JP2020043082A - モジュールを冷却する方法 - Google Patents
モジュールを冷却する方法 Download PDFInfo
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- JP2020043082A JP2020043082A JP2019203663A JP2019203663A JP2020043082A JP 2020043082 A JP2020043082 A JP 2020043082A JP 2019203663 A JP2019203663 A JP 2019203663A JP 2019203663 A JP2019203663 A JP 2019203663A JP 2020043082 A JP2020043082 A JP 2020043082A
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- thermal
- plug connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/28—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
- H01R24/30—Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable with additional earth or shield contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Abstract
Description
本出願は、2013年4月24日に出願された米国仮特許出願第61/815,565号、および2013年12月6日に出願された米国仮特許出願第61/913,008号に対する優先権を主張するものであり、これら両方ともに、全体が参照により本明細書に組み込まれる。
Claims (10)
- 嵌合端に嵌合面を有する本体であって、該本体は、細長く、挿入方向と平行な第1の方向に延在し、前記本体は、第1の側に熱表面を有し、該熱表面は、その熱表面積が増加するように構成された突起した構造を有し、該突起した構造は、前記第1の側に沿って前記嵌合端に向けて延在する、本体と、
該本体内に位置決めされ、前記嵌合面の付近にまで延在するパドルカードと、
前記本体内に位置決めされ、発熱構成要素を含む回路であって、前記発熱構成要素は、該発熱構成要素と前記熱表面との間に熱抵抗を低下させる様式で、前記熱表面と熱的に連結される、回路と、を備え、
前記熱表面は、対応する平面より少なくとも50%大きい表面積を含む、プラグコネクタ。 - 前記パドルカードは第1のパドルカードであり、前記本体は第2のパドルカードを更に支持する、請求項1に記載のプラグコネクタ。
- 前記本体は、第1の距離である高さを有し、前記熱表面は、前記第1の距離の少なくとも半分である第2の距離だけ前記第1の側の上方に延在する、請求項1に記載のプラグコネクタ。
- 前記本体は、該本体の嵌合端において、前記パドルカードの嵌合端を越えて延在する、請求項1に記載のプラグコネクタ。
- 前記熱表面の熱表面積が増加するように構成された構造は、フィンである、請求項1に記載のプラグコネクタ。
- 前記熱表面の熱表面積が増加するように構成された構造は、メッシュを有する、請求項1に記載のプラグコネクタ。
- 前記熱表面の熱表面積が増加するように構成された構造は、ハニカムを有する、請求項1に記載のプラグコネクタ。
- 前記熱表面は、対応する平面より少なくとも100%大きい表面積を含む、請求項1に記載のプラグコネクタ。
- 前記発熱構成要素は、前記回路に含まれる構成要素のうちで最大の熱エネルギーを放出するように構成される、請求項1に記載のプラグコネクタ。
- 前記発熱構成要素は、少なくとも1ワットの熱エネルギーを放出するように構成される、請求項1に記載のプラグコネクタ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361815565P | 2013-04-24 | 2013-04-24 | |
US61/815,565 | 2013-04-24 | ||
US201361913008P | 2013-12-06 | 2013-12-06 | |
US61/913,008 | 2013-12-06 | ||
JP2017089601A JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017089601A Division JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020043082A true JP2020043082A (ja) | 2020-03-19 |
JP7304268B2 JP7304268B2 (ja) | 2023-07-06 |
Family
ID=51792388
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510784A Active JP6140364B2 (ja) | 2013-04-24 | 2014-04-24 | レセプタクルコネクタ及びコネクタシステム |
JP2017089601A Active JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
JP2019203663A Active JP7304268B2 (ja) | 2013-04-24 | 2019-11-11 | モジュールを冷却する方法 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510784A Active JP6140364B2 (ja) | 2013-04-24 | 2014-04-24 | レセプタクルコネクタ及びコネクタシステム |
JP2017089601A Active JP6851896B2 (ja) | 2013-04-24 | 2017-04-28 | モジュールを冷却する方法 |
Country Status (8)
Country | Link |
---|---|
US (3) | US9882297B2 (ja) |
EP (1) | EP2989691A4 (ja) |
JP (3) | JP6140364B2 (ja) |
KR (1) | KR101820811B1 (ja) |
CN (2) | CN108336526B (ja) |
MY (1) | MY181289A (ja) |
TW (1) | TW201503494A (ja) |
WO (1) | WO2014176429A1 (ja) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108336526B (zh) | 2013-04-24 | 2020-02-21 | 莫列斯有限公司 | 具有热表面的连接器系统 |
WO2014199532A1 (ja) * | 2013-06-10 | 2014-12-18 | 三菱電機株式会社 | ハニカムサンドイッチ構造体およびハニカムサンドイッチ構造体の製造方法 |
