JP6192525B2 - 砥材埋め込み方法 - Google Patents
砥材埋め込み方法 Download PDFInfo
- Publication number
- JP6192525B2 JP6192525B2 JP2013257600A JP2013257600A JP6192525B2 JP 6192525 B2 JP6192525 B2 JP 6192525B2 JP 2013257600 A JP2013257600 A JP 2013257600A JP 2013257600 A JP2013257600 A JP 2013257600A JP 6192525 B2 JP6192525 B2 JP 6192525B2
- Authority
- JP
- Japan
- Prior art keywords
- pressing
- surface plate
- distance
- pressing member
- polishing surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 19
- 238000005498 polishing Methods 0.000 claims description 91
- 239000003082 abrasive agent Substances 0.000 claims description 35
- 239000002002 slurry Substances 0.000 claims description 21
- 238000001514 detection method Methods 0.000 claims description 18
- 239000006061 abrasive grain Substances 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003028 elevating effect Effects 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
(1) ・・・ g=v(t/2)−d
4 研磨定盤
4a 上面
6 保持機構(保持手段)
6a 下面
8 ノズル
10 押圧部材
10a 下面(押圧面)
12 圧力調整機構
14 センサユニット(検出手段)
16 制御装置
16a 時間計測部
16b 距離算出部
18 超音波センサ
18a 圧電素子(超音波振動子)
18b 超音波伝達部材
20 パルス電圧発生器
22 変換器(コンバータ)
11 被加工物
11a 上面
11b 下面
13 砥材
15 スラリー
USa 超音波
USb 超音波(反射波)
Claims (2)
- 研磨定盤上に砥材を埋め込む砥材埋め込み方法であって、
砥材を含むスラリーを介して研磨定盤の上面に押圧部材を押圧して該研磨定盤の上面に砥材を埋め込む埋め込みステップと、
該埋め込みステップ前または実施中に、該研磨定盤の上面に対面する該押圧部材の押圧面と該研磨定盤の上面との間の距離を検出手段で検出する距離検出ステップと、
該埋め込みステップの前または実施中に、該距離検出ステップで検出された該距離に基づいて該押圧部材で該研磨定盤を押圧する圧力を調整する圧力調整ステップと、を備えたことを特徴とする砥材埋め込み方法。 - 前記距離検出ステップで検出された前記距離の値が前記砥材の平均砥粒径よりも小さい場合に、前記圧力調整ステップでは、前記押圧部材で前記研磨定盤を押圧する圧力を低下させることを特徴とする請求項1に記載の砥材埋め込み方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2013257600A JP6192525B2 (ja) | 2013-12-13 | 2013-12-13 | 砥材埋め込み方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013257600A JP6192525B2 (ja) | 2013-12-13 | 2013-12-13 | 砥材埋め込み方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015112696A JP2015112696A (ja) | 2015-06-22 |
JP6192525B2 true JP6192525B2 (ja) | 2017-09-06 |
Family
ID=53526981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013257600A Active JP6192525B2 (ja) | 2013-12-13 | 2013-12-13 | 砥材埋め込み方法 |
Country Status (1)
Country | Link |
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JP (1) | JP6192525B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6814579B2 (ja) * | 2016-09-20 | 2021-01-20 | 株式会社ディスコ | 研削ホイール及び研削装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000059644A1 (en) * | 1999-04-02 | 2000-10-12 | Engis Corporation | Modular controlled platen preparation system and method |
JP2003311605A (ja) * | 2002-04-19 | 2003-11-05 | Hitachi Ltd | 砥粒埋込装置及び方法とこれを用いた研磨装置 |
JP4213086B2 (ja) * | 2004-07-16 | 2009-01-21 | 富士通株式会社 | 研磨装置及び定盤加工方法 |
JP2011212752A (ja) * | 2010-03-31 | 2011-10-27 | Hitachi Ltd | 研磨定盤の製造方法及び研磨定盤を用いた磁気ヘッドスライダの製造方法 |
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2013
- 2013-12-13 JP JP2013257600A patent/JP6192525B2/ja active Active
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JP2015112696A (ja) | 2015-06-22 |
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