JP6149476B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6149476B2
JP6149476B2 JP2013082252A JP2013082252A JP6149476B2 JP 6149476 B2 JP6149476 B2 JP 6149476B2 JP 2013082252 A JP2013082252 A JP 2013082252A JP 2013082252 A JP2013082252 A JP 2013082252A JP 6149476 B2 JP6149476 B2 JP 6149476B2
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dicing
repellent film
semiconductor chip
water repellent
semiconductor device
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JP2013082252A
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Japanese (ja)
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JP2014207256A (ja
JP2014207256A5 (enExample
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佳明 鍋島
佳明 鍋島
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H10W72/07351—
    • H10W72/30—

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  • Die Bonding (AREA)
JP2013082252A 2013-04-10 2013-04-10 半導体装置の製造方法 Expired - Fee Related JP6149476B2 (ja)

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JP2013082252A JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

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Application Number Priority Date Filing Date Title
JP2013082252A JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

Publications (3)

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JP2014207256A JP2014207256A (ja) 2014-10-30
JP2014207256A5 JP2014207256A5 (enExample) 2016-03-31
JP6149476B2 true JP6149476B2 (ja) 2017-06-21

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JP2013082252A Expired - Fee Related JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6867796B2 (ja) * 2016-12-19 2021-05-12 ローム株式会社 センサモジュールおよびセンサモジュールの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109872A (en) * 1976-03-11 1977-09-14 Matsushita Electronics Corp Semiconductor device
JPH04336435A (ja) * 1991-05-13 1992-11-24 Mitsubishi Electric Corp 半導体装置用リードフレーム
JP2009184067A (ja) * 2008-02-06 2009-08-20 Mitsubishi Electric Corp 中空構造を有する装置およびその製造方法
JP5621369B2 (ja) * 2010-07-12 2014-11-12 株式会社リコー 面発光レーザ素子、光走査装置及び画像形成装置
US8592999B2 (en) * 2011-01-13 2013-11-26 Infineon Technologies Ag Semiconductor chip and method for fabricating the same

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JP2014207256A (ja) 2014-10-30

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