JP6679481B2 (ja) * | 2013-11-12 | 2020-04-15 | モレックス エルエルシー | 熱構成されたコネクタシステム |
WO2015148786A1 (en) * | 2014-03-27 | 2015-10-01 | Molex Incorporated | Thermally efficient connector system |
US11079560B2 (en) * | 2014-11-26 | 2021-08-03 | Hewlett Packard Enterprise Development Lp | Transceiver module |
TWI612733B (zh) * | 2014-12-23 | 2018-01-21 | Molex Llc | 插座、插頭模組及連接器系統 |
US9419380B2 (en) * | 2015-01-16 | 2016-08-16 | Tyco Electronics Corporation | Pluggable module for a communication system |
US9509102B2 (en) * | 2015-01-16 | 2016-11-29 | Tyco Electronics Corporation | Pluggable module for a communication system |
US9389368B1 (en) * | 2015-04-07 | 2016-07-12 | Tyco Electronics Corporation | Receptacle assembly and set of receptacle assemblies for a communication system |
US9407046B1 (en) * | 2015-05-15 | 2016-08-02 | Tyco Electronics Corporation | Electrical connector assembly |
US9391407B1 (en) * | 2015-06-12 | 2016-07-12 | Tyco Electronics Corporation | Electrical connector assembly having stepped surface |
CN110531473A (zh) | 2015-09-10 | 2019-12-03 | 申泰公司 | 具有高热消散模块的机架安装式设备和具有增加的冷却的收发器插座 |
US9484678B1 (en) * | 2015-09-22 | 2016-11-01 | Tyco Electronics Corporation | Electrical cage member having standoff features |
US9673570B2 (en) * | 2015-09-22 | 2017-06-06 | Te Connectivity Corporation | Stacked cage having different size ports |
US10283885B2 (en) | 2015-11-06 | 2019-05-07 | Foxconn Interconnect Technology Limited | Electrical connector assembly and system using the same |
US10164362B2 (en) | 2015-12-31 | 2018-12-25 | Foxconn Interconnect Technology Limited | Plug connecetor with a metallic enclosure having heat sink member thereon |
US9668379B1 (en) * | 2016-04-14 | 2017-05-30 | Te Connectivity Corporation | Heat spreader for a caged electrical connector assembly |
US10153629B2 (en) * | 2016-07-21 | 2018-12-11 | Abb Schweiz Ag | Thermal cooling interface for electrical joints |
US20180034211A1 (en) * | 2016-07-26 | 2018-02-01 | Foxconn Interconnect Technology Limited | Electrical connector assembly |
US9893474B1 (en) * | 2016-10-12 | 2018-02-13 | International Business Machines Corporation | Active cable heat sink |
CN107046206B (zh) * | 2017-01-23 | 2021-07-20 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
US10104760B1 (en) * | 2017-06-12 | 2018-10-16 | Te Connectivity Corporation | Pluggable module having cooling channel with heat transfer fins |
US10644472B2 (en) * | 2017-06-28 | 2020-05-05 | Mellanox Technologies, Ltd. | Cable adapter |
CN107546540B (zh) * | 2017-07-13 | 2019-10-01 | 番禺得意精密电子工业有限公司 | 插头连接器组件 |
CN108281831B (zh) * | 2018-01-23 | 2020-05-12 | 泰科电子(上海)有限公司 | 插座组件和传热组件 |
US10705309B2 (en) | 2018-06-06 | 2020-07-07 | Mellanox Technologies, Ltd. | RF EMI reducing fiber cable assembly |
US11088715B2 (en) * | 2018-08-31 | 2021-08-10 | TE Connectivity Services Gmbh | Communication system having a receptacle cage with an airflow channel |
CN111478094B (zh) * | 2019-01-21 | 2022-09-09 | 莫列斯有限公司 | 具有散热器的四通道小型可插拔双密度收发模块 |
US10741954B1 (en) | 2019-03-17 | 2020-08-11 | Mellanox Technologies, Ltd. | Multi-form-factor connector |
TWI735857B (zh) | 2019-03-29 | 2021-08-11 | 佳必琪國際股份有限公司 | 小型可插拔連接器殼體結構 |
CN110416808A (zh) * | 2019-07-10 | 2019-11-05 | 安徽迅科智能技术有限公司 | 一种弱电系统接线器 |
