JP6140364B2 - レセプタクルコネクタ及びコネクタシステム - Google Patents
レセプタクルコネクタ及びコネクタシステム Download PDFInfo
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- JP6140364B2 JP6140364B2 JP2016510784A JP2016510784A JP6140364B2 JP 6140364 B2 JP6140364 B2 JP 6140364B2 JP 2016510784 A JP2016510784 A JP 2016510784A JP 2016510784 A JP2016510784 A JP 2016510784A JP 6140364 B2 JP6140364 B2 JP 6140364B2
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- 230000013011 mating Effects 0.000 claims description 7
- 239000003570 air Substances 0.000 description 26
- 238000001816 cooling Methods 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 230000000712 assembly Effects 0.000 description 10
- 238000000429 assembly Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
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- 230000008859 change Effects 0.000 description 2
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- 239000012080 ambient air Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 239000013307 optical fiber Substances 0.000 description 1
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- 230000000704 physical effect Effects 0.000 description 1
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- 238000012552 review Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
- H01R24/30—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable with additional earth or shield contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Description
本出願は、2013年4月24日に出願された米国仮特許出願第61/815,565号、および2013年12月6日に出願された米国仮特許出願第61/913,008号に対する優先権を主張するものであり、これら両方ともに、全体が参照により本明細書に組み込まれる。
Claims (5)
- 前面にカードスロットを有する筐体であって、前記カードスロットが、第1の側および第2の側を有し、前記筐体が、複数の端子を支持し、該端子のうちのいくつかが前記第1の側に位置決めされ、前記端子の他のものが前記第2の側に位置決めされる、筐体と、
ポートを画定するケージであって、該ケージが、前縁および後壁を有し、前記ケージが、前記筐体が前記後壁に隣接するように前記筐体の周囲に位置決めされ、前記ポートが、前記前縁から前記筐体まで延在し、前記ポートが、第1の内周を有する前記前縁にポート入口と、前記筐体に隣接する第2の内周を有するモジュール入口とを有し、前記ポートが、前記前縁と前記前面との間の位置で前記第1の内周から前記第2の内周へ移行し、該第2の内周が、前記第1の内周より小さい、ケージと、を備える、レセプタクルコネクタ。 - 前記ポートは、前記モジュール入口内に位置決めされた電磁妨害(EMI)ガスケットをさらに含み、該EMIガスケットは、動作中、EMIを低減するのに役立つように挿入されたプラグコネクタの周辺に係合するように構成される、請求項1に記載のレセプタクルコネクタ。
- 前記ポートは、前記第1の内周と前記第2の内周との間に延在する通気壁を含み、該通気壁は、前記ポート入口を通じて流入し、前記通気壁を通じて流出する空気を許容するように構成される、請求項1に記載のレセプタクルコネクタ。
- 前記通気壁は、複数の開孔を含む、請求項3に記載のレセプタクルコネクタ。
- 前面にカードスロットを有する筐体であって、前記カードスロットが、第1の側および第2の側を有し、前記筐体が、複数の端子を支持し、該端子のうちのいくつかが前記第1の側に位置決めされ、前記端子の他のものが前記第2の側に位置決めされる、筐体と、
ポートを画定するケージであって、該ケージが、前縁および後壁を有し、前記ケージが、前記筐体が前記後壁に隣接するように前記筐体の周囲に位置決めされ、前記ポートが、前記前縁から前記筐体まで延在し、前記ポートが、第1の内周を有する前記前縁にポート入口と、前記筐体に隣接する第2の内周を有するモジュール入口とを有し、前記ポートが、前記前縁と前記前面との間の位置で前記第1の内周から前記第2の内周へ移行し、該第2の内周が、前記第1の内周より小さく、前記ケージが、開孔を有する通気壁を含む、ケージと、
嵌合面を有する本体を含むモジュールであって、前記本体が、第1の側に熱表面を有し、前記モジュールが、前記本体内に位置決めされ、かつ前記熱表面から前記嵌合面に隣接する位置まで延在するパドルカードと、前記本体内に位置決めされた回路とを有し、該回路が、少なくとも1ワットの熱エネルギーを放出するように構成され、前記回路が、前記熱表面に熱的に接続され、該熱表面が、前記前縁と前記通気壁との間に整列する、モジュールと、を備える、コネクタシステム。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361815565P | 2013-04-24 | 2013-04-24 | |
US61/815,565 | 2013-04-24 | ||
US201361913008P | 2013-12-06 | 2013-12-06 | |
US61/913,008 | 2013-12-06 | ||
PCT/US2014/035304 WO2014176429A1 (en) | 2013-04-24 | 2014-04-24 | Connector system with thermal surface |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017089601A Division JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016518688A JP2016518688A (ja) | 2016-06-23 |
JP6140364B2 true JP6140364B2 (ja) | 2017-05-31 |
Family
ID=51792388
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510784A Active JP6140364B2 (ja) | 2013-04-24 | 2014-04-24 | レセプタクルコネクタ及びコネクタシステム |
JP2017089601A Active JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
JP2019203663A Active JP7304268B2 (ja) | 2013-04-24 | 2019-11-11 | モジュールを冷却する方法 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017089601A Active JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
JP2019203663A Active JP7304268B2 (ja) | 2013-04-24 | 2019-11-11 | モジュールを冷却する方法 |
Country Status (8)
Country | Link |
---|---|
US (3) | US9882297B2 (ja) |
EP (1) | EP2989691A4 (ja) |
JP (3) | JP6140364B2 (ja) |
KR (1) | KR101820811B1 (ja) |
CN (2) | CN105474474B (ja) |
MY (1) | MY181289A (ja) |
TW (1) | TW201503494A (ja) |
WO (1) | WO2014176429A1 (ja) |
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EP2989691A4 (en) | 2016-12-07 |
JP6851896B2 (ja) | 2021-03-31 |
KR20160009574A (ko) | 2016-01-26 |
US20190074618A1 (en) | 2019-03-07 |
US20180151970A1 (en) | 2018-05-31 |
CN105474474A (zh) | 2016-04-06 |
CN108336526A (zh) | 2018-07-27 |
TWI563744B (ja) | 2016-12-21 |
JP2016518688A (ja) | 2016-06-23 |
US10403993B2 (en) | 2019-09-03 |
KR101820811B1 (ko) | 2018-01-22 |
US10122106B2 (en) | 2018-11-06 |
US20160149324A1 (en) | 2016-05-26 |
JP7304268B2 (ja) | 2023-07-06 |
JP2020043082A (ja) | 2020-03-19 |
CN108336526B (zh) | 2020-02-21 |
JP2017152400A (ja) | 2017-08-31 |
US9882297B2 (en) | 2018-01-30 |
EP2989691A1 (en) | 2016-03-02 |
WO2014176429A1 (en) | 2014-10-30 |
CN105474474B (zh) | 2018-06-26 |
TW201503494A (zh) | 2015-01-16 |
MY181289A (en) | 2020-12-21 |
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