JP6150471B2 - Ｌｅｄパッケージ - Google Patents

Ｌｅｄパッケージ Download PDF

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Publication number
JP6150471B2
JP6150471B2 JP2012167296A JP2012167296A JP6150471B2 JP 6150471 B2 JP6150471 B2 JP 6150471B2 JP 2012167296 A JP2012167296 A JP 2012167296A JP 2012167296 A JP2012167296 A JP 2012167296A JP 6150471 B2 JP6150471 B2 JP 6150471B2
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JP
Japan
Prior art keywords
led
light
package
led chips
led package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012167296A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014027156A5 (enExample
JP2014027156A (ja
Inventor
福田　匡広
福田　　匡広
浩之 塚田
浩之 塚田
康生 中西
康生 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2012167296A priority Critical patent/JP6150471B2/ja
Publication of JP2014027156A publication Critical patent/JP2014027156A/ja
Publication of JP2014027156A5 publication Critical patent/JP2014027156A5/ja
Application granted granted Critical
Publication of JP6150471B2 publication Critical patent/JP6150471B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2012167296A 2012-07-27 2012-07-27 Ｌｅｄパッケージ Active JP6150471B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012167296A JP6150471B2 (ja) 2012-07-27 2012-07-27 Ｌｅｄパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012167296A JP6150471B2 (ja) 2012-07-27 2012-07-27 Ｌｅｄパッケージ

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2017011634A Division JP6324553B2 (ja) 2017-01-25 2017-01-25 Ｌｅｄパッケージ
JP2017011633A Division JP6324552B2 (ja) 2017-01-25 2017-01-25 Ｌｅｄパッケージ

Publications (3)

Publication Number Publication Date
JP2014027156A JP2014027156A (ja) 2014-02-06
JP2014027156A5 JP2014027156A5 (enExample) 2015-09-10
JP6150471B2 true JP6150471B2 (ja) 2017-06-21

Family

ID=50200534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012167296A Active JP6150471B2 (ja) 2012-07-27 2012-07-27 Ｌｅｄパッケージ

Country Status (1)

Country Link
JP (1) JP6150471B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0675625B2 (ja) 1991-03-11 1994-09-28 株式会社羽島 シャットルを備えた本縫いミシン

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6486726B2 (ja) * 2015-03-10 2019-03-20 シチズン時計株式会社 発光モジュール
JP6477149B2 (ja) * 2015-03-31 2019-03-06 日亜化学工業株式会社 発光装置
WO2016194405A1 (ja) * 2015-05-29 2016-12-08 シチズン電子株式会社 発光装置およびその製造方法
WO2016194876A1 (ja) * 2015-05-29 2016-12-08 シチズン電子株式会社 発光装置およびその製造方法
JP2022022640A (ja) 2020-06-30 2022-02-07 株式会社エンプラス 白色ｌｅｄパッケージ、発光装置、面光源装置および表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1197742A (ja) * 1997-09-22 1999-04-09 Nichia Chem Ind Ltd 窒化物半導体素子
JP3604550B2 (ja) * 1997-12-16 2004-12-22 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP2007019096A (ja) * 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
JP5326705B2 (ja) * 2009-03-17 2013-10-30 日亜化学工業株式会社 発光装置
JP2011134934A (ja) * 2009-12-25 2011-07-07 Toshiba Lighting & Technology Corp 発光モジュールおよび照明装置
JP5612991B2 (ja) * 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0675625B2 (ja) 1991-03-11 1994-09-28 株式会社羽島 シャットルを備えた本縫いミシン

Also Published As

Publication number Publication date
JP2014027156A (ja) 2014-02-06

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