JP6182375B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP6182375B2
JP6182375B2 JP2013149027A JP2013149027A JP6182375B2 JP 6182375 B2 JP6182375 B2 JP 6182375B2 JP 2013149027 A JP2013149027 A JP 2013149027A JP 2013149027 A JP2013149027 A JP 2013149027A JP 6182375 B2 JP6182375 B2 JP 6182375B2
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Prior art keywords
plasma processing
dielectric window
processing apparatus
conductor
plasma
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JP2013149027A
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Japanese (ja)
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JP2015022855A5 (enExample
JP2015022855A (ja
Inventor
優作 属
優作 属
忠義 川口
忠義 川口
西尾 良司
良司 西尾
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Priority to JP2013149027A priority Critical patent/JP6182375B2/ja
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Publication of JP2015022855A5 publication Critical patent/JP2015022855A5/ja
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Publication of JP6182375B2 publication Critical patent/JP6182375B2/ja
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  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2013149027A 2013-07-18 2013-07-18 プラズマ処理装置 Active JP6182375B2 (ja)

Priority Applications (1)

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JP2013149027A JP6182375B2 (ja) 2013-07-18 2013-07-18 プラズマ処理装置

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JP2013149027A JP6182375B2 (ja) 2013-07-18 2013-07-18 プラズマ処理装置

Publications (3)

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JP2015022855A JP2015022855A (ja) 2015-02-02
JP2015022855A5 JP2015022855A5 (enExample) 2016-04-14
JP6182375B2 true JP6182375B2 (ja) 2017-08-16

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JP2013149027A Active JP6182375B2 (ja) 2013-07-18 2013-07-18 プラズマ処理装置

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6594664B2 (ja) * 2015-05-28 2019-10-23 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2016225439A (ja) * 2015-05-29 2016-12-28 東京エレクトロン株式会社 プラズマ処理装置及び基板剥離検知方法
JP6446334B2 (ja) * 2015-06-12 2018-12-26 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理装置の制御方法及び記憶媒体
JP7232410B2 (ja) * 2019-03-20 2023-03-03 日新電機株式会社 プラズマ処理装置
JP7690576B2 (ja) * 2021-04-26 2025-06-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004079557A (ja) * 2002-08-09 2004-03-11 Hitachi High-Technologies Corp プラズマ処理装置及びプラズマ処理方法
JP2007173512A (ja) * 2005-12-22 2007-07-05 Mitsubishi Heavy Ind Ltd プラズマ処理装置
US10595365B2 (en) * 2010-10-19 2020-03-17 Applied Materials, Inc. Chamber lid heater ring assembly
JP2012211359A (ja) * 2011-03-31 2012-11-01 Mitsubishi Heavy Ind Ltd プラズマ処理装置
JP5913829B2 (ja) * 2011-04-21 2016-04-27 株式会社日立ハイテクノロジーズ プラズマ処理装置

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JP2015022855A (ja) 2015-02-02

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