JP6186623B2 - マイクロリソグラフィ投影露光装置 - Google Patents
マイクロリソグラフィ投影露光装置 Download PDFInfo
- Publication number
- JP6186623B2 JP6186623B2 JP2012229290A JP2012229290A JP6186623B2 JP 6186623 B2 JP6186623 B2 JP 6186623B2 JP 2012229290 A JP2012229290 A JP 2012229290A JP 2012229290 A JP2012229290 A JP 2012229290A JP 6186623 B2 JP6186623 B2 JP 6186623B2
- Authority
- JP
- Japan
- Prior art keywords
- heating light
- light
- mirror
- heating
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70158—Diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70575—Wavelength control, e.g. control of bandwidth, multiple wavelength, selection of wavelength or matching of optical components to wavelength
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
- G03F7/70891—Temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011083559.8 | 2011-09-27 | ||
| DE102011083559 | 2011-09-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013074299A JP2013074299A (ja) | 2013-04-22 |
| JP2013074299A5 JP2013074299A5 (enExample) | 2015-11-12 |
| JP6186623B2 true JP6186623B2 (ja) | 2017-08-30 |
Family
ID=47828110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012229290A Active JP6186623B2 (ja) | 2011-09-27 | 2012-09-27 | マイクロリソグラフィ投影露光装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9052606B2 (enExample) |
| JP (1) | JP6186623B2 (enExample) |
| DE (1) | DE102012216284A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI657937B (zh) * | 2013-12-05 | 2019-05-01 | 美商佛塞安科技公司 | 用於發射偏移照明以減少雜散光的方法和系統 |
| DE102014216458A1 (de) | 2014-08-19 | 2016-02-25 | Carl Zeiss Smt Gmbh | Optisches Element mit einer Beschichtung zur Beeinflussung von Heizstrahlung und optische Anordnung |
| DE102016225625A1 (de) * | 2016-12-20 | 2017-12-07 | Carl Zeiss Smt Gmbh | Retikel, projektionsbelichtungsanlage und verfahren zur abbildung von overlay-markierungen |
| DE102019219289A1 (de) * | 2019-12-11 | 2021-06-17 | Carl Zeiss Smt Gmbh | Optisches System, sowie Heizanordnung und Verfahren zum Heizen eines optischen Elements in einem optischen System |
| DE102020207748A1 (de) * | 2020-06-23 | 2021-03-25 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere in einermikrolithographischen Projektionsbelichtungsanlage |
| DE102020207752A1 (de) * | 2020-06-23 | 2021-12-23 | Carl Zeiss Smt Gmbh | Heizanordnung und Verfahren zum Heizen eines optischen Elements |
| DE102020213416A1 (de) | 2020-10-23 | 2021-10-07 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit einer Heizvorrichtung und einem Polarisator |
| DE102020213983A1 (de) * | 2020-11-06 | 2022-05-12 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| US12461448B2 (en) | 2021-01-27 | 2025-11-04 | ASML Netherlands B.V. & ASML Holding N.V. | Multi-channel light source for projection optics heating |
| DE102021201258A1 (de) | 2021-02-10 | 2022-08-11 | Carl Zeiss Smt Gmbh | Verfahren zum Heizen eines optischen Elements in einer mikrolithographischen Projektionsbelichtungsanlage, sowie optisches System |
| DE102021206203A1 (de) * | 2021-06-17 | 2022-12-22 | Carl Zeiss Smt Gmbh | Heizanordnung und Verfahren zum Heizen eines optischen Elements |
| DE102021212679A1 (de) | 2021-11-11 | 2023-05-11 | Carl Zeiss Smt Gmbh | Optisches System, insbesondere in einer mikrolithographischen Projektionsbelichtungsanlage |
