JP6157440B2 - 加熱硬化型導電性ペースト - Google Patents
加熱硬化型導電性ペースト Download PDFInfo
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- JP6157440B2 JP6157440B2 JP2014235003A JP2014235003A JP6157440B2 JP 6157440 B2 JP6157440 B2 JP 6157440B2 JP 2014235003 A JP2014235003 A JP 2014235003A JP 2014235003 A JP2014235003 A JP 2014235003A JP 6157440 B2 JP6157440 B2 JP 6157440B2
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- epoxy resin
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- catalyst
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| TW104133323A TWI690556B (zh) | 2014-11-19 | 2015-10-12 | 加熱硬化型導電性糊以及導電性被膜 |
| CN201510796215.3A CN105609162B (zh) | 2014-11-19 | 2015-11-18 | 加热固化型导电性糊剂 |
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| JP6705046B1 (ja) | 2019-12-12 | 2020-06-03 | 株式会社ノリタケカンパニーリミテド | 低温成形用導電性組成物および導電膜付き基板 |
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| JP4507750B2 (ja) * | 2004-08-05 | 2010-07-21 | 昭栄化学工業株式会社 | 導電性ペースト |
| JP5651913B2 (ja) * | 2008-04-21 | 2015-01-14 | スリーボンドファインケミカル株式会社 | 導電性樹脂組成物 |
| JP5281529B2 (ja) * | 2009-09-28 | 2013-09-04 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物およびその導電性ペースト組成物を用いた電極並びに配線パターンの形成方法 |
| CN101928540B (zh) * | 2009-10-16 | 2013-07-10 | 北京工业大学 | 一种环氧导电胶及其制备方法 |
| JP4702499B1 (ja) * | 2010-02-05 | 2011-06-15 | 東洋インキＳｃホールディングス株式会社 | 導電性インキ、および導電パターン付き積層体とその製造方法 |
| JP6018733B2 (ja) * | 2010-04-14 | 2016-11-02 | Ｄｏｗａエレクトロニクス株式会社 | 熱硬化型導電性ペーストおよびその製造方法 |
| JP2012182111A (ja) * | 2011-02-28 | 2012-09-20 | Samsung Electro-Mechanics Co Ltd | 導電性金属ペースト組成物及びその製造方法 |
| JP5146567B2 (ja) * | 2011-05-30 | 2013-02-20 | 東洋インキＳｃホールディングス株式会社 | 導電性インキ、および導電パターン付き積層体とその製造方法 |
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