JP6137701B2 - バルク部品供給システム - Google Patents

バルク部品供給システム Download PDF

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Publication number
JP6137701B2
JP6137701B2 JP2014536481A JP2014536481A JP6137701B2 JP 6137701 B2 JP6137701 B2 JP 6137701B2 JP 2014536481 A JP2014536481 A JP 2014536481A JP 2014536481 A JP2014536481 A JP 2014536481A JP 6137701 B2 JP6137701 B2 JP 6137701B2
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JP
Japan
Prior art keywords
component
bulk
case
reservoir
related information
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Active
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JP2014536481A
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English (en)
Japanese (ja)
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JPWO2014045378A1 (ja
Inventor
瑞穂 野沢
瑞穂 野沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of JPWO2014045378A1 publication Critical patent/JPWO2014045378A1/ja
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Publication of JP6137701B2 publication Critical patent/JP6137701B2/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/021Loading or unloading of containers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • H05K13/028Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084Containers and magazines for components, e.g. tube-like magazines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/043Feeding one by one by other means than belts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53004Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y10T29/53009Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply with comparator
    • Y10T29/53013Computer input
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178Chip component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/53478Means to assemble or disassemble with magazine supply

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2014536481A 2012-09-20 2012-09-20 バルク部品供給システム Active JP6137701B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/074106 WO2014045378A1 (ja) 2012-09-20 2012-09-20 バルク部品供給システムおよびバルク部品補給方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017084082A Division JP6343062B2 (ja) 2017-04-21 2017-04-21 バルク部品補給方法

Publications (2)

Publication Number Publication Date
JPWO2014045378A1 JPWO2014045378A1 (ja) 2016-08-18
JP6137701B2 true JP6137701B2 (ja) 2017-05-31

Family

ID=50340733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014536481A Active JP6137701B2 (ja) 2012-09-20 2012-09-20 バルク部品供給システム

Country Status (5)

Country Link
US (1) US10080320B2 (zh)
EP (1) EP2900048B8 (zh)
JP (1) JP6137701B2 (zh)
CN (1) CN104641735B (zh)
WO (1) WO2014045378A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10039218B2 (en) * 2013-05-27 2018-07-31 Fuji Machine Mfg. Co., Ltd. Electronic circuit component mounting system
JP6373984B2 (ja) 2014-06-03 2018-08-15 株式会社Fuji ばら部品供給装置、ばら部品供給方法
JP6432036B2 (ja) * 2014-10-27 2018-12-05 パナソニックIpマネジメント株式会社 部品実装装置
WO2017033268A1 (ja) * 2015-08-25 2017-03-02 富士機械製造株式会社 部品実装ライン
JP6739446B2 (ja) * 2015-12-07 2020-08-12 株式会社Fuji 部品投入装置
JP6778261B2 (ja) * 2016-05-31 2020-10-28 株式会社Fuji 部品供給装置
CN109983858B (zh) 2016-11-29 2020-11-27 株式会社富士 元件供给系统及元件安装机
US11388848B2 (en) * 2017-05-18 2022-07-12 Fuji Corporation Component supply device
US20190111575A1 (en) * 2017-10-18 2019-04-18 Canon Kabushiki Kaisha Tool stocker, interchangeable tool, robot apparatus, robot system, control method of robot system, and storage medium
EP3726948A4 (en) * 2017-12-12 2020-12-09 Fuji Corporation DEVICE FOR FEEDING COMPONENTS AND METHOD FOR FEEDING COMPONENTS
WO2021090432A1 (ja) * 2019-11-07 2021-05-14 株式会社Fuji 部品補充装置
JP7426400B2 (ja) * 2019-11-14 2024-02-01 株式会社Fuji バルクフィーダおよび部品装着機
JP7340032B2 (ja) * 2019-11-14 2023-09-06 株式会社Fuji 部品装着機
DE102020100615B3 (de) * 2020-01-14 2021-06-17 Asm Assembly Systems Gmbh & Co. Kg Bauteilkassette, Annahmevorrichtung sowie System mit einer Bauteilkassette und einer Annahmevorrichtung.
DE102020100613B3 (de) * 2020-01-14 2021-05-12 Asm Assembly Systems Gmbh & Co. Kg Annahmevorrichtung, Bauteilkassette und System

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02296400A (ja) * 1989-05-11 1990-12-06 Nippondenso Co Ltd 異形部品自動組付装置
JPH05198970A (ja) * 1991-11-08 1993-08-06 Olympus Optical Co Ltd 電子部品自動段取装置
JP2545428Y2 (ja) * 1992-03-14 1997-08-25 太陽誘電株式会社 チップ状回路部品の補給容器
JP3079934B2 (ja) * 1995-01-23 2000-08-21 株式会社村田製作所 チップ部品の自動補給装置
JPH08204386A (ja) * 1995-01-23 1996-08-09 Murata Mfg Co Ltd チップ部品の整列供給装置
US5649356A (en) * 1995-09-22 1997-07-22 Universal Instruments Corporation Method and apparatus for supplying and placing components
JPH1146092A (ja) * 1997-05-29 1999-02-16 Taiyo Yuden Co Ltd 電子部品搭載装置
JPH11317599A (ja) * 1998-03-05 1999-11-16 Taiyo Yuden Co Ltd 電子部品配置方法及びその装置
JP2000022388A (ja) 1998-03-05 2000-01-21 Taiyo Yuden Co Ltd 電子部品配置装置
TW426306U (en) * 1998-03-05 2001-03-11 Taiyo Yuden Kk Electronic component placing apparatus
JP3459786B2 (ja) 1999-02-18 2003-10-27 富士機械製造株式会社 バルクフィーダおよびチップ供給システム
JP4320199B2 (ja) 2002-05-24 2009-08-26 富士機械製造株式会社 テープフィーダおよび電子部品供給システム
JP4320204B2 (ja) 2002-07-19 2009-08-26 富士機械製造株式会社 対基板作業システム
KR101074253B1 (ko) * 2003-08-26 2011-10-14 파나소닉 주식회사 부품 대조 방법 및 장치
CN1914969A (zh) * 2004-01-26 2007-02-14 株式会社帕普曼 电子元件自动安装装置以及元件库存管理装置
JP4752804B2 (ja) * 2007-04-17 2011-08-17 パナソニック株式会社 部品供給装置
JP4610674B1 (ja) * 2009-05-29 2011-01-12 太陽誘電株式会社 バルクフィーダ用部品収納ケース
JP5846468B2 (ja) 2010-03-30 2016-01-20 高知県公立大学法人 白質病変による運転適性診断装置

Also Published As

Publication number Publication date
US20150237772A1 (en) 2015-08-20
US10080320B2 (en) 2018-09-18
JPWO2014045378A1 (ja) 2016-08-18
EP2900048B1 (en) 2018-09-19
CN104641735A (zh) 2015-05-20
EP2900048B8 (en) 2018-11-14
EP2900048A4 (en) 2017-02-15
EP2900048A1 (en) 2015-07-29
CN104641735B (zh) 2017-09-19
WO2014045378A1 (ja) 2014-03-27

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