JP6205527B2 - マグネトロンスパッタリング装置用の回転式カソードユニット - Google Patents
マグネトロンスパッタリング装置用の回転式カソードユニット Download PDFInfo
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- JP6205527B2 JP6205527B2 JP2017518765A JP2017518765A JP6205527B2 JP 6205527 B2 JP6205527 B2 JP 6205527B2 JP 2017518765 A JP2017518765 A JP 2017518765A JP 2017518765 A JP2017518765 A JP 2017518765A JP 6205527 B2 JP6205527 B2 JP 6205527B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
Description
Claims (2)
- 筒状のターゲットと、ターゲットを回転駆動する駆動ブロックと、流体を循環させる流体循環通路を有する流体循環手段とを備えるマグネトロンスパッタリング装置用の回転式カソードユニットであって、
駆動ブロックが、ターゲットの軸線方向に沿ってのびる内筒体と、内筒体と同心に配置されてターゲットの軸線方向一端が連結される外筒体と、この外筒体を回転駆動する駆動手段とを有し、内筒体の内部空間が流体循環通路の第1往路を構成すると共に、内筒体と外筒体との間の空間が流体循環通路の第1復路を構成し、ターゲットがその軸線方向に亘ってのびる管体に外挿され、管体内に、第1往路に連通する流体循環通路の第2往路と、第1復路に連通する流体循環通路の第2復路とが設けられるものにおいて、
ターゲットから駆動ブロックに向かう側を右側、駆動ブロックからターゲットに向かう側を左側として、外筒体の左側部分に、ターゲットの右端開口を閉塞する円盤状の規制板が固定され、規制板の右側の面に規制板の外縁から第1復路を臨む位置まで径方向にのびる連通路が形成されてこの連通路により第2復路と第1復路との間における流体の流れが規制され、連通路の径方向先端が鉛直方向下方を指向する規制板の姿勢を検出する検出手段を備えることを特徴とするマグネトロンスパッタリング装置用の回転式カソードユニット。 - 前記駆動手段は、モータとこのモータの駆動軸と外筒体の外周面との間に巻き掛けられるベルトとを備え、この駆動軸に設けられてベルトが巻き掛けられるプーリ―に付設したセンサで前記検知手段を構成したことを特徴とする請求項1記載のマグネトロンスパッタリング装置用の回転式カソードユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015102213 | 2015-05-19 | ||
JP2015102213 | 2015-05-19 | ||
PCT/JP2016/002409 WO2016185714A1 (ja) | 2015-05-19 | 2016-05-17 | マグネトロンスパッタリング装置用の回転式カソードユニット |
Publications (2)
Publication Number | Publication Date |
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JP6205527B2 true JP6205527B2 (ja) | 2017-09-27 |
JPWO2016185714A1 JPWO2016185714A1 (ja) | 2017-11-02 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2017518765A Active JP6205527B2 (ja) | 2015-05-19 | 2016-05-17 | マグネトロンスパッタリング装置用の回転式カソードユニット |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6205527B2 (ja) |
KR (1) | KR102053286B1 (ja) |
CN (1) | CN107614743B (ja) |
TW (1) | TWI634223B (ja) |
WO (1) | WO2016185714A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10727034B2 (en) * | 2017-08-16 | 2020-07-28 | Sputtering Components, Inc. | Magnetic force release for sputtering sources with magnetic target materials |
JP6552590B2 (ja) * | 2017-12-20 | 2019-07-31 | キヤノントッキ株式会社 | スパッタ装置及びその使用方法 |
WO2020079881A1 (ja) * | 2018-10-17 | 2020-04-23 | 株式会社アルバック | 接触式給電装置及び接触ユニット |
JP6646798B1 (ja) * | 2018-10-17 | 2020-02-14 | 株式会社アルバック | 接触式給電装置及び接触ユニット |
CN111455326A (zh) * | 2020-06-11 | 2020-07-28 | 中国航发航空科技股份有限公司 | 一种用于降低靶材冷却时间的真空电弧镀装置 |
KR20220139382A (ko) * | 2020-09-16 | 2022-10-14 | 가부시키가이샤 알박 | 회전식 캐소드 유닛용 구동 블록 |
CN116057199A (zh) * | 2020-10-08 | 2023-05-02 | 株式会社爱发科 | 旋转式阴极单元用的驱动块 |
Family Cites Families (12)
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JPH05230634A (ja) * | 1992-02-20 | 1993-09-07 | Kobe Steel Ltd | アークイオンプレーティング装置 |
CN2808932Y (zh) * | 2005-03-14 | 2006-08-23 | 深圳南玻南星玻璃加工有限公司 | 大功率溅射镀膜源 |
JP4110175B2 (ja) * | 2006-03-22 | 2008-07-02 | 株式会社神戸製鋼所 | アークイオンプレーティング方法 |
JP4641014B2 (ja) * | 2006-09-11 | 2011-03-02 | 新明和工業株式会社 | プラズマガンのチャンバへの取り付け構造 |
US20100078309A1 (en) * | 2007-01-26 | 2010-04-01 | Osaka Vacuum, Ltd. | Sputtering method and sputtering apparatus |
US20100200395A1 (en) * | 2009-02-06 | 2010-08-12 | Anton Dietrich | Techniques for depositing transparent conductive oxide coatings using dual C-MAG sputter apparatuses |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
EP2360290A1 (en) * | 2010-02-11 | 2011-08-24 | Applied Materials, Inc. | Method for producing an ITO layer and sputtering system |
JP2012149339A (ja) * | 2010-12-28 | 2012-08-09 | Canon Anelva Corp | スパッタリング装置、及び電子デバイスの製造方法 |
CN202181345U (zh) * | 2011-06-20 | 2012-04-04 | 肇庆市前沿真空设备有限公司 | 真空磁控溅射的旋转靶装置 |
KR101079621B1 (ko) * | 2011-06-30 | 2011-11-03 | 박경일 | 타겟과 백킹 플레이트의 비접착식 체결구조 |
WO2013076966A1 (ja) * | 2011-11-22 | 2013-05-30 | 株式会社神戸製鋼所 | プラズマ発生源及びこれを備えた真空プラズマ処理装置 |
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2016
- 2016-05-17 WO PCT/JP2016/002409 patent/WO2016185714A1/ja active Application Filing
- 2016-05-17 KR KR1020177036221A patent/KR102053286B1/ko active IP Right Grant
- 2016-05-17 JP JP2017518765A patent/JP6205527B2/ja active Active
- 2016-05-17 CN CN201680028805.4A patent/CN107614743B/zh active Active
- 2016-05-19 TW TW105115559A patent/TWI634223B/zh active
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Publication number | Publication date |
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TWI634223B (zh) | 2018-09-01 |
TW201708584A (zh) | 2017-03-01 |
KR20180006977A (ko) | 2018-01-19 |
KR102053286B1 (ko) | 2019-12-06 |
JPWO2016185714A1 (ja) | 2017-11-02 |
CN107614743A (zh) | 2018-01-19 |
CN107614743B (zh) | 2019-10-22 |
WO2016185714A1 (ja) | 2016-11-24 |
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