US11374363B2 (en) | 2019-09-04 | 2022-06-28 | TE Connectivity Services Gmbh | Pluggable module having EMI prevention fins in airflow channel |
CN110703392A (zh) * | 2019-09-05 | 2020-01-17 | 苏州浪潮智能科技有限公司 | 一种交换机光模块散热装置 |
US10942323B1 (en) * | 2019-09-20 | 2021-03-09 | Inphi Corporation | Apparatus and method for thermal dissipation of photonic transceiving module |
US11063391B2 (en) | 2019-10-11 | 2021-07-13 | TE Connectivity Services Gmbh | Circuit card assemblies for a communication system |
US10952355B1 (en) * | 2019-10-16 | 2021-03-16 | Juniper Networks, Inc | Apparatus, system, and method for electromagnetic interference mitigation in optical module cages |
US11169330B2 (en) | 2019-10-24 | 2021-11-09 | Mellanox Technologies Tlv Ltd. | Wavelength-splitting optical cable |
TWM599039U (zh) * | 2020-02-07 | 2020-07-21 | 貿聯國際股份有限公司 | 具有鰭片組的連接器 |
US11774693B2 (en) * | 2020-06-10 | 2023-10-03 | Molex, Llc | Optical transceiver modules and heat management techniques therefor |
US11249264B2 (en) * | 2020-07-02 | 2022-02-15 | Google Llc | Thermal optimizations for OSFP optical transceiver modules |
US11374339B2 (en) * | 2020-09-18 | 2022-06-28 | TE Connectivity Services Gmbh | Circuit card locating features for pluggable module |
US11199669B1 (en) * | 2020-09-24 | 2021-12-14 | Hewlett Packard Enterprise Development Lp | Modular faceplate optical sub-assembly |
JP2022053699A (ja) * | 2020-09-25 | 2022-04-06 | 富士通オプティカルコンポーネンツ株式会社 | 光通信モジュール |
CN114325962B (zh) * | 2020-09-29 | 2023-04-07 | 华为技术有限公司 | 一种光模块组件和通信设备 |
US11327257B1 (en) * | 2020-10-22 | 2022-05-10 | Mellanox Technologies, Ltd. | Networking communication adapter |
US11650385B2 (en) * | 2021-02-03 | 2023-05-16 | Cisco Technology, Inc. | Optical module cages mounted for optimal density and cooling |
US11852879B2 (en) * | 2022-01-18 | 2023-12-26 | Prime World International Holdings Ltd. | Optical transceiver with internal gas flow passage for heat dissipation |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0644049U (ja) * | 1992-11-10 | 1994-06-10 | 日本航空電子工業株式会社 | 放熱フィン付コネクタ |
JP2002328269A (ja) * | 2001-03-15 | 2002-11-15 | Agilent Technol Inc | 光トランシーバモジュール |
JP3122917U (ja) * | 2005-11-18 | 2006-06-29 | 穩態科技股▲ふん▼有限公司 | 放熱装置 |
US20060246766A1 (en) * | 2003-06-27 | 2006-11-02 | Neer Jay H | Adapter module |
US7637672B1 (en) * | 2008-11-02 | 2009-12-29 | Broadway Networks, Ltd. | Pluggable optical tranceiver module having effective thermal release function |
JP2011527101A (ja) * | 2008-06-30 | 2011-10-20 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 構造的に複雑なモノリシック・ヒートシンク設計 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6062893A (en) * | 1998-06-04 | 2000-05-16 | Molex Incorporated | Adapter frame for an electrical connector |
US6069794A (en) * | 1999-02-08 | 2000-05-30 | Chuang; Wen-Hao | Bushing for combining fan and heat sink |
JP2001296457A (ja) * | 1999-10-07 | 2001-10-26 | Sumitomo Electric Ind Ltd | 光送受信器 |
US6870746B2 (en) * | 2002-11-06 | 2005-03-22 | Agilent Technologies, Inc. | Electronic module |
US7239515B2 (en) * | 2004-03-08 | 2007-07-03 | Nortel Networks Limited | Thermal assembly for cooling an electronics module |
