JP2015225002A5 - - Google Patents
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- Publication number
- JP2015225002A5 JP2015225002A5 JP2014110839A JP2014110839A JP2015225002A5 JP 2015225002 A5 JP2015225002 A5 JP 2015225002A5 JP 2014110839 A JP2014110839 A JP 2014110839A JP 2014110839 A JP2014110839 A JP 2014110839A JP 2015225002 A5 JP2015225002 A5 JP 2015225002A5
- Authority
- JP
- Japan
- Prior art keywords
- diaphragm
- neck
- pressure sensor
- base
- bonding pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims 12
- 238000005553 drilling Methods 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000003754 machining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014110839A JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014110839A JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015225002A JP2015225002A (ja) | 2015-12-14 |
| JP2015225002A5 true JP2015225002A5 (enExample) | 2017-06-22 |
| JP6170879B2 JP6170879B2 (ja) | 2017-07-26 |
Family
ID=54841843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014110839A Expired - Fee Related JP6170879B2 (ja) | 2014-05-29 | 2014-05-29 | 歪みゲージ圧力センサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6170879B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102232405B1 (ko) * | 2014-08-19 | 2021-03-26 | 타이코에이엠피 주식회사 | 압력 센서 |
| US10545064B2 (en) * | 2017-05-04 | 2020-01-28 | Sensata Technologies, Inc. | Integrated pressure and temperature sensor |
| JP6992482B2 (ja) * | 2017-12-18 | 2022-01-13 | 富士電機株式会社 | 圧力センサ |
| CN110349738B (zh) * | 2019-07-12 | 2020-06-30 | 安第斯新材料科技(浙江)有限公司 | 一种利用电阻变化保护单晶硅差压变送器内的电子元件 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7077008B2 (en) * | 2004-07-02 | 2006-07-18 | Honeywell International Inc. | Differential pressure measurement using backside sensing and a single ASIC |
| KR20070059108A (ko) * | 2004-08-23 | 2007-06-11 | 허니웰 인터내셔널 인코포레이티드 | 미세가공된 절대 압력 감지 다이를 이용한 배출 가스재순환 시스템 |
| JP2008151738A (ja) * | 2006-12-20 | 2008-07-03 | Denso Corp | 圧力センサ |
| DE102007031980A1 (de) * | 2007-07-10 | 2009-01-15 | Robert Bosch Gmbh | Anschlusseinheit für eine Druckmesszelle |
| EP2390641B1 (en) * | 2010-05-27 | 2019-06-26 | Sensata Technologies, Inc. | Pressure Sensor |
| DE102010041169A1 (de) * | 2010-09-22 | 2012-03-22 | Robert Bosch Gmbh | Drucksensor, insbesondere für Bremsvorrichtung |
| US20130192379A1 (en) * | 2012-01-27 | 2013-08-01 | Neil S. Petrarca | Small form factor microfused silicon strain gage (msg) pressure sensor packaging |
-
2014
- 2014-05-29 JP JP2014110839A patent/JP6170879B2/ja not_active Expired - Fee Related
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