JP6174767B1 - 情報定着装置 - Google Patents
情報定着装置 Download PDFInfo
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- JP6174767B1 JP6174767B1 JP2016158709A JP2016158709A JP6174767B1 JP 6174767 B1 JP6174767 B1 JP 6174767B1 JP 2016158709 A JP2016158709 A JP 2016158709A JP 2016158709 A JP2016158709 A JP 2016158709A JP 6174767 B1 JP6174767 B1 JP 6174767B1
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- bag
- plastic bag
- wind pressure
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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Abstract
Description
2 スタンパー
21 ラベル
22 粘着層
23 プリンターヘッド
3 送風装置
31 ノズル部
32 風(風圧)
33 空気の流れ
34 空気ふさぎ部
4 物品
5 コンテナ
51 穴(窓)
6 コンベア
7 押さえ板
71 凸部
8 帯電ガン
81 コロナ放電
A 接触領域(A1、A2、A3)
D コンテナ窓からのプラスチック袋の突出量(D1、D2、D3)
G スタンパーとコンテナ表面との適切な間隔寸法
Claims (9)
- 内容物を格納し得る袋体が投入もしくは内挿されることが可能なコンテナであって該コンテナを構成する側壁の少なくとも一部に前記コンテナの内外を貫通する窓部が設けられたコンテナと、
前記コンテナに投入もしくは内挿された前記袋体の表面の少なくとも一部に対して情報票を貼付しもしくは印字を押圧するための情報付着手段と、
前記情報付着手段によって前記情報票が貼付されもしくは前記印字が押圧される押圧力に前記窓部を介して対抗する対抗力を生成する反力生成手段と
を具備することを特徴とする情報定着装置。 - 前記情報付着手段は前記情報票を貼付するものであり、前記反力生成手段は風圧を用いて前記対抗力を生成し、前記風圧によって前記袋体が前記窓部において前記コンテナの外に向かって略凸状に変位した領域に対し、前記コンテナの前記側壁に略平行に位置する前記情報票が徐々に近接して移動し、前記コンテナの外縁に向かって前記略凸状に変位した領域の頂点部から接触を開始し、順次粘着させてゆくことを特徴とした請求項1記載の情報定着装置。
- 前記情報付着手段は前記印字を押圧するものであり、前記対抗力は風圧によって生成され、前記風圧によって前記袋体が前記窓部において前記コンテナの外方に向かって凸状に変位した領域に対し、前記コンテナの側面に略平行に位置する前記情報付着手段の少なくとも一部が徐々に近接して移動し、前記コンテナの外方に向かって凸状に変位した頂点部から接触を開始し、順次粘着させてゆくことを特徴とした請求項1記載の情報定着装置。
- 前記風圧を生成するための、前記コンテナの有する開口部の上方に位置し前記袋体の前記開口部に向けて送風することができる送風装置を有し、前記風圧による内圧を維持するための内圧維持機構をさらに有することを特徴とした請求項2もしくは3記載の情報定着装置。
- 前記送風装置は、前記袋体内面の前記コンテナの前記窓部のある方向に対して傾斜して設置され、前記風圧は前記送風装置から前記窓部に直接的に当てられることを特徴とした請求項4記載の情報定着装置。
- 前記内圧維持機構は、空気の逃げを防ぐための空気ふさぎ部及び/もしくは前記袋体の開口部領域に近い大きさを有する送風機底面部であることを特徴とした請求項4もしくは5記載の情報定着装置。
- 前記反力生成手段は、前記袋体の内側に挿入される機械的な押さえ板であることを特徴とした請求項1記載の情報定着装置。
- 前記反力生成手段は、前記袋体および前記コンテナ間に静電気による付着力を生成するものであることを特徴とした請求項1記載の情報定着装置。
- 前記袋体はプラスチックもしくは紙を素材とするものであることを特徴とする請求項1記載の情報定着装置。
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JP2016158709A JP6174767B1 (ja) | 2016-08-12 | 2016-08-12 | 情報定着装置 |
JP2017035598A JP7206455B2 (ja) | 2016-08-12 | 2017-02-27 | 情報定着装置 |
JP2017035599A JP7206456B2 (ja) | 2016-08-12 | 2017-02-27 | 情報定着装置 |
TW107103251A TWI744468B (zh) | 2016-08-12 | 2018-01-30 | 半導體加工用黏著帶以及半導體裝置的製造方法 |
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JP2002179038A (ja) * | 2000-12-15 | 2002-06-26 | Daifuku Co Ltd | ケース体搬送設備 |
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US2166497A (en) * | 1937-05-15 | 1939-07-18 | Continental Distilling Corp | Labeling machine |
US3188261A (en) * | 1962-01-05 | 1965-06-08 | American Cyanamid Co | Labelling device |
JPS5350000A (en) * | 1976-10-18 | 1978-05-06 | Shibuya Kogyo Co Ltd | Device for deleting deformation of soft container |
US4180105A (en) * | 1978-10-27 | 1979-12-25 | Diamond International Corporation | Article inflating system |
JPH0747287Y2 (ja) * | 1992-07-15 | 1995-11-01 | アサノ精機株式会社 | 粉粒体包装装置 |
JP3421091B2 (ja) * | 1993-08-27 | 2003-06-30 | テルモ株式会社 | 情報管理装置 |
JPH09221119A (ja) * | 1996-02-19 | 1997-08-26 | Yamazaki Kikai Seisakusho:Kk | 柔軟性筒体に対するラベル等の貼付方法及び装置 |
JP3099004B1 (ja) * | 1999-07-29 | 2000-10-16 | 株式会社ヤマガタグラビヤ | チューブ体のラベル貼着方法 |
TWI310230B (en) * | 2003-01-22 | 2009-05-21 | Lintec Corp | Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work |
JP2005241818A (ja) * | 2004-02-25 | 2005-09-08 | Lintec Corp | 宅配用ラベル、ラベル付宅配用透明プラスチック製包装袋及び宅配用ラベルの使用方法 |
JP5049612B2 (ja) * | 2007-02-28 | 2012-10-17 | リンテック株式会社 | 粘着シート |
WO2014203792A1 (ja) * | 2013-06-19 | 2014-12-24 | 綜研化学株式会社 | 偏光板用粘着剤組成物、偏光板用粘着シート、粘着剤層付き偏光板、積層体及びフラットパネルディスプレイ |
JP6322013B2 (ja) * | 2014-03-20 | 2018-05-09 | リンテック株式会社 | 粘着シート |
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JPH0752932A (ja) * | 1993-08-06 | 1995-02-28 | Midou:Kk | ネット状袋へのラベル挿設装置及びこの袋へのラベル熱溶着装置 |
JP2002179038A (ja) * | 2000-12-15 | 2002-06-26 | Daifuku Co Ltd | ケース体搬送設備 |
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