前記各開口(104)が、前記一つまたは複数の冷却フィン(62)上を空気が流れるように配置された、請求項1または2に記載の電子装置。 - 前記熱管理システム(14)が、前記複数のシンセティック・ジェット・ダイアフラム(100)動作時に空気が動く一つまたは複数の通風スロットまたはホール(22)を備える、請求項1乃至3のいずれかに記載の電子装置。
- 前記一つまたは複数の発熱電子部品と前記ヒートシンク(20)との間に配置された熱伝導構造を備える、請求項1乃至4のいずれかに記載の電子装置。
- 各シンセティック・ジェット・ダイアフラム(100)の直径が25mm未満である請求項1乃至5のいずれかに記載の電子装置。
- 前記スタックアセンブリが前記電子装置のねじ込みベース(86)の中に配置されている、請求項1乃至6のいずれかに記載の電子装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/538,746 | 2012-06-29 | ||
US13/538,746 US9194575B2 (en) | 2012-06-29 | 2012-06-29 | Thermal management in optical and electronic devices |
PCT/US2013/044896 WO2014004056A1 (en) | 2012-06-29 | 2013-06-10 | Thermal management in optical and electronic devices |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015528183A JP2015528183A (ja) | 2015-09-24 |
JP2015528183A5 JP2015528183A5 (ja) | 2016-07-21 |
JP6219384B2 true JP6219384B2 (ja) | 2017-10-25 |
Family
ID=48703855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015520234A Expired - Fee Related JP6219384B2 (ja) | 2012-06-29 | 2013-06-10 | 光学および電子装置における熱管理 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9194575B2 (ja) |
JP (1) | JP6219384B2 (ja) |
KR (1) | KR102102006B1 (ja) |
CN (1) | CN104520641B (ja) |
DE (1) | DE112013003187T5 (ja) |
WO (1) | WO2014004056A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9891677B2 (en) * | 2014-09-11 | 2018-02-13 | Dell Products L.P. | Skin based system cooling using internal system fan |
US10669042B2 (en) * | 2014-10-23 | 2020-06-02 | Wet | Unmanned aerial vehicle with lighting and cooling therefor |
US10745126B2 (en) | 2015-12-28 | 2020-08-18 | Wet | Unmanned aerial system with transportable screen |
WO2017117291A1 (en) | 2015-12-28 | 2017-07-06 | Dezso Molnar | Tethered unmanned aerial system |
US11059601B2 (en) | 2015-12-28 | 2021-07-13 | Dezso Molnar | Water and lighting displays including unmanned aerial system |
KR102433594B1 (ko) | 2020-09-25 | 2022-08-18 | 국방과학연구소 | 온도 안정화 홀더 및 이를 이용하는 광학 부품 홀딩방법 |
WO2023014475A1 (en) * | 2021-08-04 | 2023-02-09 | Medtronic, Inc. | Thermal transfer system and method |
Family Cites Families (16)
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US3847211A (en) * | 1969-01-28 | 1974-11-12 | Sub Marine Syst Inc | Property interchange system for fluids |
US5749413A (en) * | 1991-09-23 | 1998-05-12 | Sundstrand Corporation | Heat exchanger for high power electrical component and package incorporating same |
US6123145A (en) | 1995-06-12 | 2000-09-26 | Georgia Tech Research Corporation | Synthetic jet actuators for cooling heated bodies and environments |
US6588497B1 (en) | 2002-04-19 | 2003-07-08 | Georgia Tech Research Corporation | System and method for thermal management by synthetic jet ejector channel cooling techniques |
JP4572548B2 (ja) * | 2004-03-18 | 2010-11-04 | ソニー株式会社 | 気体噴出装置 |
US20060196638A1 (en) | 2004-07-07 | 2006-09-07 | Georgia Tech Research Corporation | System and method for thermal management using distributed synthetic jet actuators |
US7932535B2 (en) | 2005-11-02 | 2011-04-26 | Nuventix, Inc. | Synthetic jet cooling system for LED module |
US8030886B2 (en) | 2005-12-21 | 2011-10-04 | Nuventix, Inc. | Thermal management of batteries using synthetic jets |
US8136767B2 (en) * | 2006-01-03 | 2012-03-20 | General Electric Company | Method and system for flow control with arrays of dual bimorph synthetic jet fluidic actuators |
US7633753B2 (en) * | 2007-09-27 | 2009-12-15 | Intel Corporation | Piezoelectric air jet augmented cooling for electronic devices |
US9478479B2 (en) | 2010-10-26 | 2016-10-25 | General Electric Company | Thermal management system and method |
US8881994B2 (en) * | 2009-12-16 | 2014-11-11 | General Electric Company | Low frequency synthetic jet actuator and method of manufacturing thereof |
US8695686B2 (en) * | 2010-01-07 | 2014-04-15 | General Electric Company | Method and apparatus for removing heat from electronic devices using synthetic jets |
US8564217B2 (en) | 2010-06-24 | 2013-10-22 | General Electric Company | Apparatus and method for reducing acoustical noise in synthetic jets |
JP5636923B2 (ja) * | 2010-12-03 | 2014-12-10 | 岩崎電気株式会社 | ランプ |
US8602607B2 (en) | 2010-10-21 | 2013-12-10 | General Electric Company | Lighting system with thermal management system having point contact synthetic jets |
-
2012
- 2012-06-29 US US13/538,746 patent/US9194575B2/en not_active Expired - Fee Related
-
2013
- 2013-06-10 DE DE112013003187.6T patent/DE112013003187T5/de not_active Withdrawn
- 2013-06-10 JP JP2015520234A patent/JP6219384B2/ja not_active Expired - Fee Related
- 2013-06-10 CN CN201380034542.4A patent/CN104520641B/zh not_active Expired - Fee Related
- 2013-06-10 WO PCT/US2013/044896 patent/WO2014004056A1/en active Application Filing
- 2013-06-10 KR KR1020157002064A patent/KR102102006B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
WO2014004056A1 (en) | 2014-01-03 |
US20140002990A1 (en) | 2014-01-02 |
KR102102006B1 (ko) | 2020-04-20 |
WO2014004056A8 (en) | 2015-02-05 |
US9194575B2 (en) | 2015-11-24 |
CN104520641B (zh) | 2018-07-03 |
JP2015528183A (ja) | 2015-09-24 |
KR20150034740A (ko) | 2015-04-03 |
DE112013003187T5 (de) | 2015-03-19 |
CN104520641A (zh) | 2015-04-15 |
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