CN104070258B - 基板加热装置和软钎焊装置 - Google Patents

基板加热装置和软钎焊装置 Download PDF

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Publication number
CN104070258B
CN104070258B CN201410130833.XA CN201410130833A CN104070258B CN 104070258 B CN104070258 B CN 104070258B CN 201410130833 A CN201410130833 A CN 201410130833A CN 104070258 B CN104070258 B CN 104070258B
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China
Prior art keywords
substrate
temperature
mentioned
temperature detection
detection part
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Active
Application number
CN201410130833.XA
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English (en)
Chinese (zh)
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CN104070258A (zh
Inventor
大清水和宪
桥本昇
向井直人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
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Publication of CN104070258A publication Critical patent/CN104070258A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CN201410130833.XA 2013-03-29 2014-03-28 基板加热装置和软钎焊装置 Active CN104070258B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-072982 2013-03-29
JP2013072982A JP6200182B2 (ja) 2013-03-29 2013-03-29 基板加熱装置及びはんだ付装置

Publications (2)

Publication Number Publication Date
CN104070258A CN104070258A (zh) 2014-10-01
CN104070258B true CN104070258B (zh) 2018-02-09

Family

ID=51592086

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410130833.XA Active CN104070258B (zh) 2013-03-29 2014-03-28 基板加热装置和软钎焊装置

Country Status (2)

Country Link
JP (1) JP6200182B2 (enExample)
CN (1) CN104070258B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10933483B2 (en) 2017-12-05 2021-03-02 Illinois Tool Works Inc. IR non-contact temperature sensing in a dispenser
JP6742386B2 (ja) * 2018-11-13 2020-08-19 キヤノンマシナリー株式会社 ボンディング装置、ダイボンダ、及びボンディング方法
ES3048009T3 (en) * 2019-01-14 2025-12-05 Illinois Tool Works Ir non-contact temperature sensing in a dispenser
JP7162776B2 (ja) * 2020-03-27 2022-10-28 三菱電機株式会社 銅部材用自動トーチろう付装置及び銅部材用自動トーチろう付方法
CN113579478B (zh) * 2021-08-18 2023-04-18 江南造船(集团)有限责任公司 一种激光焊磁感预热自适应系统及其工作方法
CN117020498B (zh) * 2023-09-25 2025-09-30 蚌埠富源电子科技有限责任公司 一种玻璃密封连接器用焊接辅助设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0118091A1 (en) * 1983-02-28 1984-09-12 Electrovert Ltd. Automatic wave soldering machine
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595494Y2 (ja) * 1979-10-04 1984-02-18 権士 近藤 プリント基板予備加熱装置
JPH01124727A (ja) * 1987-11-10 1989-05-17 Matsushita Electric Ind Co Ltd 加熱装置
JPH0677639A (ja) * 1992-08-27 1994-03-18 Sharp Corp フローハンダ付け装置およびリフローハンダ付け装置
JP3634076B2 (ja) * 1996-08-06 2005-03-30 松下電器産業株式会社 リフロー条件設定方法
JPH10107423A (ja) * 1996-09-30 1998-04-24 Matsushita Electric Works Ltd リフロー半田付け装置
JP2002290027A (ja) * 2001-03-28 2002-10-04 Seiko Epson Corp 電子回路モジュールの製造方法及び製造装置並びに半導体モジュールの製造方法及び製造装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0118091A1 (en) * 1983-02-28 1984-09-12 Electrovert Ltd. Automatic wave soldering machine
CN102566625A (zh) * 2010-12-09 2012-07-11 西安中科麦特电子技术设备有限公司 一种回流焊机温度控制系统

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Publication number Publication date
CN104070258A (zh) 2014-10-01
JP6200182B2 (ja) 2017-09-20
JP2014197632A (ja) 2014-10-16

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