JP2014207256A5 - - Google Patents

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Publication number
JP2014207256A5
JP2014207256A5 JP2013082252A JP2013082252A JP2014207256A5 JP 2014207256 A5 JP2014207256 A5 JP 2014207256A5 JP 2013082252 A JP2013082252 A JP 2013082252A JP 2013082252 A JP2013082252 A JP 2013082252A JP 2014207256 A5 JP2014207256 A5 JP 2014207256A5
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JP
Japan
Prior art keywords
dicing
water repellent
semiconductor chip
repellent film
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013082252A
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English (en)
Japanese (ja)
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JP2014207256A (ja
JP6149476B2 (ja
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Priority to JP2013082252A priority Critical patent/JP6149476B2/ja
Priority claimed from JP2013082252A external-priority patent/JP6149476B2/ja
Publication of JP2014207256A publication Critical patent/JP2014207256A/ja
Publication of JP2014207256A5 publication Critical patent/JP2014207256A5/ja
Application granted granted Critical
Publication of JP6149476B2 publication Critical patent/JP6149476B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013082252A 2013-04-10 2013-04-10 半導体装置の製造方法 Expired - Fee Related JP6149476B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013082252A JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013082252A JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2014207256A JP2014207256A (ja) 2014-10-30
JP2014207256A5 true JP2014207256A5 (enExample) 2016-03-31
JP6149476B2 JP6149476B2 (ja) 2017-06-21

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ID=52120621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013082252A Expired - Fee Related JP6149476B2 (ja) 2013-04-10 2013-04-10 半導体装置の製造方法

Country Status (1)

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JP (1) JP6149476B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6867796B2 (ja) * 2016-12-19 2021-05-12 ローム株式会社 センサモジュールおよびセンサモジュールの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52109872A (en) * 1976-03-11 1977-09-14 Matsushita Electronics Corp Semiconductor device
JPH04336435A (ja) * 1991-05-13 1992-11-24 Mitsubishi Electric Corp 半導体装置用リードフレーム
JP2009184067A (ja) * 2008-02-06 2009-08-20 Mitsubishi Electric Corp 中空構造を有する装置およびその製造方法
JP5621369B2 (ja) * 2010-07-12 2014-11-12 株式会社リコー 面発光レーザ素子、光走査装置及び画像形成装置
US8592999B2 (en) * 2011-01-13 2013-11-26 Infineon Technologies Ag Semiconductor chip and method for fabricating the same

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