| DE102022203039A1 (de) | 2022-03-28 | 2023-03-09 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage für die Mikrolithographie |
| DE102022209455A1 (de) | 2022-09-09 | 2024-03-14 | Carl Zeiss Smt Gmbh | Heizanordnung, sowie optisches System und Verfahren zum Heizen eines optischen Elements |
| DE102023117203A1 (de) * | 2023-06-29 | 2025-01-02 | Carl Zeiss Smt Gmbh | Vorrichtung und Verfahren zur Voralterung eines optischen Elements für die Halbleiterlithographie |
| DE102024205028A1 (de) * | 2024-05-29 | 2025-06-05 | Carl Zeiss Smt Gmbh | Anlage der Halbleitertechnologie mit unterdrückter Streustrahlung |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1112750A (fr) * | 1978-10-13 | 1981-11-17 | Jean-Luc Dion | Cellule acousto-optique a cristal liquide |
| JP4051473B2 (ja) * | 1998-12-17 | 2008-02-27 | 株式会社ニコン | 照明光学装置および該照明光学装置を備えた露光装置 |
| JP2002075835A (ja) * | 2000-08-30 | 2002-03-15 | Nikon Corp | 照明光学装置および該照明光学装置を備えた露光装置 |
| DE10146944A1 (de) * | 2001-09-24 | 2003-04-10 | Zeiss Carl Jena Gmbh | Meßanordnung |
| US20030235682A1 (en) * | 2002-06-21 | 2003-12-25 | Sogard Michael R. | Method and device for controlling thermal distortion in elements of a lithography system |
| DE10317662A1 (de) | 2003-04-17 | 2004-11-18 | Carl Zeiss Smt Ag | Projektionsobjektiv, mikrolithographische Projektionsbelichtungsanlage und Verfahren zur Herstellung einer Halbleiterschaltung |
| WO2004095137A1 (en) | 2003-04-24 | 2004-11-04 | Carl Zeiss Smt Ag | Projection optical system |
| WO2005040925A1 (de) | 2003-09-27 | 2005-05-06 | Carl Zeiss Smt Ag | Euv-projektionsobjektiv mit spiegeln aus materialien mit unterschiedlichem vorzeichen der steigung der temperaturabhängigkeit des wärmeausdehnungskoeffizienten nahe der nulldurchgangstemperatur |
| DE102005031792A1 (de) * | 2005-07-07 | 2007-01-11 | Carl Zeiss Smt Ag | Verfahren zur Entfernung von Kontamination von optischen Elementen, insbesondere von Oberflächen optischer Elemente sowie ein optisches System oder Teilsystem hierfür |
| DE102008016011A1 (de) * | 2007-03-27 | 2008-10-02 | Carl Zeiss Smt Ag | Korrektur optischer Elemente mittels flach eingestrahltem Korrekturlicht |
| JP2009010131A (ja) * | 2007-06-27 | 2009-01-15 | Canon Inc | 露光装置及びデバイス製造方法 |
| US20090091730A1 (en) * | 2007-10-03 | 2009-04-09 | Nikon Corporation | Spatial light modulation unit, illumination apparatus, exposure apparatus, and device manufacturing method |
| DE102008054582A1 (de) * | 2007-12-21 | 2009-07-09 | Carl Zeiss Smt Ag | Mikrolithographische Projektionsbelichtungsanlage |
| US20100290020A1 (en) * | 2009-05-15 | 2010-11-18 | Shinichi Mori | Optical apparatus, exposure apparatus, exposure method, and method for producing device |
-
2012
- 2012-09-13 DE DE102012216284A patent/DE102012216284A1/de not_active Withdrawn
- 2012-09-26 US US13/627,842 patent/US9052606B2/en active Active
- 2012-09-27 JP JP2012229290A patent/JP6186623B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20130077074A1 (en) | 2013-03-28 |
| US9052606B2 (en) | 2015-06-09 |
| JP2013074299A (ja) | 2013-04-22 |
| DE102012216284A1 (de) | 2013-03-28 |
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