JP2005316475A (ja) * | 2004-04-29 | 2005-11-10 | Sumitomo Electric Ind Ltd | 光トランシーバ |
US7147041B2 (en) * | 2004-05-03 | 2006-12-12 | Parker-Hannifin Corporation | Lightweight heat sink |
US7433193B2 (en) * | 2005-05-11 | 2008-10-07 | Cisco Technology, Inc. | Techniques for controlling a position of a transceiver module relative to a connector |
US7780361B2 (en) | 2008-04-02 | 2010-08-24 | Ciena Corporation | Card guide and heatsink assemblies for pluggable electro-optic modules |
US8035973B2 (en) * | 2009-08-31 | 2011-10-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage |
CN107069274B (zh) | 2010-05-07 | 2020-08-18 | 安费诺有限公司 | 高性能线缆连接器 |
US8382509B2 (en) * | 2010-08-06 | 2013-02-26 | Fci Americas Technology Llc | Electrical connector assembly including compliant heat sink |
US8393917B2 (en) * | 2010-10-25 | 2013-03-12 | Molex Incorporated | Connector system with airflow control |
CN108336526B (zh) * | 2013-04-24 | 2020-02-21 | 莫列斯有限公司 | 具有热表面的连接器系统 |
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2014
- 2014-04-24 CN CN201810054161.7A patent/CN108336526B/zh active Active
- 2014-04-24 US US14/392,106 patent/US9882297B2/en active Active
- 2014-04-24 JP JP2016510784A patent/JP6140364B2/ja active Active
- 2014-04-24 EP EP14787431.7A patent/EP2989691A4/en active Pending
- 2014-04-24 MY MYPI2015002637A patent/MY181289A/en unknown
- 2014-04-24 KR KR1020157033274A patent/KR101820811B1/ko active IP Right Grant
- 2014-04-24 CN CN201480035271.9A patent/CN105474474B/zh active Active
- 2014-04-24 TW TW103114850A patent/TW201503494A/zh unknown
- 2014-04-24 WO PCT/US2014/035304 patent/WO2014176429A1/en active Application Filing
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2017
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0644049U (ja) * | 1992-11-10 | 1994-06-10 | 日本航空電子工業株式会社 | 放熱フィン付コネクタ |
JP2002328269A (ja) * | 2001-03-15 | 2002-11-15 | Agilent Technol Inc | 光トランシーバモジュール |
US20060246766A1 (en) * | 2003-06-27 | 2006-11-02 | Neer Jay H | Adapter module |
JP3122917U (ja) * | 2005-11-18 | 2006-06-29 | 穩態科技股▲ふん▼有限公司 | 放熱装置 |
JP2011527101A (ja) * | 2008-06-30 | 2011-10-20 | アルカテル−ルーセント ユーエスエー インコーポレーテッド | 構造的に複雑なモノリシック・ヒートシンク設計 |
US7637672B1 (en) * | 2008-11-02 | 2009-12-29 | Broadway Networks, Ltd. | Pluggable optical tranceiver module having effective thermal release function |
Also Published As
Publication number | Publication date |
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CN105474474A (zh) | 2016-04-06 |
TW201503494A (zh) | 2015-01-16 |
EP2989691A4 (en) | 2016-12-07 |
CN108336526B (zh) | 2020-02-21 |
US20160149324A1 (en) | 2016-05-26 |
MY181289A (en) | 2020-12-21 |
US20190074618A1 (en) | 2019-03-07 |
US10122106B2 (en) | 2018-11-06 |
CN108336526A (zh) | 2018-07-27 |
KR20160009574A (ko) | 2016-01-26 |
KR101820811B1 (ko) | 2018-01-22 |
JP2016518688A (ja) | 2016-06-23 |
JP6140364B2 (ja) | 2017-05-31 |
JP6851896B2 (ja) | 2021-03-31 |
US9882297B2 (en) | 2018-01-30 |
EP2989691A1 (en) | 2016-03-02 |
WO2014176429A1 (en) | 2014-10-30 |
JP7304268B2 (ja) | 2023-07-06 |
CN105474474B (zh) | 2018-06-26 |
US10403993B2 (en) | 2019-09-03 |
JP2017152400A (ja) | 2017-08-31 |
US20180151970A1 (en) | 2018-05-31 |
TWI563744B (ja) | 2016-12-21 |
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