JP6125443B2 - 常温接合装置 - Google Patents

常温接合装置 Download PDF

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Publication number
JP6125443B2
JP6125443B2 JP2014006869A JP2014006869A JP6125443B2 JP 6125443 B2 JP6125443 B2 JP 6125443B2 JP 2014006869 A JP2014006869 A JP 2014006869A JP 2014006869 A JP2014006869 A JP 2014006869A JP 6125443 B2 JP6125443 B2 JP 6125443B2
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JP
Japan
Prior art keywords
carriage
wafer
lower wafer
stage
load
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014006869A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015135903A (ja
JP2015135903A5 (https=
Inventor
雅人 木ノ内
雅人 木ノ内
後藤　崇之
崇之 後藤
武志 津野
武志 津野
健介 井手
健介 井手
毅典 鈴木
毅典 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Machine Tool Co Ltd
Original Assignee
Mitsubishi Heavy Industries Machine Tool Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Machine Tool Co Ltd filed Critical Mitsubishi Heavy Industries Machine Tool Co Ltd
Priority to JP2014006869A priority Critical patent/JP6125443B2/ja
Priority to EP14878983.7A priority patent/EP3062333B1/en
Priority to PCT/JP2014/084495 priority patent/WO2015107855A1/ja
Priority to US15/039,545 priority patent/US20170162428A1/en
Publication of JP2015135903A publication Critical patent/JP2015135903A/ja
Publication of JP2015135903A5 publication Critical patent/JP2015135903A5/ja
Application granted granted Critical
Publication of JP6125443B2 publication Critical patent/JP6125443B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2313/00—Elements other than metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/08—Glass

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2014006869A 2014-01-17 2014-01-17 常温接合装置 Active JP6125443B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014006869A JP6125443B2 (ja) 2014-01-17 2014-01-17 常温接合装置
EP14878983.7A EP3062333B1 (en) 2014-01-17 2014-12-26 Normal temperature bonding device
PCT/JP2014/084495 WO2015107855A1 (ja) 2014-01-17 2014-12-26 常温接合装置
US15/039,545 US20170162428A1 (en) 2014-01-17 2014-12-26 Room-temperature bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014006869A JP6125443B2 (ja) 2014-01-17 2014-01-17 常温接合装置

Publications (3)

Publication Number Publication Date
JP2015135903A JP2015135903A (ja) 2015-07-27
JP2015135903A5 JP2015135903A5 (https=) 2016-10-27
JP6125443B2 true JP6125443B2 (ja) 2017-05-10

Family

ID=53542755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014006869A Active JP6125443B2 (ja) 2014-01-17 2014-01-17 常温接合装置

Country Status (4)

Country Link
US (1) US20170162428A1 (https=)
EP (1) EP3062333B1 (https=)
JP (1) JP6125443B2 (https=)
WO (1) WO2015107855A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205159286U (zh) * 2012-12-31 2016-04-13 菲力尔系统公司 用于微辐射热计真空封装组件的晶片级封装的装置
JP6165127B2 (ja) * 2014-12-22 2017-07-19 三菱重工工作機械株式会社 半導体装置及び半導体装置の製造方法
JP6731805B2 (ja) * 2016-07-12 2020-07-29 東京エレクトロン株式会社 接合システム
US10663661B1 (en) * 2018-01-26 2020-05-26 Partow Technologies, Llc. Apparatus for bonding wafers and an optically-transparent thin film made from the same
US12394653B2 (en) * 2020-02-19 2025-08-19 Mao-Yen Sung Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2984441B2 (ja) * 1991-12-06 1999-11-29 光正 小柳 三次元ｌｓｉ積層装置
JP4822577B2 (ja) 2000-08-18 2011-11-24 東レエンジニアリング株式会社 実装方法および装置
JP3938655B2 (ja) * 2000-08-25 2007-06-27 東レエンジニアリング株式会社 アライメント装置
TW588926U (en) * 2003-06-13 2004-05-21 Hon Hai Prec Ind Co Ltd Heat sink clip
JP4459687B2 (ja) 2004-03-31 2010-04-28 地方独立行政法人山口県産業技術センター 砥石とその製造方法
JP2005288673A (ja) * 2004-04-06 2005-10-20 Mitsubishi Heavy Ind Ltd 微小構造体の製造装置
JP4669766B2 (ja) 2005-09-29 2011-04-13 ボンドテック株式会社 位置決め方法、この方法を用いた加圧方法および位置決め装置、この装置を備える加圧装置
JP3970304B1 (ja) 2006-03-27 2007-09-05 三菱重工業株式会社 常温接合装置
FR2924274B1 (fr) * 2007-11-22 2012-11-30 Saint Gobain Substrat porteur d'une electrode, dispositif electroluminescent organique l'incorporant, et sa fabrication
JP4209457B1 (ja) * 2008-02-29 2009-01-14 三菱重工業株式会社 常温接合装置
JP5565792B2 (ja) * 2009-11-02 2014-08-06 ボンドテック株式会社 アライメント装置

Also Published As

Publication number Publication date
JP2015135903A (ja) 2015-07-27
WO2015107855A1 (ja) 2015-07-23
US20170162428A1 (en) 2017-06-08
EP3062333B1 (en) 2019-06-12
EP3062333A1 (en) 2016-08-31
EP3062333A4 (en) 2016-12-28

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