JP6171613B2 - 発光装置の製造方法及び発光装置 - Google Patents

発光装置の製造方法及び発光装置 Download PDF

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Publication number
JP6171613B2
JP6171613B2 JP2013130077A JP2013130077A JP6171613B2 JP 6171613 B2 JP6171613 B2 JP 6171613B2 JP 2013130077 A JP2013130077 A JP 2013130077A JP 2013130077 A JP2013130077 A JP 2013130077A JP 6171613 B2 JP6171613 B2 JP 6171613B2
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Japan
Prior art keywords
adhesive
light emitting
stamp
emitting element
emitting device
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JP2013130077A
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English (en)
Japanese (ja)
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JP2015005625A5 (enExample
JP2015005625A (ja
Inventor
智紀 田村
智紀 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2013130077A priority Critical patent/JP6171613B2/ja
Publication of JP2015005625A publication Critical patent/JP2015005625A/ja
Publication of JP2015005625A5 publication Critical patent/JP2015005625A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2013130077A 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置 Active JP6171613B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Publications (3)

Publication Number Publication Date
JP2015005625A JP2015005625A (ja) 2015-01-08
JP2015005625A5 JP2015005625A5 (enExample) 2016-08-04
JP6171613B2 true JP6171613B2 (ja) 2017-08-02

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JP2013130077A Active JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

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JP (1) JP6171613B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311727B1 (ko) * 2019-05-29 2021-10-13 서울대학교산학협력단 전자 장치 및 스탬핑과 자기장 정렬을 이용한 전자 소자의 전사 방법
JP7060809B2 (ja) * 2019-11-12 2022-04-27 日亜化学工業株式会社 半導体装置の製造方法
US12009339B2 (en) 2020-08-18 2024-06-11 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650746B2 (ja) * 1986-08-06 1994-06-29 三菱電機株式会社 樹脂ボンデイング装置におけるボンデイング樹脂面の調整装置
JPH0645658A (ja) * 1992-07-24 1994-02-18 Ricoh Co Ltd 半導体素子接着基板
JP3393708B2 (ja) * 1994-07-06 2003-04-07 イビデン株式会社 半導体パッケージの製造方法
JP2004146698A (ja) * 2002-10-25 2004-05-20 Ueno Seiki Kk ペースト材料の転写装置及び転写方法
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
JP4867548B2 (ja) * 2006-09-22 2012-02-01 ソニー株式会社 塗布装置、実装装置及び電子部品の製造方法
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
JP2011077164A (ja) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd 半導体発光装置
JP2013062337A (ja) * 2011-09-13 2013-04-04 Toshiba Corp 発光装置

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JP2015005625A (ja) 2015-01-08

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