JP6170879B2 - 歪みゲージ圧力センサ - Google Patents
歪みゲージ圧力センサ Download PDFInfo
- Publication number
- JP6170879B2 JP6170879B2 JP2014110839A JP2014110839A JP6170879B2 JP 6170879 B2 JP6170879 B2 JP 6170879B2 JP 2014110839 A JP2014110839 A JP 2014110839A JP 2014110839 A JP2014110839 A JP 2014110839A JP 6170879 B2 JP6170879 B2 JP 6170879B2
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- neck
- base
- pressure sensor
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 9
- 238000005553 drilling Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014110839A JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014110839A JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015225002A JP2015225002A (ja) | 2015-12-14 |
| JP2015225002A5 JP2015225002A5 (enExample) | 2017-06-22 |
| JP6170879B2 true JP6170879B2 (ja) | 2017-07-26 |
Family
ID=54841843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014110839A Expired - Fee Related JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6170879B2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017525961A (ja) * | 2014-08-19 | 2017-09-07 | タイコ エレクトロニクス アンプ コリア カンパニー リミテッドTyco Electronics AMP Korea Co.,Ltd | 圧力センサ |
| JP2018189642A (ja) * | 2017-05-04 | 2018-11-29 | センサータ テクノロジーズ インコーポレーテッド | 統合された圧力および温度センサ |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6992482B2 (ja) * | 2017-12-18 | 2022-01-13 | 富士電機株式会社 | 圧力センサ |
| CN110349738B (zh) * | 2019-07-12 | 2020-06-30 | 安第斯新材料科技(浙江)有限公司 | 一种利用电阻变化保护单晶硅差压变送器内的电子元件 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077008B2 (en) * | 2004-07-02 | 2006-07-18 | Honeywell International Inc. | Differential pressure measurement using backside sensing and a single ASIC |
| KR20070059108A (ko) * | 2004-08-23 | 2007-06-11 | 허니웰 인터내셔널 인코포레이티드 | 미세가공된 절대 압력 감지 다이를 이용한 배출 가스재순환 시스템 |
| JP2008151738A (ja) * | 2006-12-20 | 2008-07-03 | Denso Corp | 圧力センサ |
| DE102007031980A1 (de) * | 2007-07-10 | 2009-01-15 | Robert Bosch Gmbh | Anschlusseinheit für eine Druckmesszelle |
| EP2390641B1 (en) * | 2010-05-27 | 2019-06-26 | Sensata Technologies, Inc. | Pressure Sensor |
| DE102010041169A1 (de) * | 2010-09-22 | 2012-03-22 | Robert Bosch Gmbh | Drucksensor, insbesondere für Bremsvorrichtung |
| US20130192379A1 (en) * | 2012-01-27 | 2013-08-01 | Neil S. Petrarca | Small form factor microfused silicon strain gage (msg) pressure sensor packaging |
-
2014
- 2014-05-29 JP JP2014110839A patent/JP6170879B2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017525961A (ja) * | 2014-08-19 | 2017-09-07 | タイコ エレクトロニクス アンプ コリア カンパニー リミテッドTyco Electronics AMP Korea Co.,Ltd | 圧力センサ |
| JP2018189642A (ja) * | 2017-05-04 | 2018-11-29 | センサータ テクノロジーズ インコーポレーテッド | 統合された圧力および温度センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015225002A (ja) | 2015-12-14 |
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