JP6192773B1 - 金属表面改質装置 - Google Patents
金属表面改質装置 Download PDFInfo
- Publication number
- JP6192773B1 JP6192773B1 JP2016114633A JP2016114633A JP6192773B1 JP 6192773 B1 JP6192773 B1 JP 6192773B1 JP 2016114633 A JP2016114633 A JP 2016114633A JP 2016114633 A JP2016114633 A JP 2016114633A JP 6192773 B1 JP6192773 B1 JP 6192773B1
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- irradiated
- irradiated object
- vacuum chamber
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 21
- 239000002184 metal Substances 0.000 title claims abstract description 21
- 230000004048 modification Effects 0.000 title claims abstract description 18
- 238000012986 modification Methods 0.000 title claims abstract description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000010936 titanium Substances 0.000 claims abstract description 25
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 25
- 239000007943 implant Substances 0.000 claims abstract description 24
- 238000001125 extrusion Methods 0.000 claims abstract description 16
- 238000009434 installation Methods 0.000 claims abstract description 15
- 238000010894 electron beam technology Methods 0.000 abstract description 31
- 239000007789 gas Substances 0.000 description 12
- 238000004381 surface treatment Methods 0.000 description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000004053 dental implant Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 230000004308 accommodation Effects 0.000 description 5
- 229910001069 Ti alloy Inorganic materials 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002407 reforming Methods 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000002715 modification method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000011796 hollow space material Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229910000883 Ti6Al4V Inorganic materials 0.000 description 1
- 229910010380 TiNi Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000005433 ionosphere Substances 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052704 radon Inorganic materials 0.000 description 1
- SYUHGPGVQRZVTB-UHFFFAOYSA-N radon atom Chemical compound [Rn] SYUHGPGVQRZVTB-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229940034610 toothpaste Drugs 0.000 description 1
- 239000000606 toothpaste Substances 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
- H01J37/185—Means for transferring objects between different enclosures of different pressure or atmosphere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/201—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated for mounting multiple objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20207—Tilt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20214—Rotation
Abstract
Description
2:移動装置
2A:移動体(Y軸)
2B:移動体(X軸)
2C:昇降装置
3:真空装置
4:稀ガス供給装置
5:電子ビーム発生装置
5A:電子銃
5B:電源装置
50A:カソード電極
50B:アノード電極
50C:ソレノイド
50D:コレクタ
50E:グランドライン
50F:電子ビーム発生用電源装置
50G:プラズマ発生用電源装置
50H:スイッチ
6:被照射体設置装置
7:保持冶具
7A:底部位
7B:上部位
7C:突出部位
8:被照射体
8A:土台部位
8B:歯根部位
10:テーブル
Claims (1)
- チタン製のインプラントの被照射体を収容して真空の環境下に置く真空チャンバと、前記真空チャンバの中に設置され少なくとも水平1軸方向と前記水平1軸方向に直交する他の水平1軸方向とに前記被照射体を移動させる移動装置と、前記移動装置の上に設置され前記被照射体を載置するテーブルと、所定の断面積を有するカソード電極とプラズマを生成するための環状のアノード電極と磁場を形成するソレノイドとを含んでなる電子銃と、を備えた金属表面改質装置であって、テーブルの上に固定され被照射体を保持する保持冶具の底部位の曲面形状と相対する曲面を有する複数の収容穴が上面に形成された移動保持台と、真空チャンバに固定され前記移動保持台の上側に前記移動保持台に相対移動可能に重なるように配置されて前記各収容穴にそれぞれ対向する位置に複数の貫通孔が形成された固定押出板と、でなり、前記移動装置が前記被照射体を移動させるのにともなって前記各被照射体を同時に任意の方向に所定の角度傾斜するように前記被照射体を設置する被照射体設置装置と、を含んでな金属表面改質装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016114633A JP6192773B1 (ja) | 2016-06-08 | 2016-06-08 | 金属表面改質装置 |
US15/592,198 US10115560B2 (en) | 2016-06-08 | 2017-05-11 | Apparatus for modifying surfaces of titanium implants made of titanium alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016114633A JP6192773B1 (ja) | 2016-06-08 | 2016-06-08 | 金属表面改質装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6192773B1 true JP6192773B1 (ja) | 2017-09-06 |
JP2017217246A JP2017217246A (ja) | 2017-12-14 |
Family
ID=59798913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016114633A Active JP6192773B1 (ja) | 2016-06-08 | 2016-06-08 | 金属表面改質装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10115560B2 (ja) |
JP (1) | JP6192773B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102017500B1 (ko) * | 2018-10-29 | 2019-09-03 | (주)코비젼 | 인공치아 보철의 표면 처리장치 |
BR102022014113A2 (pt) * | 2022-07-15 | 2024-01-23 | M3 Health Indústria E Comércio De Produtos Médicos, Odontológicos E Correlatos S.A. | Processo de fabricação de implante dentário, dispositivo para anodização de implante dentário e dispositivo para ataque ácido de implante dentário |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06225891A (ja) * | 1992-12-07 | 1994-08-16 | Nobelpharma Ab | インプラント表面の加工方法 |
JPH09239564A (ja) * | 1996-03-05 | 1997-09-16 | Toshiba Corp | イオンビーム加工装置、イオンビーム加工方法、マスク及びマスクの製造方法 |
US20150038899A1 (en) * | 2011-08-22 | 2015-02-05 | Exogenesis Corporation | Medical device for bone implant and method for producing such a device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5091217A (en) * | 1989-05-22 | 1992-02-25 | Advanced Semiconductor Materials, Inc. | Method for processing wafers in a multi station common chamber reactor |
IL128261A0 (en) | 1999-01-27 | 1999-11-30 | Disc O Tech Medical Tech Ltd | Expandable element |
EP1036406B1 (en) * | 1997-11-03 | 2003-04-02 | ASM America, Inc. | Improved low mass wafer support system |
US6763281B2 (en) * | 1999-04-19 | 2004-07-13 | Applied Materials, Inc | Apparatus for alignment of automated workpiece handling systems |
US6863531B2 (en) | 2001-06-28 | 2005-03-08 | Itac Ltd. | Surface modification process on metal dentures, products produced thereby, and the incorporated system thereof |
JP2009187990A (ja) * | 2008-02-01 | 2009-08-20 | Tokyo Electron Ltd | プラズマ処理装置 |
DE102008007662A1 (de) | 2008-02-06 | 2009-08-13 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Behandlung von Formteilen mittels energiereicher Elektronenstrahlen |
DE102008049556B4 (de) * | 2008-09-30 | 2011-07-07 | Carl Zeiss SMT GmbH, 73447 | Mikrolithographische Projektionsbelichtungsanlage |
US10062599B2 (en) * | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
-
2016
- 2016-06-08 JP JP2016114633A patent/JP6192773B1/ja active Active
-
2017
- 2017-05-11 US US15/592,198 patent/US10115560B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06225891A (ja) * | 1992-12-07 | 1994-08-16 | Nobelpharma Ab | インプラント表面の加工方法 |
JPH09239564A (ja) * | 1996-03-05 | 1997-09-16 | Toshiba Corp | イオンビーム加工装置、イオンビーム加工方法、マスク及びマスクの製造方法 |
US20150038899A1 (en) * | 2011-08-22 | 2015-02-05 | Exogenesis Corporation | Medical device for bone implant and method for producing such a device |
Also Published As
Publication number | Publication date |
---|---|
JP2017217246A (ja) | 2017-12-14 |
US20170358423A1 (en) | 2017-12-14 |
US10115560B2 (en) | 2018-10-30 |
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