JP6189178B2 - レーザー加工装置 - Google Patents

レーザー加工装置 Download PDF

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Publication number
JP6189178B2
JP6189178B2 JP2013224643A JP2013224643A JP6189178B2 JP 6189178 B2 JP6189178 B2 JP 6189178B2 JP 2013224643 A JP2013224643 A JP 2013224643A JP 2013224643 A JP2013224643 A JP 2013224643A JP 6189178 B2 JP6189178 B2 JP 6189178B2
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JP
Japan
Prior art keywords
laser beam
polygon mirror
axis direction
chuck table
incident position
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Active
Application number
JP2013224643A
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English (en)
Japanese (ja)
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JP2015085347A (ja
Inventor
圭司 能丸
圭司 能丸
宏 北村
宏 北村
健太郎 小田中
健太郎 小田中
正寿 名雪
正寿 名雪
真樹 坂井
真樹 坂井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2013224643A priority Critical patent/JP6189178B2/ja
Priority to KR1020140135635A priority patent/KR102091292B1/ko
Publication of JP2015085347A publication Critical patent/JP2015085347A/ja
Application granted granted Critical
Publication of JP6189178B2 publication Critical patent/JP6189178B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
JP2013224643A 2013-10-29 2013-10-29 レーザー加工装置 Active JP6189178B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013224643A JP6189178B2 (ja) 2013-10-29 2013-10-29 レーザー加工装置
KR1020140135635A KR102091292B1 (ko) 2013-10-29 2014-10-08 레이저 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013224643A JP6189178B2 (ja) 2013-10-29 2013-10-29 レーザー加工装置

Publications (2)

Publication Number Publication Date
JP2015085347A JP2015085347A (ja) 2015-05-07
JP6189178B2 true JP6189178B2 (ja) 2017-08-30

Family

ID=53048734

Family Applications (1)

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JP2013224643A Active JP6189178B2 (ja) 2013-10-29 2013-10-29 レーザー加工装置

Country Status (2)

Country Link
JP (1) JP6189178B2 (ko)
KR (1) KR102091292B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3070888A1 (fr) * 2017-09-14 2019-03-15 Disco Corporation Appareil de traitement au laser

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101897869B1 (ko) 2016-07-07 2018-10-04 고려대학교 산학협력단 비구면거울이 내장된 레이저수술장치
JP6917727B2 (ja) 2017-02-15 2021-08-11 株式会社ディスコ レーザー加工装置
JP2019069465A (ja) * 2017-10-11 2019-05-09 株式会社ディスコ レーザー加工装置
JP6965094B2 (ja) * 2017-10-17 2021-11-10 株式会社ディスコ レーザー加工装置
JP6907091B2 (ja) * 2017-10-19 2021-07-21 株式会社ディスコ レーザー加工装置
JP6907093B2 (ja) * 2017-10-24 2021-07-21 株式会社ディスコ レーザー加工装置
JP6985102B2 (ja) * 2017-10-31 2021-12-22 株式会社ディスコ レーザー加工装置
JP6998177B2 (ja) * 2017-11-02 2022-01-18 株式会社ディスコ レーザー加工装置
JP6998178B2 (ja) * 2017-11-07 2022-01-18 株式会社ディスコ レーザー加工装置
JP7201343B2 (ja) * 2018-06-19 2023-01-10 株式会社ディスコ レーザー加工装置
JP7173809B2 (ja) * 2018-09-25 2022-11-16 株式会社ディスコ レーザー加工方法
JP7313127B2 (ja) * 2018-10-04 2023-07-24 浜松ホトニクス株式会社 撮像装置、レーザ加工装置、及び、撮像方法
JP7313128B2 (ja) * 2018-10-04 2023-07-24 浜松ホトニクス株式会社 撮像装置、レーザ加工装置、及び、撮像方法
JP7319770B2 (ja) * 2018-10-04 2023-08-02 浜松ホトニクス株式会社 撮像装置、レーザ加工装置、及び、撮像方法
US11534862B2 (en) * 2019-04-09 2022-12-27 Disco Corporation Laser processing apparatus
JP7449097B2 (ja) * 2019-04-09 2024-03-13 株式会社ディスコ レーザー加工装置
JP7278178B2 (ja) 2019-09-05 2023-05-19 株式会社ディスコ レーザー加工装置の光軸確認方法
JP2023069381A (ja) 2021-11-05 2023-05-18 株式会社ディスコ ウエーハの加工方法
JP2023069380A (ja) 2021-11-05 2023-05-18 株式会社ディスコ 加工方法
KR102496330B1 (ko) * 2022-05-18 2023-02-06 두원포토닉스 주식회사 비행체 방어용 레이저 장치 및 그 운용 방법
JP2023180898A (ja) 2022-06-10 2023-12-21 株式会社ディスコ レーザー加工装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US241060A (en) * 1881-05-03 Bomb-harpoon
JP2659021B2 (ja) * 1989-02-15 1997-09-30 富士通株式会社 ポリゴンミラー上下動機構
JPH0588099A (ja) * 1991-09-30 1993-04-09 Matsushita Electric Ind Co Ltd レーザビームの走査方法
JP2004130754A (ja) * 2002-10-15 2004-04-30 Noritsu Koki Co Ltd 写真プリント装置
JP2005064231A (ja) 2003-08-12 2005-03-10 Disco Abrasive Syst Ltd 板状物の分割方法
KR100462358B1 (ko) * 2004-03-31 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치
JP5122773B2 (ja) * 2006-08-04 2013-01-16 株式会社ディスコ レーザー加工機
KR100904034B1 (ko) * 2007-06-25 2009-06-19 (주)하드램 레이저멀티커팅장치
KR100993625B1 (ko) * 2009-02-25 2010-11-11 (주)하드램 멀티 스캐너 유닛을 구비한 레이저 다이렉트 이미징 시스템
KR101058548B1 (ko) * 2009-03-27 2011-08-23 (주)하드램 레이저를 이용하는 다중 절단방법
JP5819605B2 (ja) * 2010-12-17 2015-11-24 株式会社ディスコ 基板の分割方法
JP5778432B2 (ja) * 2011-01-17 2015-09-16 株式会社ディスコ レーザー加工装置
KR20120129759A (ko) * 2011-05-19 2012-11-28 가부시기가이샤 디스코 레이저 가공 방법 및 레이저 가공 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3070888A1 (fr) * 2017-09-14 2019-03-15 Disco Corporation Appareil de traitement au laser

Also Published As

Publication number Publication date
KR20150050357A (ko) 2015-05-08
JP2015085347A (ja) 2015-05-07
KR102091292B1 (ko) 2020-03-19

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