JP2015005625A5 - - Google Patents

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Publication number
JP2015005625A5
JP2015005625A5 JP2013130077A JP2013130077A JP2015005625A5 JP 2015005625 A5 JP2015005625 A5 JP 2015005625A5 JP 2013130077 A JP2013130077 A JP 2013130077A JP 2013130077 A JP2013130077 A JP 2013130077A JP 2015005625 A5 JP2015005625 A5 JP 2015005625A5
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JP
Japan
Prior art keywords
stamp
light emitting
manufacturing
emitting device
adhesive
Prior art date
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Application number
JP2013130077A
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English (en)
Japanese (ja)
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JP2015005625A (ja
JP6171613B2 (ja
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Priority to JP2013130077A priority Critical patent/JP6171613B2/ja
Priority claimed from JP2013130077A external-priority patent/JP6171613B2/ja
Publication of JP2015005625A publication Critical patent/JP2015005625A/ja
Publication of JP2015005625A5 publication Critical patent/JP2015005625A5/ja
Application granted granted Critical
Publication of JP6171613B2 publication Critical patent/JP6171613B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013130077A 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置 Active JP6171613B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013130077A JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Publications (3)

Publication Number Publication Date
JP2015005625A JP2015005625A (ja) 2015-01-08
JP2015005625A5 true JP2015005625A5 (enExample) 2016-08-04
JP6171613B2 JP6171613B2 (ja) 2017-08-02

Family

ID=52301289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013130077A Active JP6171613B2 (ja) 2013-06-21 2013-06-21 発光装置の製造方法及び発光装置

Country Status (1)

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JP (1) JP6171613B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102311727B1 (ko) * 2019-05-29 2021-10-13 서울대학교산학협력단 전자 장치 및 스탬핑과 자기장 정렬을 이용한 전자 소자의 전사 방법
JP7060809B2 (ja) * 2019-11-12 2022-04-27 日亜化学工業株式会社 半導体装置の製造方法
US12009339B2 (en) 2020-08-18 2024-06-11 Seoul National University R&Db Foundation Electronic device and method of transferring electronic element using stamping and magnetic field alignment

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0650746B2 (ja) * 1986-08-06 1994-06-29 三菱電機株式会社 樹脂ボンデイング装置におけるボンデイング樹脂面の調整装置
JPH0645658A (ja) * 1992-07-24 1994-02-18 Ricoh Co Ltd 半導体素子接着基板
JP3393708B2 (ja) * 1994-07-06 2003-04-07 イビデン株式会社 半導体パッケージの製造方法
JP2004146698A (ja) * 2002-10-25 2004-05-20 Ueno Seiki Kk ペースト材料の転写装置及び転写方法
JP2007258324A (ja) * 2006-03-22 2007-10-04 Matsushita Electric Ind Co Ltd 発光装置の製造方法および発光装置
JP4867548B2 (ja) * 2006-09-22 2012-02-01 ソニー株式会社 塗布装置、実装装置及び電子部品の製造方法
KR101438826B1 (ko) * 2008-06-23 2014-09-05 엘지이노텍 주식회사 발광장치
JP2011077164A (ja) * 2009-09-29 2011-04-14 Sanken Electric Co Ltd 半導体発光装置
JP2013062337A (ja) * 2011-09-13 2013-04-04 Toshiba Corp 発光装置

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