JP6178683B2 - 吸着ステージ、貼合装置、および貼合方法 - Google Patents

吸着ステージ、貼合装置、および貼合方法 Download PDF

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JP6178683B2
JP6178683B2 JP2013198343A JP2013198343A JP6178683B2 JP 6178683 B2 JP6178683 B2 JP 6178683B2 JP 2013198343 A JP2013198343 A JP 2013198343A JP 2013198343 A JP2013198343 A JP 2013198343A JP 6178683 B2 JP6178683 B2 JP 6178683B2
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substrate
shape
placement
main body
support
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JP2015065298A5 (enExample
JP2015065298A (ja
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絵美 松井
絵美 松井
林　航之介
航之介 林
隆宏 金井
隆宏 金井
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Shibaura Mechatronics Corp
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JP2013198343A 2013-09-25 2013-09-25 吸着ステージ、貼合装置、および貼合方法 Active JP6178683B2 (ja)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017195411A (ja) * 2017-07-14 2017-10-26 芝浦メカトロニクス株式会社 吸着ステージ、貼合装置、および貼合方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6244188B2 (ja) * 2013-11-27 2017-12-06 東京エレクトロン株式会社 接合装置、接合方法および接合システム
TWI559410B (zh) * 2016-05-09 2016-11-21 印鋐科技有限公司 以壓差法抑制材料翹曲的方法
CN116403929A (zh) * 2021-12-28 2023-07-07 拓荆键科(海宁)半导体设备有限公司 调整卡盘形变的系统及装置

Family Cites Families (7)

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Publication number Priority date Publication date Assignee Title
SE444526B (sv) * 1978-01-23 1986-04-21 Western Electric Co Sett att i lege och plan placera en substratbricka
JPS61102735A (ja) * 1984-10-26 1986-05-21 Hitachi Ltd 基板変形チャック
JP3940823B2 (ja) * 1994-12-26 2007-07-04 株式会社ニコン ステージ装置及びその制御方法
JP2007123560A (ja) * 2005-10-28 2007-05-17 Toshiba Corp ウェハチャック及び半導体製造方法
JP2010182866A (ja) * 2009-02-05 2010-08-19 Nikon Corp 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法
CN103283000B (zh) * 2010-12-20 2016-10-26 Ev集团E·索尔纳有限责任公司 用于保持晶片的容纳装置
JP2013187393A (ja) * 2012-03-08 2013-09-19 Tokyo Electron Ltd 貼り合わせ装置及び貼り合わせ方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017195411A (ja) * 2017-07-14 2017-10-26 芝浦メカトロニクス株式会社 吸着ステージ、貼合装置、および貼合方法

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