JP6200182B2 - 基板加熱装置及びはんだ付装置 - Google Patents

基板加熱装置及びはんだ付装置 Download PDF

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Publication number
JP6200182B2
JP6200182B2 JP2013072982A JP2013072982A JP6200182B2 JP 6200182 B2 JP6200182 B2 JP 6200182B2 JP 2013072982 A JP2013072982 A JP 2013072982A JP 2013072982 A JP2013072982 A JP 2013072982A JP 6200182 B2 JP6200182 B2 JP 6200182B2
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JP
Japan
Prior art keywords
substrate
temperature
heating
preheating
target temperature
Prior art date
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Active
Application number
JP2013072982A
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English (en)
Japanese (ja)
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JP2014197632A5 (enExample
JP2014197632A (ja
Inventor
和憲 大清水
和憲 大清水
昇 橋本
昇 橋本
直人 向井
直人 向井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Senju Metal Industry Co Ltd
Original Assignee
Denso Corp
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp, Senju Metal Industry Co Ltd filed Critical Denso Corp
Priority to JP2013072982A priority Critical patent/JP6200182B2/ja
Priority to CN201410130833.XA priority patent/CN104070258B/zh
Publication of JP2014197632A publication Critical patent/JP2014197632A/ja
Publication of JP2014197632A5 publication Critical patent/JP2014197632A5/ja
Application granted granted Critical
Publication of JP6200182B2 publication Critical patent/JP6200182B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP2013072982A 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置 Active JP6200182B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013072982A JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置
CN201410130833.XA CN104070258B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013072982A JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (3)

Publication Number Publication Date
JP2014197632A JP2014197632A (ja) 2014-10-16
JP2014197632A5 JP2014197632A5 (enExample) 2016-03-24
JP6200182B2 true JP6200182B2 (ja) 2017-09-20

Family

ID=51592086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013072982A Active JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Country Status (2)

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JP (1) JP6200182B2 (enExample)
CN (1) CN104070258B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10933483B2 (en) 2017-12-05 2021-03-02 Illinois Tool Works Inc. IR non-contact temperature sensing in a dispenser
JP6742386B2 (ja) * 2018-11-13 2020-08-19 キヤノンマシナリー株式会社 ボンディング装置、ダイボンダ、及びボンディング方法
ES3048009T3 (en) * 2019-01-14 2025-12-05 Illinois Tool Works Ir non-contact temperature sensing in a dispenser
JP7162776B2 (ja) * 2020-03-27 2022-10-28 三菱電機株式会社 銅部材用自動トーチろう付装置及び銅部材用自動トーチろう付方法
CN113579478B (zh) * 2021-08-18 2023-04-18 江南造船(集团)有限责任公司 一种激光焊磁感预热自适应系统及其工作方法
CN117020498B (zh) * 2023-09-25 2025-09-30 蚌埠富源电子科技有限责任公司 一种玻璃密封连接器用焊接辅助设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
US4632291A (en) * 1983-02-28 1986-12-30 Electrovert Ltd. Automatic wave soldering machine
JPH01124727A (ja) * 1987-11-10 1989-05-17 Matsushita Electric Ind Co Ltd 加熱装置
JPH0677639A (ja) * 1992-08-27 1994-03-18 Sharp Corp フローハンダ付け装置およびリフローハンダ付け装置
JP3634076B2 (ja) * 1996-08-06 2005-03-30 松下電器産業株式会社 リフロー条件設定方法
JPH10107423A (ja) * 1996-09-30 1998-04-24 Matsushita Electric Works Ltd リフロー半田付け装置
JP2002290027A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

Also Published As

Publication number Publication date
CN104070258A (zh) 2014-10-01
CN104070258B (zh) 2018-02-09
JP2014197632A (ja) 2014-10-16

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